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    Radiation-emitting component
    3.
    发明授权
    Radiation-emitting component 有权
    辐射发射组件

    公开(公告)号：US08963181B2

    公开(公告)日：2015-02-24

    申请号：US13711662

    申请日：2012-12-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Stefan Grötsch ,  Jan Marfeld ,  Jörg E. Sorg ,  Moritz Engl ,  Steffen Köhler

    IPC: H01L33/10 ,  H01L33/60 ,  H01L33/44 ,  H01L33/58

    CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

    Abstract translation: 辐射发射部件包括具有发射电磁辐射的有源区的半导体层堆叠以及透射电磁辐射的半导体层堆叠或光学元件的至少一个表面，其中表面具有法向量，其中在 半导体层堆叠或电磁辐射通过的光学元件的至少一个表面，防反射层被布置成使得对于预定波长，其具有相对于第一电极的法向量的视角的最小反射 电磁辐射的带状光通量增加的表面大约为最大值。

    Laser component
    7.
    发明授权
    Laser component 有权

    公开(公告)号：US10431954B2

    公开(公告)日：2019-10-01

    申请号：US15654136

    申请日：2017-07-19

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Jan Seidenfaden ,  Jan Marfeld ,  Hubert Schmid ,  Soenke Tautz ,  Roland Enzmann

    IPC: H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

    Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.

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