Inspection System Using 193nm Laser
    92.
    发明申请
    Inspection System Using 193nm Laser 审中-公开
    193nm激光检测系统

    公开(公告)号:US20160365693A1

    公开(公告)日:2016-12-15

    申请号:US15249096

    申请日:2016-08-26

    Abstract: Improved inspection systems utilize laser systems and associated techniques to generate an ultra-violet (UV) wavelength of approximately 193.368 nm from a fundamental vacuum wavelength near 1063.5 nm. Preferred embodiments separate out an unconsumed portion of an input wavelength to at least one stage and redirect that unconsumed portion for use in another stage. The improved laser systems and associated techniques result in less expensive, longer life lasers than those currently being used in the industry. These laser systems can be constructed with readily-available, relatively inexpensive components.

    Abstract translation: 改进的检查系统利用激光系统和相关技术从1063.5nm附近的基本真空波长产生约193.368nm的紫外(UV)波长。 优选实施例将输入波长的未消耗的部分分离成至少一个级,并将该未消耗的部分重定向以用于另一级。 改进的激光系统和相关技术导致比当前在工业中使用的激光器更便宜,更长寿命的激光器。 这些激光系统可以由容易获得的相对便宜的部件构成。

    Method and system for determining one or more optical characteristics of structure of a semiconductor wafer
    93.
    发明授权
    Method and system for determining one or more optical characteristics of structure of a semiconductor wafer 有权
    用于确定半导体晶片的结构的一个或多个光学特性的方法和系统

    公开(公告)号:US09448184B1

    公开(公告)日:2016-09-20

    申请号:US14180923

    申请日:2014-02-14

    Abstract: Determination of one or more optical characteristics of a structure of a semiconductor wafer includes measuring one or more optical signals from one or more structures of a sample, determining a background optical field associated with a reference structure having a selected set of nominal characteristics based on the one or more structures, determining a correction optical field suitable for at least partially correcting the background field, wherein a difference between the measured one or more optical signals and a signal associated with a sum of the correction optical field and the background optical field is below a selected tolerance level, and extracting one or more characteristics associated with the one or more structures utilizing the correction optical field.

    Abstract translation: 半导体晶片的结构的一个或多个光学特性的确定包括测量来自样品的一个或多个结构的一个或多个光学信号,基于所述样品的一个或多个结构确定与具有所选择的一组标称特征的参考结构相关联的背景光学场 一个或多个结构,确定适合于至少部分校正背景场的校正光场,其中所测量的一个或多个光信号与与校正光场和背景光场之和相关联的信号之间的差异在以下 选择的公差等级,以及利用所述校正光场提取与所述一个或多个结构相关联的一个或多个特征。

    Laser Assembly And Inspection System Using Monolithic Bandwidth Narrowing Apparatus
    94.
    发明申请
    Laser Assembly And Inspection System Using Monolithic Bandwidth Narrowing Apparatus 有权
    激光装配检测系统采用单片带宽缩窄装置

    公开(公告)号:US20160094011A1

    公开(公告)日:2016-03-31

    申请号:US14859122

    申请日:2015-09-18

    Abstract: A pulsed UV laser assembly includes a partial reflector or beam splitter that divides each fundamental pulse into two sub-pulses and directs one sub-pulse to one end of a Bragg grating and the other pulse to the other end of the Bragg grating (or another Bragg grating) such that both sub-pulses are stretched and receive opposing (positive and negative) frequency chirps. The two stretched sub-pulses are combined to generate sum frequency light having a narrower bandwidth than could be obtained by second-harmonic generation directly from the fundamental. UV wavelengths may be generated directly from the sum frequency light or from a harmonic conversion scheme incorporating the sum frequency light. The UV laser may further incorporate other bandwidth reducing schemes. The pulsed UV laser may be used in an inspection or metrology system.

