公开(公告)号：US20110241808A1

公开(公告)日：2011-10-06

申请号：US12987731

申请日：2011-01-10

申请人： Haiyan Zhao ,  Masahiro Kobayashi ,  Noriaki Sakamoto

发明人： Haiyan Zhao ,  Masahiro Kobayashi ,  Noriaki Sakamoto

IPC分类号： H03J3/02

CPC分类号： H05K9/006

摘要： According to one embodiment, a tuner module, including: a substantially box-shaped casing; an input terminal attached to one side plate of the casing; a distributor disposed in the casing around the input terminal; a first tuner disposed adjoining the distributor so as to sandwich the distributor with the input terminal; a second tuner disposed adjoining the first tuner so as to sandwich the first tuner with the distributor; and a circuit board on which the distributor, the first tuner and the second tuner are mounted.

摘要翻译： 根据一个实施例，一种调谐器模块，包括：基本上为箱形的壳体; 连接到所述壳体的一个侧板的输入端子; 布置在输入端子周围的壳体中的分配器; 第一调谐器，与所述分配器相邻设置，以使所述分配器与所述输入端夹持; 第二调谐器，与第一调谐器相邻设置，以便将第一调谐器与分配器夹持; 以及安装有分配器，第一调谐器和第二调谐器的电路板。

公开(公告)号：US07957158B2

公开(公告)日：2011-06-07

申请号：US11928782

申请日：2007-10-30

申请人： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

发明人： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

IPC分类号： H05K7/10

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

摘要翻译： 提供了具有改进的包装密度的电路装置。 本发明的电路装置包括：电路板，其表面被绝缘层覆盖; 形成在绝缘层的表面上的导电图案; 电连接到导电图案的电路元件; 并且连接到由导电图案形成的焊盘的引线。 此外，控制元件固定到由引线的一部分形成的台面部的上表面，并且台肩部的后表面与电路板的上表面间隔开。

公开(公告)号：US20100293715A1

公开(公告)日：2010-11-25

申请号：US12739916

申请日：2008-10-21

申请人： Noriaki Sakamoto ,  Tatsuya Ozaki ,  Koichiro Ochiai ,  Kosaku Adachi ,  Yuji Emura ,  Hiroya Ishikawa

发明人： Noriaki Sakamoto ,  Tatsuya Ozaki ,  Koichiro Ochiai ,  Kosaku Adachi ,  Yuji Emura ,  Hiroya Ishikawa

IPC分类号： A47C21/04

CPC分类号： A47C21/048 ,  A47C17/80 ,  A47C21/044 ,  A47G9/0215 ,  A61F7/08 ,  A61F2007/0055 ,  A61F2007/0057 ,  A61F2007/0086 ,  A61F2007/0096 ,  A61G10/005 ,  A61G2210/70 ,  A61G2210/90 ,  B60H1/00378

摘要： Provided is temperature-controlled air circulation type bedding which introduces the blowoff air generated by temperature control unit into an air flow passage provided around a bedding body so as to cool or warm the body of a person in the bedding, controls the blowoff air temperature to form a comfortable sleeping environment irrespective of an external atmosphere temperature, suppresses discharge of carbon dioxide gas, etc. with a compact configuration, and has low power consumption. The temperature-controlled air circulation type bedding includes a temperature control unit 2 which controls the blowoff air temperature by a cooling or heating action, and a bedding body 3 which provides an air flow passage 27 which allows the blowoff air from the temperature control unit to be introduced and circulated therethrough, and cools or warms the inside thereof. The temperature of air which circulates through the bedding is detected so that the temperature of the blowoff air is controlled by the temperature control unit.

摘要翻译： 提供了一种温度控制的空气循环式床上用品，其将由温度控制单元产生的吹出空气引入设置在床身体周围的空气流动通道中，以冷却或加热床上人的身体，将吹送空气温度控制在 形成舒适的睡眠环境，而与外部气氛温度无关，抑制二氧化碳气体等的排出，结构紧凑，功耗低。 温度控制的空气循环型床上用品包括通过冷却或加热动作控制吹出空气温度的温度控制单元2和提供空气流动通道27的床身体3，床主体3允许来自温度控制单元的吹出空气 引入并循环，冷却或加热其内部。 检测通过床垫循环的空气的温度，使得吹出空气的温度由温度控制单元控制。

公开(公告)号：US20100263395A1

公开(公告)日：2010-10-21

申请号：US12742004

申请日：2008-10-30

申请人： Kosaku Adachi ,  Noriaki Sakamoto ,  Tatsuya Ozaki ,  Koichiro Ochiai ,  Yuji Emura ,  Hiroya Ishikawa ,  Takayuki Nakata

发明人： Kosaku Adachi ,  Noriaki Sakamoto ,  Tatsuya Ozaki ,  Koichiro Ochiai ,  Yuji Emura ,  Hiroya Ishikawa ,  Takayuki Nakata

