公开(公告)号：US20090251049A1

公开(公告)日：2009-10-08

申请号：US12381639

申请日：2009-03-13

申请人： Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01J1/63 ,  C07F15/00

CPC分类号： C09K11/06 ,  C09B1/00 ,  C09B57/00 ,  C09B57/008 ,  C09B57/10 ,  C09K2211/1011 ,  C09K2211/1014 ,  C09K2211/1029 ,  H01L51/0058 ,  H01L51/006 ,  H01L51/0081 ,  H01L51/5012 ,  H05B33/14 ,  Y02E10/549

摘要： The present invention relates to an organic electroluminescent device comprising an organic layer interposed between an anode and an cathode on a substrate, wherein the organic layer comprises an electroluminescent layer comprising one or more host compound(s) represented by Chemical Formula (1) and one or more dopant compound(s) represented by Chemical Formula (2): The organic electroluminescent device according to the present invention exhibits long life, high efficiency and high luminance with good color purity and lowered operation voltage, as well as enhanced stability of device.

摘要翻译： 本发明涉及一种有机电致发光器件，其包括插入在衬底上的阳极和阴极之间的有机层，其中所述有机层包括包含一种或多种由化学式（1）表示的主体化合物的电致发光层和一个 或更多的掺杂剂化合物：根据本发明的有机电致发光器件具有长的使用寿命，高效率和高亮度，具有良好的色纯度和降低的操作电压，以及增强了器件的稳定性。

公开(公告)号：US20090179555A1

公开(公告)日：2009-07-16

申请号：US12313304

申请日：2008-11-19

申请人： Jin Ho Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Jin Ho Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01J1/63 ,  C07F17/00

CPC分类号： C09K11/06 ,  C07F15/0033 ,  C09K2211/185 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/42 ,  H01L51/5016 ,  H05B33/14 ,  Y02E10/549

摘要： The present invention relates to novel organic electroluminescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same. The organic electroluminescent compounds according to the invention are represented by Chemical Formula (1):

公开(公告)号：US20090153037A1

公开(公告)日：2009-06-18

申请号：US12290749

申请日：2008-11-03

申请人： Jin Ho Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Jin Ho Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01J1/63 ,  C07F19/00

CPC分类号： C07F15/0033 ,  C09K11/06 ,  C09K2211/1011 ,  C09K2211/1014 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1037 ,  C09K2211/1044 ,  C09K2211/185 ,  C09K2211/186 ,  C09K2211/188 ,  H01L51/0077 ,  H01L51/0081 ,  H01L51/0084 ,  H01L51/0085 ,  H01L51/009 ,  H01L51/5016 ,  H05B33/14 ,  Y02E10/549

摘要： The present invention relates to novel organic electroluminescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same. The organic electroluminescent compounds according to the invention are represented by Chemical Formula (1):

摘要翻译： 本发明涉及具有高发光效率的新型有机电致发光化合物和包含该有机电致发光化合物的有机电致发光器件。 根据本发明的有机电致发光化合物由化学式（1）表示：

公开(公告)号：US07507637B2

公开(公告)日：2009-03-24

申请号：US11647914

申请日：2006-12-29

申请人： Min Suk Suh ,  Sung Min Kim

发明人： Min Suk Suh ,  Sung Min Kim

IPC分类号： H01L21/30

CPC分类号： H01L21/76898 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2224/05099

摘要： To manufacture a wafer level stack package, first and second wafers having first and second via patterns are prepared. The second wafer is attached to the first wafer such that the front sides of the first and second wafers face each other and the first and second via patterns are connected to each other. The back side of the second wafer is ground and etched such that the lower ends of the second via patterns are exposed and projected. The back side of the first wafer is ground and etched such that the lower ends of the first via patterns are exposed and projected. A chip level stack structure is formed by sawing a wafer level stack structure having the stacked wafers into a chip level. The chip level stack structure is attached to a substrate having electrode terminals.

摘要翻译： 为了制造晶片级堆叠封装，准备具有第一和第二通孔图案的第一和第二晶片。 第二晶片附接到第一晶片，使得第一晶片和第二晶片的前侧彼此面对，并且第一和第二通孔图案彼此连接。 对第二晶片的背面进行研磨和蚀刻，使得第二通孔图案的下端被暴露和投影。 对第一晶片的背面进行研磨和蚀刻，使得第一通孔图案的下端被暴露和投影。 通过将具有堆叠的晶片的晶片级堆叠结构锯切成芯片级而形成芯片级堆叠结构。 芯片级堆叠结构附着到具有电极端子的基板上。

公开(公告)号：US09957425B2

公开(公告)日：2018-05-01

申请号：US14204128

申请日：2014-03-11

申请人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

发明人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

IPC分类号： C09J163/00 ,  H01L23/00 ,  C09J7/00 ,  C08L63/00 ,  C08K5/00 ,  C08K5/3445

CPC分类号： C09J163/00 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/05442 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

公开(公告)号：US08673605B2

公开(公告)日：2014-03-18

申请号：US13702975

申请日：2011-06-08

申请人： Jung-Keug Park ,  Sung Min Kim ,  Soo Chan Kim ,  Moon Young Yoon ,  Hyun Jin Cho ,  Young-Kwon Seo ,  Hee Hoon Yoon

发明人： Jung-Keug Park ,  Sung Min Kim ,  Soo Chan Kim ,  Moon Young Yoon ,  Hyun Jin Cho ,  Young-Kwon Seo ,  Hee Hoon Yoon

IPC分类号： A01N63/00 ,  C12N13/00 ,  C12N5/0793

CPC分类号： C12N5/0619 ,  C12N5/0618 ,  C12N13/00 ,  C12N2506/1346 ,  C12N2506/1353 ,  C12N2506/1361 ,  C12N2506/1369 ,  C12N2506/1384 ,  C12N2529/00

摘要： The present invention relates to a method for differentiation of mesenchymal stem cells or dental pulp stem cells. More specifically, the invention relates to a method for differentiating stem cells to neural cells by applying mesenchymal stem cells or dental pulp stem cells with a low-frequency electromagnetic field. The differentiation method according to the present invention can induce differentiation even with low-cost mediums rather than induced neural differentiation mediums which are expensive due to addition of growth factors, and the neural cells differentiated according to the present invention may be useful for treatment of neurological brain diseases.

