公开(公告)号：US08678438B2

公开(公告)日：2014-03-25

申请号：US13615788

申请日：2012-09-14

Applicant: Byoung-Gae You ,  Sung-Suk Ko ,  Ho-Jin Lee

Inventor： Byoung-Gae You ,  Sung-Suk Ko ,  Ho-Jin Lee

IPC: B60R22/20

CPC classification number: B60R21/055 ,  B60R22/24 ,  B60R2022/1818

Abstract: A seat belt apparatus for a vehicle including an anchor metal plate coupled with a vehicle body by a fastening bolt to extensively support a seat belt and upper and lower covers to receive the anchor metal plate. A contact rib is formed on at least one side portion of the inner surface of the upper cover, and a sidewall is formed on a side portion of the lower cover to make contact with the contact rib. An arc-type rib is formed on the bottom plate of the lower cover corresponding to an outer peripheral portion of at least one side portion of the base portion of the anchor metal plate, and a connection rib is formed between the arc-type rib and the sidewall. An arc-type slot is formed on the bottom plate of the lower cover.

Abstract translation: 一种用于车辆的安全带装置，包括通过紧固螺栓与车体联接的锚金属板，以广泛地支撑安全带和上盖和下盖以接收锚金属板。 接触肋形成在上盖的内表面的至少一个侧部上，并且侧壁形成在下盖的侧部上以与接触肋接触。 在下盖的底板上形成弧形肋，该底板对应于锚金属板的基部的至少一个侧部的外周部分，并且在弧形肋和 侧壁。 在下盖的底板上形成弧形槽。

公开(公告)号：US08637989B2

公开(公告)日：2014-01-28

申请号：US13569653

申请日：2012-08-08

Applicant: Ho-jin Lee ,  Hyun-soo Chung ,  Chang-seong Jeon ,  Sang-sick Park ,  Jae-hyun Phee

Inventor： Ho-jin Lee ,  Hyun-soo Chung ,  Chang-seong Jeon ,  Sang-sick Park ,  Jae-hyun Phee

IPC: H01L23/48

CPC classification number: H01L23/48 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941

Abstract: A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.

Abstract translation: 半导体器件包括半导体衬底和通孔电极。 通孔电极在基板上具有第一部分并且朝向基板延伸并且具有从第一部分延伸到基板中的多个尖峰，每个尖峰彼此间隔开。

公开(公告)号：US20130210222A1

公开(公告)日：2013-08-15

申请号：US13758239

申请日：2013-02-04

Applicant: Ho-Jin LEE ,  Kyu-ha LEE ,  Gilheyun CHOI ,  YongSoon CHOI ,  Pil-Kyu KANG ,  Byung-Lyul PARK ,  Hyunsoo CHUNG

Inventor： Ho-Jin LEE ,  Kyu-ha LEE ,  Gilheyun CHOI ,  YongSoon CHOI ,  Pil-Kyu KANG ,  Byung-Lyul PARK ,  Hyunsoo CHUNG

IPC: H01L21/768 ,  H01L23/00

CPC classification number: H01L21/768 ,  H01L21/02271 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/3192 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L25/0657 ,  H01L2221/68372 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: In one embodiment, the method includes forming a conductive via structure in a base layer. The base layer has a first surface and a second surface, and the second surface is opposite the first surface. The method further includes removing the second surface of the base layer to expose the conductive via structure such that the conductive via structure protrudes from the second surface, and forming a first lower insulating layer over the second surface such that an end surface of the conductive via structure remains exposed by the first lower insulating layer.