    Abstract translation: 脉冲UV激光器组件包括部分反射器或分束器,其将每个基本脉冲分成两个子脉冲,并将一个子脉冲引导到布拉格光栅的一端,将另一个脉冲引导到布拉格光栅的另一端(或另一个 布拉格光栅),使得两个子脉冲都被拉伸并接收相对(正和负)频率的线性调频脉冲。 两个延伸的子脉冲被组合以产生具有比通过直接从基波的二次谐波产生可以获得的窄带宽的和频光。 紫外波长可以直接从和频光或从包含和频光的谐波转换方案中产生。 UV激光器可以进一步并入其他带宽减小方案。 脉冲UV激光可用于检测或计量系统。

    Interposer based imaging sensor for high-speed image acquisition and inspection systems
    95.
    发明授权
    Interposer based imaging sensor for high-speed image acquisition and inspection systems 有权
    基于内插器的成像传感器,用于高速图像采集和检测系统

    公开(公告)号:US09299738B1

    公开(公告)日:2016-03-29

    申请号:US14299749

    申请日:2014-06-09

    Abstract: The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.

    Abstract translation: 本发明包括设置在基板的表面上的插入器,设置在插入件上的光感测阵列传感器,光感测阵列传感器被背面薄化并被配置为用于背光照明,光感测阵列传感器包括像素列,一 或多个放大电路元件,被配置为放大光感测阵列传感器的输出,放大电路可操作地连接到插入器,一个或多个模拟 - 数字转换电路元件,被配置为将光感测阵列传感器的输出转换成 数字信号,所述ADC电路元件可操作地连接到所述插入器,配置成驱动所述阵列传感器的时钟或控制信号的一个或多个驱动器电路元件,所述插入器被配置为电耦合所述光感测阵列传感器中的至少两个, 放大电路,转换电路,驱动器电路或一个或多个附加电路 电话

    Anti-Reflection Layer For Back-Illuminated Sensor
    97.
    发明申请
    Anti-Reflection Layer For Back-Illuminated Sensor 有权
    背照射传感器防反射层

    公开(公告)号:US20150200216A1

    公开(公告)日:2015-07-16

    申请号:US14591325

    申请日:2015-01-07

    CPC classification number: H01L27/1462 H01L27/1464 H01L27/14685 H01L27/14687

    Abstract: An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.

    Abstract translation: 用于短波长光的图像传感器包括半导体膜,形成在半导体膜的一个表面上的电路元件和在半导体膜的另一个表面上的纯硼层。 在纯硼层的顶部形成防反射层或保护层。 该图像传感器具有高效率和良好的稳定性,即使在高通量下连续使用多年。 图像传感器可以使用CCD(电荷耦合器件)或CMOS(互补金属氧化物半导体)技术来制造。 图像传感器可以是二维区域传感器或一维阵列传感器。

    Photocathode Including Silicon Substrate With Boron Layer
    100.
    发明申请
    Photocathode Including Silicon Substrate With Boron Layer 有权
    含有硅衬底的光电阴极

    公开(公告)号:US20140034816A1

    公开(公告)日:2014-02-06

    申请号:US13947975

    申请日:2013-07-22

    Abstract: A photocathode is formed on a monocrystalline silicon substrate having opposing illuminated (top) and output (bottom) surfaces. To prevent oxidation of the silicon, a thin (e.g., 1-5 nm) boron layer is disposed directly on the output surface using a process that minimizes oxidation and defects, and a low work-function material layer is then formed over the boron layer to enhance the emission of photoelectrons. The low work-function material includes an alkali metal (e.g., cesium) or an alkali metal oxide. An optional second boron layer is formed on the illuminated (top) surface, and an optional anti-reflective material layer is formed on the boron layer to enhance entry of photons into the silicon substrate. An optional external potential is generated between the opposing illuminated (top) and output (bottom) surfaces. The photocathode forms part of novel sensors and inspection systems.

    Abstract translation: 在具有相对的照明​​(顶部)和输出(底部)表面的单晶硅衬底上形成光电阴极。 为了防止硅的氧化,使用最小化氧化和缺陷的工艺将薄(例如,1-5nm)的硼层直接设置在输出表面上,然后在硼层上形成低功函数材料层 以增强光电子的发射。 低功函材料包括碱金属(例如铯)或碱金属氧化物。 在照明(顶部)表面上形成可选的第二硼层,并且在硼层上形成可选的抗反射材料层,以增强光子进入硅衬底的能力。 在相对的照明​​(顶部)和输出(底部)表面之间产生可选的外部电位。 光电阴极形成新型传感器和检测系统的一部分。

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