摘要翻译： 本发明涉及分化间充质干细胞或牙髓干细胞的方法。 更具体地，本发明涉及通过用低频电磁场施用间充质干细胞或牙髓干细胞来分化干细胞与神经细胞的方法。 根据本发明的分化方法即使使用低成本培养基也可诱导分化，而不是由于生长因子的添加而昂贵的诱导神经分化培养基，并且根据本发明分化的神经细胞可用于治疗神经系统 脑疾病

公开(公告)号：US08618656B2

公开(公告)日：2013-12-31

申请号：US13241455

申请日：2011-09-23

申请人： Tac Keun Oh ,  Sung Min Kim

发明人： Tac Keun Oh ,  Sung Min Kim

IPC分类号： H01L23/34

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L21/67138 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/48095 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/8517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.

摘要翻译： 提出了一种具有响应可弯曲的导线构件的柔性半导体封装装置。 该装置包括柔性基板，半导体芯片和导线。 半导体芯片设置在柔性基板上并且在柔性基板上彼此间隔开。 每个半导体芯片具有接合焊盘。 导电线电连接到半导体芯片的接合焊盘。 每个导线具有至少一个弹性部分。 一个优选的构造是，导线的一部分被卷绕以形成螺旋弹簧形状，使得导线的螺旋弹簧形状有助于防止导线与半导体芯片的相应焊盘分离，当柔性基板 其上安装半导体芯片被弯曲，膨胀或扭曲。

公开(公告)号：US08563427B2

公开(公告)日：2013-10-22

申请号：US12981207

申请日：2010-12-29

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： H01L25/07

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor chip includes a substrate with a barrier region and a conductive diffusion region formed in the substrate and is surrounded by the barrier region. The conductive diffusion region may provide a conductive oath from top of the substrate to bottom of the substrate.

摘要翻译： 半导体芯片包括具有阻挡区域的基板和形成在基板中并被阻挡区域包围的导电扩散区域。 导电扩散区域可以从衬底的顶部到衬底的底部提供导电的誓言。

公开(公告)号：US20130264371A1

公开(公告)日：2013-10-10

申请号：US13515785

申请日：2011-02-23

申请人： Du-Jin Bach ,  Sung Min Kim ,  Jae-Sung Choi

发明人： Du-Jin Bach ,  Sung Min Kim ,  Jae-Sung Choi

IPC分类号： A61B17/115

CPC分类号： A61B17/1155 ,  A61B2017/1107 ,  A61B2017/1125 ,  A61B2017/1132 ,  A61B2017/1157

摘要： A medical anastomosis apparatus is provided. The medical anastomosis apparatus includes a cylindrical body which has a hollow portion and extends in a longitudinal direction, a pressing rod which is provided inside of the hollow portion of the body to translate along the hollow portion, a knob which is coupled to the pressing rod to provide a driving force to translate the pressing rod, a guide member which is inserted into one end of the body and simultaneously coupled to expose a portion of the body and has a pressing unit formed therein to move radially upon translation of the pressing rod, and a staple cartridge which is inserted around an outer circumferential surface of the guide member and then coupled to the body and has built-in staple clips that protrude outward upon movement of the pressing unit.

摘要翻译： 提供医用吻合装置。 医疗吻合装置包括具有中空部分并沿纵向延伸的圆柱体，设置在主体的中空部分的内侧以沿着中空部分平移的按压杆，与按压杆 以提供驱动力以平移按压杆，引导构件插入到主体的一端并同时联接以暴露主体的一部分，并且具有形成在其中的按压单元以在按压杆平移时径向移动， 以及钉仓，其插入在所述引导构件的外周表面周围，然后联接到所述主体并且具有当所述按压单元移动时向外突出的内置订书钉夹。

公开(公告)号：US08338921B2

公开(公告)日：2012-12-25

申请号：US13289365

申请日：2011-11-04

申请人： Chang Jun Park ,  Kwon Whan Han ,  Seong Cheol Kim ,  Sung Min Kim ,  Hyeong Seok Choi ,  Ha Na Lee ,  Tac Keun Oh ,  Sang Joon Lim

发明人： Chang Jun Park ,  Kwon Whan Han ,  Seong Cheol Kim ,  Sung Min Kim ,  Hyeong Seok Choi ,  Ha Na Lee ,  Tac Keun Oh ,  Sang Joon Lim

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L21/486 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/552 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00

摘要： A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads.

摘要翻译： 提出了具有增强的EMF屏蔽的热交换效率的晶片级芯片级封装。 晶片级芯片级封装包括半导体芯片，绝缘层和金属板。 半导体芯片在其上表面上具有多个接合焊盘。 绝缘层设置在半导体芯片的上表面上，并且具有暴露接合焊盘的一些部分的开口。 金属板覆盖绝缘层的上表面和半导体芯片的侧面，其中金属板与接合焊盘电绝缘。