Abstract translation: 在一个实施例中，该方法包括在基层中形成导电通孔结构。 基层具有第一表面和第二表面，并且第二表面与第一表面相对。 该方法还包括去除基底层的第二表面以暴露导电通路结构，使得导电通孔结构从第二表面突出，并且在第二表面上形成第一下绝缘层，使得导电通孔的端表面 结构保持由第一下绝缘层暴露。

公开(公告)号：US20130200525A1

公开(公告)日：2013-08-08

申请号：US13718580

申请日：2012-12-18

Applicant: Ho-Jin LEE ,  Pil-Kyu KANG ,  Kyu-Ha LEE ,  Byung-Lyul PARK ,  Hyun-Soo CHUNG ,  Gil-Heyun CHOI

Inventor： Ho-Jin LEE ,  Pil-Kyu KANG ,  Kyu-Ha LEE ,  Byung-Lyul PARK ,  Hyun-Soo CHUNG ,  Gil-Heyun CHOI

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/525 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor device including a lower layer, an insulating layer on a first side of the lower layer, an interconnection structure in the insulating layer, a via structure in the lower layer. The via structure protrudes into the insulating layer and the interconnection structure.

Abstract translation: 一种半导体器件，包括下层，在下层的第一侧上的绝缘层，绝缘层中的互连结构，下层中的通孔结构。 通孔结构突出到绝缘层和互连结构中。

公开(公告)号：US08482129B2

公开(公告)日：2013-07-09

申请号：US13027594

申请日：2011-02-15

Applicant: In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

Inventor： In-Young Lee ,  Ho-Jin Lee ,  Hyun-Soo Chung ,  Ju-Il Choi ,  Son-Kwan Hwang

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2224/05552

Abstract: A method of manufacturing a semiconductor device includes forming an integrated circuit region on a semiconductor wafer. A first metal layer pattern is formed over the integrated circuit region. A via hole is formed to extend through the first metal layer pattern and the integrated circuit region. A final metal layer pattern is formed over the first metal layer pattern and within the via hole. A plug is formed within the via hole. Thereafter, a passivation layer is formed to overlie the final metal layer pattern.

Abstract translation: 一种制造半导体器件的方法包括在半导体晶片上形成集成电路区域。 在集成电路区域上形成第一金属层图案。 通孔形成为延伸穿过第一金属层图案和集成电路区域。 最终的金属层图案形成在第一金属层图案之上并且在通孔内。 在通孔内形成插头。 此后，形成钝化层以覆盖最终金属层图案。

公开(公告)号：US08442359B2

公开(公告)日：2013-05-14

申请号：US12923078

申请日：2010-08-31

Applicant: Ho Jin Lee ,  Young Su Moon ,  Shi Hwa Lee

Inventor： Ho Jin Lee ,  Young Su Moon ,  Shi Hwa Lee

IPC: G06K9/32 ,  G06K9/00

CPC classification number: G06T3/4015

Abstract: Provided is an image interpolation method and apparatus using a reference block depending on a direction. The image interpolation method may generate a horizontal reference block and a vertical reference block each with respect to an inputted image, and determine interpolation directivity with respect to the inputted image using the generated horizontal reference block and vertical reference block, thereby performing an interpolation on an image based on accurate interpolation directivity. In particular, the image interpolation method may determine whether to verify interpolation directivity depending on an edge intensity of an inputted image, thereby performing a color filter array (CFA) interpolation on an image based on an edge direction without determining the interpolation directivity, when the edge intensity is strong.

Abstract translation: 提供了根据方向使用参考块的图像插值方法和装置。 图像插值方法可以生成相对于输入图像的水平参考块和垂直参考块，并且使用所生成的水平参考块和垂直参考块来确定关于输入图像的插值方向性，从而在 基于准确插值方向性的图像。 特别地，图像插值方法可以确定是否根据输入图像的边缘强度来验证插值方向性，从而基于边缘方向对图像执行滤色器阵列（CFA）插值，而不确定插值方向性，当 边缘强度很强。

