公开(公告)号：US4204725A

公开(公告)日：1980-05-27

申请号：US852394

申请日：1977-11-17

申请人： Thomas H. DiStefano ,  Lawrence Kuhn

发明人： Thomas H. DiStefano ,  Lawrence Kuhn

IPC分类号： G02B26/10 ,  B41J2/44 ,  G03G15/04 ,  G03G15/22 ,  H04N1/028 ,  G03G15/00

CPC分类号： G03G15/221 ,  G03G15/04072 ,  H04N1/028

摘要： A printer/copier having the added capabilities of scanning information from photocopying media, for the purpose of storing it in computer memories or transmitting it over communication lines. The printer/copier has a sensing electrode which detects the charge change on a photoconductor surface as it is being scanned by a laser beam. The laser can also be used to expose the photoconductor for the purpose of printing. A deconvolution circuit is also provided to convert the detected charge to a storable or transmittable coded signal.

摘要翻译： 具有从复印介质扫描信息的附加功能的打印机/复印机，用于将其存储在计算机存储器中或通过通信线路发送。 打印机/复印机具有感测电极，该感测电极在激光束扫描时检测感光体表面上的电荷变化。 为了印刷的目的，也可以使用激光曝光感光体。 还提供去卷积电路以将检测到的电荷转换成可存储或可传输的编码信号。

公开(公告)号：US07752738B2

公开(公告)日：2010-07-13

申请号：US11039949

申请日：2005-01-24

申请人： Thomas H. DiStefano

发明人： Thomas H. DiStefano

IPC分类号： H01H11/00 ,  H01H65/00

CPC分类号： H05K3/4092 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K2201/0311 ,  Y10T29/49105 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49218

摘要： Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.

摘要翻译： 提供了用于制造柔性弹簧触点的系统和方法，用于例如IC封装以及堆叠IC封装和电子部件中的多层之间的互连。 在成形薄膜内产生的内部应力被释放以使薄膜从支撑端子弯曲和/或翘曲。 薄的应力金属膜层从支撑端子的基板选择性地断开，允许应力金属膜基于内部应力的释放通过微小的变形而呈现弓形和/或弹簧形状。 随着弹簧接触件被压靠在上层中的相容配合接触表面上，所得到的柔性柔顺弹性接触件可以变形少量。

公开(公告)号：US07454834B2

公开(公告)日：2008-11-25

申请号：US11450537

申请日：2006-06-09

申请人： Thomas H. DiStefano

发明人： Thomas H. DiStefano

IPC分类号： H05K13/04 ,  H01L21/02

CPC分类号： H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/50 ,  H01L24/83 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01009 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49821 ,  H01L2224/83 ,  H01L2224/05599

摘要： A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

摘要翻译： 制造微电子封装的方法包括提供具有导电部分并包括第一和第二表面的第一微电子元件，并提供在第一微电子元件的第一表面上包括可释放粘合剂的柔顺元件。 具有导电部件的第二微电子元件抵靠可释放的粘合剂，使得第二微电子元件可释放地组装到第一微电子元件，并且第一和第二微电子元件的导电部件彼此连接。 对可拆卸组装的包装进行测试以确定包装是否已正确组装。 然后将可固化液体引入正确组装的包装的第一和第二微电子元件之间，并且可固化液体被固化以将第一和第二微电子元件永久地组装在一起。

公开(公告)号：US07098078B2

公开(公告)日：2006-08-29

申请号：US10301188

申请日：2002-11-21

申请人： Igor Y. Khandros ,  Thomas H. DiStefano

发明人： Igor Y. Khandros ,  Thomas H. DiStefano

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L22/32 ,  H01L21/6836 ,  H01L21/822 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

公开(公告)号：US06966784B2

公开(公告)日：2005-11-22

申请号：US10742501

申请日：2003-12-19

申请人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

发明人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

IPC分类号： H05K1/14 ,  H01B11/00 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

摘要翻译： 能够传输速度超过40Gbps的数据传输互连组件（例如，路由器），其中线卡可以使用柔性扁平电缆可拆卸地耦合到背板，弯曲以在连接的板之间提供连续的平滑曲线 并且通过采用对所发送的信号波透明的电缆到电缆接口部件的连接装置连接。 微电缆接触结构形成在电缆上或按压在电缆上的接触结构上，以提供小于传输信号的波长的接口布置。 连接器装置使用凸轮机构对准电缆，然后将形成有微弹簧接口构件的接触结构压靠在电缆上。 替代接触结构使用各向异性导电膜。

公开(公告)号：US06541845B2

公开(公告)日：2003-04-01

申请号：US09777781

申请日：2001-02-06

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H05K3/4092 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.

摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。

公开(公告)号：US06465893B1

公开(公告)日：2002-10-15

申请号：US09691807

申请日：2000-10-19

申请人： Igor Y. Khandros ,  Thomas H. DiStefano

发明人： Igor Y. Khandros ,  Thomas H. DiStefano

IPC分类号： H01L2348

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/50 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/10378 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor chip assembly, comprises a first semiconductor chip having a front surface, a rear surface and contacts on the front surface and a second semiconductor chip having a front surface, a rear surface and contacts on the front surface. The rear surface of the second semiconductor chip is juxtaposed with the front surface of the first semiconductor chip. The assembly includes a first backing element having electrically conductive first terminals. The first backing element is juxtaposed with the rear surface of the first semiconductor chip so that at least some of the terminals overlie the rear surface of the first semiconductor chip. At least some of the contacts on the first and the second semiconductor chips are electrically connected to at least some of the terminals. The assembly includes a substrate having contact pads thereon. The first terminals are connected to the contact pads of the substrate. The substrate is adapted to connect the assembly with other elements of a circuit. At least some of the first terminals overlie the rear surface of the first semiconductor chip.

摘要翻译： 一种半导体芯片组件，包括具有前表面，后表面和前表面上的触点的第一半导体芯片和具有前表面，后表面和在前表面上接触的第二半导体芯片。 第二半导体芯片的后表面与第一半导体芯片的前表面并置。 组件包括具有导电的第一端子的第一背衬元件。 第一背衬元件与第一半导体芯片的后表面并置，使得至少一些端子覆盖在第一半导体芯片的后表面上。 第一和第二半导体芯片上的至少一些触点与至少一些端子电连接。 组件包括其上具有接触焊盘的基板。 第一端子连接到基板的接触焊盘。 衬底适于将组件与电路的其它元件连接。 至少一些第一端子覆盖在第一半导体芯片的后表面上。

公开(公告)号：US06362520B1

公开(公告)日：2002-03-26

申请号：US09791245

申请日：2001-02-22

申请人： Thomas H. DiStefano

发明人： Thomas H. DiStefano

IPC分类号： H01L2348

摘要： A microelectronic assembly includes a first microelectronic element including contacts on a contact-bearing face and a second microelectronic element confronting the first microelectronic element. The assembly also has a plurality of vertically extended signal leads electrically interconnecting the first and second microelectronic elements, and a plurality of vertically extended straps attached to the first and second microelectronic elements, whereby the straps are shorter than the signal leads for limiting vertical movement of the first and second microelectronic elements away from one another.

公开(公告)号：US06324754B1

公开(公告)日：2001-12-04

申请号：US09047638

申请日：1998-03-25

申请人： Thomas H. DiStefano ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  Joseph Fjelstad

IPC分类号： H05K334

CPC分类号： H01L24/81 ,  H01L23/49838 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0397 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

摘要： Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.

摘要翻译： 用于微电子连接的焊盘由一组从中心点径向向外延伸的可焊接润湿条形成。 固体芯焊球位于每个焊盘上并回流。 焊盘配置有助于使焊球居中，并将焊球保持在所需位置，从而最小化所得焊料凸块的高度变化。 此外，焊盘可以包括由非可润湿金属，金属化合物或电介质材料限定的不可润湿表面。 焊盘上的不可润湿区域限制焊料，并避免需要单独的焊接掩模。

公开(公告)号：US06197665B1

公开(公告)日：2001-03-06

申请号：US09292640

申请日：1999-04-15

申请人： Thomas H. DiStefano ,  Craig S. Mitchell ,  Tan Nguyen

发明人： Thomas H. DiStefano ,  Craig S. Mitchell ,  Tan Nguyen

IPC分类号： H01L2136

CPC分类号： H01L21/67126 ,  H01L21/67092

摘要： A lamination machine includes means for using gas pressure to bring a coverlay and a microelectronic package into intimate contact and means for heating a coverlay adhesive in order to seal the coverlay to the package. A method of laminating a coverlay to a microelectronic package using the lamination machine includes using gas pressure to bring a coverlay into intimate contact with a microelectronic package. The method also includes heating an adhesive on the coverlay in order to adhere the coverlay to the package. Once the coverlay is laminated to the package, the package can be encapsulated with a curable encapsulant composition. The method may also include decreasing the pressure in the chamber disposed above the package to reduce voids and bubble and/or regulating the pressure in a bladder disposed in a chamber below the package. The lamination machine may also include a pressurized bladder which is used to support the microelectronic package and minimize stress on the leads during the lamination process.

摘要翻译： 层压机包括用于使气体压力使盖板和微电子封装件紧密接触的装置，以及用于加热覆盖层粘合剂以便将覆盖物密封到包装的装置。 使用层压机将覆盖层层压到微电子封装的方法包括使用气体压力使覆盖物与微电子封装紧密接触。 该方法还包括加热覆盖物上的粘合剂以便将覆盖物粘附到包装上。 一旦覆盖层被层压到包装上，封装可以用可固化的密封剂组合物包封。 该方法还可以包括减小设置在包装上方的室中的压力，以减少空气和气泡和/或调节设置在包装下方的室中的气囊中的压力。 层压机还可以包括用于支撑微电子封装并且在层压过程期间使引线上的应力最小化的加压囊。