Abstract:
An amplifier includes at least two amplification stages coupled in parallel. Each amplification stage includes at differential pair of amplifying MOS transistors having gates connected to a first and second input nodes common to amplifying stages, and bulk regions connected to each other but insulated from bulk regions of the amplifying MOS transistors of the other amplification stages. A configuration circuit generates bias voltage for application to the bulk terminals in each amplification stage to set the threshold voltages of the amplifying MOS transistors, and thus configuring the operating range of each amplification stage so that different amplification stages have different operating ranges.
Abstract:
An integrated circuit may include at least one MOS transistor having a sigmoid response. The at least one MOS transistor may include a substrate, a source region, a drain region, a gate region, and insulating spacer regions on either side of the gate region. The substrate may include a first region situated under the gate region between the insulating spacer regions. At least one of the source and drain regions may be separated from the first region of the substrate by a second region of the substrate situated under an insulating spacer region, which may be of a same type of conductivity as the first region of the substrate.
Abstract:
A device includes integrated circuit chips mounted on one another. At least one component for protecting elements of a second chip is formed in a first chip. The chips may be of the SOI type, with the first chip including a first SOI layer having a first thickness and the second chip including a second SOI layer having a second thickness smaller than the first thickness. The first chip including the component for protecting may include an optical waveguide with the component for protecting formed adjacent the optical waveguide.
Abstract:
The transverse mechanical stress within the active region of a MOS transistor is relaxed by forming an insulating incursion, such as an insulated trench, within the active region of the MOS transistor. The insulated incursion is provided at least in a channel region of the MOS transistor so as to separate the channel region into two parts. The insulated incursion is configured to extend in a direction of a length of the MOS transistor. The insulated incursion may further extend into one or more of a source region or drain region located adjacent the channel region of the MOS transistor.
Abstract:
One or more embodiments of the invention concerns a method of forming a semiconductor layer having uniaxial stress including: forming, in a surface of a semiconductor structure having a stressed semiconductor layer and an insulator layer, at least two first trenches in a first direction delimiting a first dimension of at least one first transistor to be formed in the semiconductor structure; performing a first anneal to decrease the viscosity of the insulating layer; and forming, in the surface after the first anneal, at least two second trenches in a second direction delimiting a second dimension of the at least one transistor.
Abstract:
A back side illumination photodiode includes a light-receiving back side surface of a semiconductor material substrate. An area of the light-receiving back side surface includes a recess. The recess is filled with a material having an optical index that is lower than an optical index of the semiconductor material substrate. Both the substrate and the filling material are transparent to an operating wavelength of the photodiode. The recess may be formed to have a ring shape.
Abstract:
A device for protecting a set of N nodes from electrostatic discharges, wherein N is greater than or equal to three, includes a set of N units respectively possessing N first terminals respectively connected to the N nodes and N second terminals connected together to form a common terminal. Each unit includes at least one MOS transistor including a parasitic transistor connected between a pair of the N nodes and configured, in the presence of a current pulse between the pair of nodes, to operate, at least temporarily, in a hybrid mode including MOS-type operation in a sub-threshold mode and operation of the bipolar transistor.
Abstract:
The invention concerns a circuit comprising: a first circuit block (302) adapted to receive a first clock signal (CLK1) and to provide a first output data signal at a time determined by said first clock signal; a second circuit block (304) adapted to receive a second clock signal (CLK2) and to provide a second output data signal at a time determined by said second clock signal; a clock bus (314) coupled to corresponding outputs of said first and second circuit blocks for receiving a third clock signal (BCLK) based on said first and second clock signals; and a synchronization unit (312) coupled to said clock bus and adapted to sample said first and second output data signals based on said third clock signal.
Abstract:
The invention relates to a III-V heterostructure laser device (1) arranged in and/or on silicon, comprising:a III-V heterostructure gain medium (3); andan optical rib waveguide (11), arranged facing the gain medium (3) and comprising a slab waveguide (15) equipped with a longitudinal rib (17), the optical rib waveguide (11) being arranged in the silicon.The optical rib waveguide (11) is oriented so that at least one Bragg grating (19, 19a, 19b) is arranged on that side (21) of the slab waveguide (15) which is proximal relative to the gain medium (3) and in that the rib (17) is placed on that side (23) of the slab waveguide (15) that is distal relative to the gain medium (3).
Abstract:
The electric behavior of a reverse-biased PN junction diode is modeled by measuring the value of voltage V present across the diode and the value of the corresponding current I running through this diode, the voltage V varying within a range of values including the value of diode breakdown voltage. A representation of a function ln ( I - I s ) according to voltage V is established from the measured values of current I and of voltage V, IS being the saturation current of the diode. A linear function representative of a substantially linear portion of the function, characterized by voltages V greater than breakdown voltage VBK in terms of absolute value, is determined. An avalanche multiplication factor MM is then calculated by MM = 1 + ⅇ ( - slbv · V + bv bv ) , with parameter slbv equal to the ordinate at the origin of the linear function, and parameter slbv/bv equal to the slope of the linear function.