公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US06706973B2

公开(公告)日：2004-03-16

申请号：US10200941

申请日：2002-07-23

申请人： Thomas H. DiStefano ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  Joseph Fjelstad

IPC分类号： H05K116

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

公开(公告)号：US06700072B2

公开(公告)日：2004-03-02

申请号：US09779117

申请日：2001-02-08

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件从中心导体延伸，并且具有适于从中心导体径向向内收缩的外围部分，以响应由在所接合的电路板上限定中心孔的接触垫施加的力。 因此，当电路板被内插件压缩时，触头径向向内收缩并且擦拭穿过焊盘。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

公开(公告)号：US06357112B1

公开(公告)日：2002-03-19

申请号：US09200100

申请日：1998-11-25

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R906

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

摘要翻译： 用于制造微电子元件组件的连接部件具有形成在电介质支撑结构上的可剥离引线。 每个引线的一端永久地连接到支撑结构，并且引线的相对端可释放地连接到支撑结构。 当引线的可释放端接合到半导体芯片上的触点时，引线的可释放端可以从支撑结构剥离，使得芯片可以从支撑结构移开。 柔性层可以设置在芯片和支撑结构之间。 如果柔性材料在芯片和支撑结构之间注入以形成顺应性层，柔性材料将使芯片从支撑结构上提升，并促进引线从支撑结构的剥离。

公开(公告)号：US06265759B1

公开(公告)日：2001-07-24

申请号：US09120006

申请日：1998-07-21

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23495

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.

摘要翻译： 一种具有内部横向弯曲引线的半导体芯片封装，以补偿半导体芯片和诸如PWB的支撑基板之间的CTE失配。

公开(公告)号：US06196042B1

公开(公告)日：2001-03-06

申请号：US09281643

申请日：1999-03-31

申请人： Thomas H. Distefano ,  Joseph Fjelstad ,  Belgacem Haba

发明人： Thomas H. Distefano ,  Joseph Fjelstad ,  Belgacem Haba

IPC分类号： B21D2810

CPC分类号： H01L21/4842 ,  Y10T29/49121

摘要： A tool having a coining projection is operative for forming a frangible portion in a lead of a microelectronic connection component by application of a compressive force. The coining projection is supported on a pedestal formed from a tool body. In an alternative embodiment, the pedestal is formed on a backing plate for use in circuits up construction. The pedestal is sized and shaped so as to be received within a gap formed in a support layer for the leads. By application of the compressive force, the coining projection will penetrate the lead within the region of the gap to form the frangible portion.

摘要翻译： 具有压印突起的工具用于通过施加压缩力来形成微电子连接部件的引线中的易碎部分。 压印突起支撑在由工具主体形成的基座上。 在替代实施例中，基座形成在背板上用于回路结构。 基座的尺寸和形状被设计成容纳在形成在引线的支撑层中的间隙内。 通过施加压缩力，压印突起将在间隙的区域内穿透引线，以形成易碎部分。

公开(公告)号：US6086386A

公开(公告)日：2000-07-11

申请号：US862151

申请日：1997-05-22

申请人： Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

发明人： Joseph Fjelstad ,  Thomas H. DiStefano ,  Konstantine Karavakis ,  Anthony B. Faraci ,  Tan Nguyen

IPC分类号： H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC分类号： H01L23/32 ,  H01L23/49827 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1061 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49149

摘要： A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

摘要翻译： 用于微电子元件的连接器包括具有布置成规则网格图案的多个活动触点的片状体。 有源触点可以包括在片状元件的第一主表面上围绕片状元件中的孔向内延伸的几个片状金属突起。 支撑结构例如非隔离结构柱的格子阵列在片状元件的第二主表面上，并且每个柱电连接到一个活动触点。 柱的网格阵列和活动触点的网格阵列彼此偏移，使得活动触点被多个柱包围。 支柱支撑与柱连接的基板间隔开的片状元件。 其上具有凸起引线的微电子元件可以通过使凸起引线与活动触头接触，并使片状元件在一侧的凸起引线与另一侧上的柱之间偏转而接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5802699A

公开(公告)日：1998-09-08

申请号：US254991

申请日：1994-06-07

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connector for microelectronic elements includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

摘要翻译： 用于微电子元件的连接器包括具有多个孔的片状体，期望地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US06938338B2

公开(公告)日：2005-09-06

申请号：US10417746

申请日：2003-04-17

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US06780747B2

公开(公告)日：2004-08-24

申请号：US10097032

申请日：2002-03-13

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/80001 ,  H01L2224/81

摘要： A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.

摘要翻译： 一种利用可固化密封剂为一个或多个倒装芯片组件或一个或多个微电子部件提供基本无空隙的方法。 还公开了将密封剂注入到组件中的方法以及处理微电子部件以形成无空隙层的方法。