IPC分类号： B60H1/32 ,  F25B39/04 ,  B60H1/34

CPC分类号： B60H1/00378 ,  B60H1/00271 ,  B60H1/00428 ,  B60H1/00742 ,  B60H1/00842 ,  B60H1/247 ,  Y02T10/88

摘要： Provided is a vehicle-mounted temperature control device (2) capable of suppressing resource wasting or environmental contamination during an idling stop, an easily installed vehicle-mounted refrigeration unit which blows off cooled or warmed air to the inside of a vehicle, and selectively cooling or warming not only a napping cabin behind the driver's seat, but also the driver's seat. The vehicle-mounted temperature control device includes a refrigeration unit having a refrigeration cycle in which a compressor, a condenser, and an evaporator to which driving electric power is supplied by a battery 5 are annularly connected; a temperature control chamber formed from a heat-insulating wall body having a blowoff air trunk and a return air trunk and having a circulation fan and the evaporator in the refrigeration cycle housed therein; and a machine chamber in which the compressor, the condenser, and a radiation fan which cools the compressor and condenser are disposed. The refrigeration unit (2) is attached to the inside of a napping cabin (4) behind the driver's seat (3), and the cool or warm air generated by the evaporator being blown off to either the driver's seat or the inside of the napping cabin, or both so that temperature is controlled.

摘要翻译： 本发明提供一种能够抑制怠速停止时的资源浪费或环境污染的车载温度控制装置（2），将冷却或温热的空气吹送到车辆内部的容易安装的车载制冷机组，并且选择性地冷却 或者不仅在驾驶员座椅后面的一个小睡舱，还可以驾驶座椅。 车载温度控制装置包括具有制冷循环的制冷单元，其中由电池5供给驱动电力的压缩机，冷凝器和蒸发器环形连接; 温度控制室，由具有吹出空气导管和返回空气导管的隔热壁体形成，并具有容纳在其中的制冷循环中的循环风扇和蒸发器; 以及设置有压缩机，冷凝器和冷却压缩机和冷凝器的辐射风扇的机械室。 制冷单元（2）安装在驾驶员座椅（3）后面的起飞舱（4）的内部，并且由蒸发器产生的冷或暖空气被吹送到驾驶员座椅或起毛的内部 舱或两者，以便控制温度。

公开(公告)号：US20090135572A1

公开(公告)日：2009-05-28

申请号：US12064996

申请日：2006-08-30

申请人： Sadamichi Takakusaki ,  Noriaki Sakamoto

发明人： Sadamichi Takakusaki ,  Noriaki Sakamoto

IPC分类号： H05K1/11 ,  H05K13/04

CPC分类号： H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/056 ,  H05K1/142 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/09554 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T29/5313 ,  H01L2924/00 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.

摘要翻译： 提供一种其中并入其中的电子电路稳定地工作的电路装置。 混合集成电路装置包括设置在大致相同平面上的多个电路板。 在电路板的每个顶表面上形成包括导电图案和电路元件的电子电路。 此外，这些电路板由密封树脂一体地支撑。 此外，连接到形成在电路板表面上的电子电路的引线从密封树脂引出到外部。

公开(公告)号：US07529093B2

公开(公告)日：2009-05-05

申请号：US11164522

申请日：2005-11-28

申请人： Noriaki Sakamoto

发明人： Noriaki Sakamoto

IPC分类号： H05K7/20

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/0379 ,  H05K2203/0315 ,  H05K2203/1316 ,  Y10T29/49158 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating layer. Circuit elements are connected to the conductive pattern. Sealing resin covers the front and side surfaces of the circuit board. Furthermore, the sealing resin also covers the edge region of the back surface of the circuit board. Thus, it is ensured that the circuit board has a dielectric strength while exposing the back surface of the circuit board to the outside.

摘要翻译： 在电路板的前表面上形成第一绝缘层，在后表面上形成第二绝缘层。 在第一绝缘层的表面上形成导电图案。 电路元件连接到导电图案。 密封树脂覆盖电路板的正面和侧面。 此外，密封树脂也覆盖电路板背面的边缘区域。 因此，确保电路板在将电路板的背面暴露于外部时具有介电强度。

公开(公告)号：US07364941B2

公开(公告)日：2008-04-29

申请号：US11207293

申请日：2005-08-19

申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Noriaki Sakamoto

发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L23/02

CPC分类号： H01L24/97 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85913 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/381 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive film 23A and a second conductive film 23B, which are laminated with an interlayer insulating layer 22 interposed in between, are formed. By selectively removing the first conductive film, a first conductive wiring layer 12A is formed and the first conductive wiring layer is covered with an overcoat resin 18. Overcoat resin 18 is irradiated with plasma to roughen its top surface. A sealing resin layer 17 is formed so as to cover the top surface of the roughened overcoat resin 18 and circuit elements 13.

