公开(公告)号：US07033245B2

公开(公告)日：2006-04-25

申请号：US10774528

申请日：2004-02-10

Applicant: Kiyoshi Hasegawa ,  Masahiko Iizumi ,  Masahiro Omata ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

Inventor： Kiyoshi Hasegawa ,  Masahiko Iizumi ,  Masahiro Omata ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

IPC: B24B49/02 ,  B24B19/12 ,  B24B21/06

CPC classification number: B24B49/16 ,  B24B5/42 ,  B24B19/12 ,  B24B21/00

Abstract: A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the shoe toward the work in order to press the abrasive-grained surface of the lapping film to the pre-machined surface of the work, a rotational driving unit which drives the work rotationally, a detecting unit which detects the position of the rotating work in the rotating direction, and a controlling unit which controls the pressing force of the shoe driving unit so as to drive the shoe correspondingly to the position of the work in the rotating direction during machining.

Abstract translation: 研磨具有预加工表面的工件的研磨装置包括研磨膜，其包括具有设置有磨粒的表面的薄基材，设置在研磨膜的背面侧的鞋，驱动鞋的鞋驱动单元 朝向工作以将研磨膜的磨粒表面压到工件的预加工表面上，旋转驱动单元，其旋转地驱动工作;检测单元，其检测旋转工件在旋转中的位置 方向和控制单元，其控制鞋驱动单元的按压力，以便在加工期间相应于工件在旋转方向上的位置驱动鞋。

公开(公告)号：US06975039B2

公开(公告)日：2005-12-13

申请号：US10712054

申请日：2003-11-14

Applicant: Kiyoshi Hasegawa ,  Fumihiko Ooka

Inventor： Kiyoshi Hasegawa ,  Fumihiko Ooka

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/06 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract translation: 半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。 半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中 外部电极电连接到第二焊盘。 半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。

公开(公告)号：US06811828B2

公开(公告)日：2004-11-02

申请号：US10380548

申请日：2003-03-17

Applicant: Akio Takahashi ,  Hiroshi Yamamoto ,  Sumiko Nakajima ,  Kiyoshi Hasegawa ,  Kanji Murakami

Inventor： Akio Takahashi ,  Hiroshi Yamamoto ,  Sumiko Nakajima ,  Kiyoshi Hasegawa ,  Kanji Murakami

IPC: B05D118

CPC classification number: C23C18/44

Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

公开(公告)号：US06580152B2

公开(公告)日：2003-06-17

申请号：US10045099

申请日：2002-01-15

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: H01L2348

CPC classification number: H01L29/0657 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/013

Abstract: A semiconductor device includes a semiconductor substrate which has a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a central area and a peripheral area surrounding the central area, and a first steplike section formed in the peripheral area.

Abstract translation: 半导体器件包括半导体衬底，其具有形成在其上的电路元件的第一主表面，与第一主表面基本相对的第二主表面和设置在第一主表面和第二主表面之间的多个侧面。 半导体器件还包括形成在第一主表面上并分别电连接到电路元件的多个外部端子。 第二主表面具有围绕中心区域的中心区域和周边区域，以及形成在周边区域中的第一阶梯状区域。

公开(公告)号：US06404846B1

公开(公告)日：2002-06-11

申请号：US09531662

申请日：2000-03-20

Applicant: Kiyoshi Hasegawa ,  Yuuya Sone

Inventor： Kiyoshi Hasegawa ,  Yuuya Sone

IPC: G01N23223

CPC classification number: G01N23/223 ,  G01N2223/076

Abstract: A fluorescent X-ray analysis method comprises examining a positional relationship between an image of a sample and an X-ray illuminated region of the sample image, acquiring an image of the sample as a monochromatic image, extracting from the acquired sample image a coincident portion thereof containing the X-ray illuminated region, and examining a luminance change in the extracted image and, where there is a luminance change greater than a reference value, determining whether or not the X-ray illuminated to the sample is partly off the sample.

Abstract translation: 荧光X射线分析方法包括：检查样本的图像与样本图像的X射线照射区域之间的位置关系，获取样本的图像作为单色图像，从获取的样本图像中提取重合部分 并且检查所提取的图像中的亮度变化，并且当存在大于参考值的亮度变化时，确定照射到样品的X射线是否部分地偏离样本。

公开(公告)号：US5689879A

公开(公告)日：1997-11-25

申请号：US357734

申请日：1994-12-16

Applicant: Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

Inventor： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC: H05K3/02 ,  H05K3/06 ,  H05K3/38

CPC classification number: H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Abstract translation: 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US5579879A

公开(公告)日：1996-12-03

申请号：US401945

申请日：1995-03-10

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: F16D41/06 ,  F16D41/064

CPC classification number: F16D41/064

Abstract: A one-way clutch which is constructed such that there are formed between an external rotary member and an internal rotary member a plurality of clutch member spaces which are defined by cam surfaces of the external rotary member and a cam surface of the internal rotary member and which are arranged in the circumferential direction of the two rotary members. Each of the plurality of clutch member spaces is equipped with clutch rolling members to be switched between a transmission ON state, in which the clutch rolling members bite into the two cam surfaces to couple the two rotary members in an integrally rotatable manner, and a transmission OFF state in which the aforementioned bites are released to allow relative rotation of the two rotary members.

Abstract translation: 一种单向离合器，其构造成在外部旋转构件和内部旋转构件之间形成有由外部旋转构件的凸轮表面和内部旋转构件的凸轮表面限定的多个离合器构件空间，以及 它们沿两个旋转部件的圆周方向排列。 多个离合器构件空间中的每一个配备有离合器滚动构件，以在变速器接通状态之间切换，其中离合器滚动构件咬入两个凸轮表面以将两个旋转构件以可旋转的方式联接，并且传动 OFF状态，其中上述咬合被释放以允许两个旋转构件的相对旋转。