公开(公告)号：US08426252B2

公开(公告)日：2013-04-23

申请号：US13537953

申请日：2012-06-29

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

公开(公告)号：US08423863B2

公开(公告)日：2013-04-16

申请号：US12940484

申请日：2010-11-05

Applicant: Pan Soo Kim ,  Dae Ig Chang ,  Ho Jin Lee

Inventor： Pan Soo Kim ,  Dae Ig Chang ,  Ho Jin Lee

IPC: G06F11/00

CPC classification number: H04L27/0008

Abstract: The present invention separates inputted triple play IP data into Internet and TV data and voice (VoIP) data, encodes the Internet and TV data permitting a long delay time according to the existing DVB-S2 standard, and encodes the voice data permitting only a short delay time according to a DVB-RCS+M standard based 4K mode. Each encoded data is subjected to the orthogonal modulation and the orthogonally modulated voice data is subjected to a direct sequence spectrum spread according to a spreading factor. The spread spectrum signal is multiplexed in a SCPC frequency division multiple access (FDMA) scheme so as to overlap with frequencies allocated to each user.

Abstract translation: 本发明将输入的三重播放IP数据分为因特网和电视数据和语音（VoIP）数据，根据现有的DVB-S2标准对允许长延迟时间的因特网和电视数据进行编码，并对只允许短暂的DVB-S2标准的语音数据进行编码 根据基于DVB-RCS + M标准的4K模式的延迟时间。 对每个编码数据进行正交调制，并且根据扩展因子对正交调制的语音数据进行直接序列频谱扩展。 扩频信号在SCPC分频多址（FDMA）方案中多路复用，以便与分配给每个用户的频率重叠。

公开(公告)号：US08415804B2

公开(公告)日：2013-04-09

申请号：US12639241

申请日：2009-12-16

Applicant: Ho-jin Lee ,  Dong-hyun Jang ,  In-young Lee ,  Min-seung Yoon ,  Son-kwan Hwang

Inventor： Ho-jin Lee ,  Dong-hyun Jang ,  In-young Lee ,  Min-seung Yoon ,  Son-kwan Hwang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44

CPC classification number: H01L24/13 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13009 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/83194 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05552

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.

Abstract translation: 提供一种半导体芯片及其制造方法，以及包括半导体芯片的堆叠模块和存储卡，其包括第一表面和面对第一表面的第二表面。 至少一个通孔，包括在从基板的第一表面到基板的第二表面的方向上延伸的第一部分和连接到第一部分并具有锥形形状的第二部分。 提供至少一个填充至少一个通孔的通孔电极。

公开(公告)号：US20130069356A1

公开(公告)日：2013-03-21

申请号：US13615788

申请日：2012-09-14

Applicant: Byoung-Gae YOU ,  Sung-Suk KO ,  Ho-Jin LEE

Inventor： Byoung-Gae YOU ,  Sung-Suk KO ,  Ho-Jin LEE

IPC: B60R22/18

CPC classification number: B60R21/055 ,  B60R22/24 ,  B60R2022/1818

Abstract: A seat belt apparatus for a vehicle including an anchor metal plate coupled with a vehicle body by a fastening bolt to extensively support a seat belt and upper and lower covers to receive the anchor metal plate. A contact rib is formed on at least one side portion of the inner surface of the upper cover, and a sidewall is formed on a side portion of the lower cover to make contact with the contact rib. An arc-type rib is formed on the bottom plate of the lower cover corresponding to an outer peripheral portion of at least one side portion of the base portion of the anchor metal plate, and a connection rib is formed between the arc-type rib and the sidewall. An arc-type slot is formed on the bottom plate of the lower cover.

Abstract translation: 一种用于车辆的安全带装置，包括通过紧固螺栓与车体联接的锚金属板，以广泛地支撑安全带和上盖和下盖以接收锚金属板。 接触肋形成在上盖的内表面的至少一个侧部上，并且侧壁形成在下盖的侧部上以与接触肋接触。 在下盖的底板上形成弧形肋，该底板对应于锚金属板的基部的至少一个侧部的外周部分，并且在弧形肋和 侧壁。 在下盖的底板上形成弧形槽。