摘要翻译： 提供了一种电路器件制造方法，其中通过将等离子体照射到外涂层树脂上来改善形成在导电布线层上的外涂层树脂与密封树脂层的粘合性。 形成有夹在中间层间绝缘层22的第一导电膜23A和第二导电膜23B。 通过选择性地去除第一导电膜，形成第一导电布线层12A，并且用外涂层树脂18覆盖第一导电布线层。 外涂层树脂18用等离子体照射以使其顶表面粗糙化。 形成密封树脂层17以覆盖粗糙的外涂层树脂18和电路元件13的顶表面。

公开(公告)号：US20070120237A1

公开(公告)日：2007-05-31

申请号：US11698104

申请日：2007-01-26

申请人： Noriaki Sakamoto ,  Takehisa Yokohama ,  Tomoru Sato ,  Takafumi Kikuchi ,  Fujio Ito

发明人： Noriaki Sakamoto ,  Takehisa Yokohama ,  Tomoru Sato ,  Takafumi Kikuchi ,  Fujio Ito

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L22/34 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： To provide a test technology capable of reducing a package size by reducing a number of terminals (pins) in a semiconductor integrated circuit of SIP or the like constituted by mounting a plurality of semiconductor chips to a single package, in SIP 102 constituted by mounting a plurality of semiconductor chips to a signal package of ASIC 100, SDRAM 101 and the like, a circuit of testing SDRAM 101 (SDRAMBIST 109) is provided at inside of ASIC 100, and SDRAM 101 is tested from outside of SDRAM 101, that is, from ASIC 100. By providing the test circuit of SDRAM 101 at inside of ASIC 100, it is not necessary to extrude a terminal for testing SDRAM 101 to outside of SIP 102.

摘要翻译： 为了提供一种测试技术，能够通过将通过将多个半导体芯片安装到单个封装构成的SIP等的半导体集成电路中的多个端子（引脚）减少到封装尺寸，在通过安装 将多个半导体芯片连接到ASIC 100，SDRAM 101等的信号封装，在ASIC 100的内部提供测试SDRAM 101（SDRAMBIST 109）的电路，并且从RAM 101的外部测试SDRAM 101， 来自ASIC 100。 通过在ASIC100的内部提供SDRAM 101的测试电路，不需要将用于测试SDRAM 101的终端拉伸到SIP 102的外部。

公开(公告)号：US07208826B2

公开(公告)日：2007-04-24

申请号：US09821361

申请日：2001-03-29

申请人： Noriaki Sakamoto ,  Isao Ochiai

发明人： Noriaki Sakamoto ,  Isao Ochiai

IPC分类号： H01L23/24 ,  H01L23/22

CPC分类号： H01L24/49 ,  H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporting board is required, a low-profile semiconductor device with improved heat radiation can be provided.

摘要翻译： 模具焊盘50,51，外部连接电极52和桥接器在半蚀刻之后被绝缘树脂覆盖，形成为单个封装，而不需要诸如支撑引线或胶带的联接构件。 此外，由于不需要支撑板，可以提供具有改善的散热的低轮廓半导体器件。

公开(公告)号：US06989291B2

公开(公告)日：2006-01-24

申请号：US10664209

申请日：2003-09-17

申请人： Yusuke Igarashi ,  Hideki Mizuhara ,  Noriaki Sakamoto

发明人： Yusuke Igarashi ,  Hideki Mizuhara ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/185 ,  H05K1/187 ,  H05K3/062 ,  H05K3/064 ,  H05K3/20 ,  H05K2203/0376 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate 10 in which a first conductive film 11 and a second conductive film 12 have been laminated via a third conductive film 13 is used. After forming a conductive pattern layer 11A by etching the first conductive film 11, anchor portions 15 are formed by overetching the third conductive film 13 by use of the conductive pattern layer 11A as a mask, and a sealing resin layer 22 is made to bite into the anchor portions 15 so as to strengthen bonding of the sealing resin layer 22 with the conductive pattern layer 11A.

摘要翻译： 优选地，其中使用具有导电图案的柔性片的半导体器件作为支撑衬底，在其上安装半导体元件，并且已经开发了组合。 在这种情况下，存在无法形成多层布线结构并且在制造工艺中绝缘树脂片翘曲突出的问题。 为了解决这些问题，使用通过第三导电膜13层压了第一导电膜11和第二导电膜12的层压板10。 在通过蚀刻第一导电膜11形成导电图案层11a之后，通过使用导电图案层11A作为掩模，通过使第三导电膜13过蚀刻来形成锚固部分15，并且将密封树脂层22制成 咬入锚定部15，以便加强密封树脂层22与导电图案层11A的接合。