SEMICONDUCTOR DIE WITH STEPPED SIDE SURFACE

    公开(公告)号:US20230017286A1

    公开(公告)日:2023-01-19

    申请号:US17373958

    申请日:2021-07-13

    Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

    Methods and apparatus for semiconductor device having bi-material die attach layer

    公开(公告)号:US10366944B2

    公开(公告)日:2019-07-30

    申请号:US15973828

    申请日:2018-05-08

    Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

    WAFER LEVEL DERIVED FLIP CHIP PACKAGE
    5.
    发明申请

    公开(公告)号:US20200381390A1

    公开(公告)日:2020-12-03

    申请号:US16423104

    申请日:2019-05-27

    Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.

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