公开(公告)号：US09505230B2

公开(公告)日：2016-11-29

申请号：US15157247

申请日：2016-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: G01P15/125 ,  B41J2/39

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20160293566A1

公开(公告)日：2016-10-06

申请号：US15182272

申请日：2016-06-14

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/00

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。

公开(公告)号：US12175945B2

公开(公告)日：2024-12-24

申请号：US18497185

申请日：2023-10-30

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/20 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G3/34 ,  H01L25/075 ,  H01L25/16

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

公开(公告)号：US12080696B2

公开(公告)日：2024-09-03

申请号：US18494109

申请日：2023-10-25

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20240234385A1

公开(公告)日：2024-07-11

申请号：US18415536

申请日：2024-01-17

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US20240008298A1

公开(公告)日：2024-01-04

申请号：US18451538

申请日：2023-08-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H10K50/00 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683 ,  H10K59/12

CPC classification number: H10K50/00 ,  H01L27/1214 ,  G09G3/006 ,  H01L24/24 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H10K59/12 ,  H01L2224/83005 ,  H01L2224/82104 ,  H01L2224/82102 ,  H01L2224/75301 ,  H01L2224/2401 ,  H01L24/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/759 ,  H01L2224/82101 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2224/7598 ,  H01L2224/29155 ,  H01L2224/29118 ,  H01L2224/29113 ,  H01L2924/12041 ,  H01L2224/75725 ,  H01L27/156

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US11778842B2

公开(公告)日：2023-10-03

申请号：US17804715

申请日：2022-05-31

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L21/683 ,  H10K50/00 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H10K59/12 ,  H01L27/12 ,  G09G3/3208 ,  H10K59/10

CPC classification number: H10K50/00 ,  G09G3/006 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/156 ,  H10K59/12 ,  G09G3/3208 ,  H01L24/32 ,  H01L27/1214 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/245 ,  H01L2224/2405 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/759 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75725 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/8381 ,  H01L2224/8383 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H10K59/10 ,  H01L2224/83825 ,  H01L2924/00014 ,  H01L2224/8383 ,  H01L2924/00014 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01049 ,  H01L2224/29109 ,  H01L2924/0105 ,  H01L2224/32057 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/75301 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00014 ,  H01L2224/29113 ,  H01L2924/00014 ,  H01L2224/29144 ,  H01L2924/00014 ,  H01L2224/29147 ,  H01L2924/00014 ,  H01L2224/29139 ,  H01L2924/00014 ,  H01L2224/29124 ,  H01L2924/00014 ,  H01L2224/29118 ,  H01L2924/00014 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2224/32503 ,  H01L2924/00014 ,  H01L2224/82102 ,  H01L2924/00014 ,  H01L2224/82104 ,  H01L2924/00014 ,  H01L2224/82101 ,  H01L2924/00014 ,  H01L2224/245 ,  H01L2924/053 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2224/245 ,  H01L2924/0781 ,  H01L2224/245 ,  H01L2924/01013 ,  H01L2924/00014 ,  H01L2224/245 ,  H01L2924/01042 ,  H01L2924/00014 ,  H01L2224/245 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2224/245 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/245 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/759 ,  H01L2924/00012 ,  H01L2224/2401 ,  H01L2924/00012 ,  H01L2224/2405 ,  H01L2924/00012 ,  H01L2224/29005 ,  H01L2924/00012 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US20230082786A1

公开(公告)日：2023-03-16

申请号：US17933188

申请日：2022-09-19

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US11362076B2

公开(公告)日：2022-06-14

申请号：US17180076

申请日：2021-02-19

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  G09G3/32 ,  H01L25/16 ,  G06F3/041 ,  G06F1/16 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US10957678B2

公开(公告)日：2021-03-23

申请号：US16688638

申请日：2019-11-19

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  H01L25/16 ,  G06F3/041 ,  G06F1/16 ,  G09G3/32 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.