公开(公告)号：US20130280956A1

公开(公告)日：2013-10-24

申请号：US13555749

申请日：2012-07-23

Applicant: Wai Chun Cheng ,  Chung Fai Lam ,  Lorenzo Trolese

Inventor： Wai Chun Cheng ,  Chung Fai Lam ,  Lorenzo Trolese

IPC: H01R13/66

CPC classification number: H02G3/081 ,  H01H13/023 ,  H01H13/20 ,  H01H13/22 ,  H01H13/30 ,  H01H50/08 ,  H01H71/123 ,  H01H71/128 ,  H01H71/24 ,  H01H71/50 ,  H01H2219/036 ,  H01H2219/06 ,  H01H2219/066 ,  H01R13/506 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6658 ,  H01R13/713 ,  H01R13/7135 ,  H01R13/7175 ,  H01R25/006 ,  H01R43/20 ,  H02G3/086 ,  H02G3/10 ,  H02G3/12 ,  H02G3/14 ,  H02G3/18 ,  H02H3/162 ,  H02H3/33 ,  H05K5/02 ,  H05K5/0221 ,  H05K7/026

Abstract: The present invention is directed to an electrical wiring device that includes an AC power supply control circuit, an isolation interface circuit and a low voltage printed circuit board (PCB) assembly. The low voltage PCB assembly includes a universal serial bus (USB) charging interface circuit configured to convert the modulated power signal into a low voltage direct current (DC) charging signal. The at least one low voltage PCB assembly includes at least one USB socket coupled to the USB charging interface circuit and accessible via the at least one USB aperture formed in the front cover member. The USB charging interface circuit is configured to provide the low voltage DC charging signal to at least one device-under-charge at a maximum predetermined charging current.

Abstract translation: 本发明涉及一种包括交流电源控制电路，隔离接口电路和低压印刷电路板（PCB）组件的电气接线装置。 低压PCB组件包括通用串行总线（USB）充电接口电路，其被配置为将调制的功率信号转换成低电压直流（DC）充电信号。 所述至少一个低压PCB组件包括耦合到所述USB充电接口电路的至少一个USB插座，并且可经由形成在所述前盖构件中的所述至少一个USB孔访问。 USB充电接口电路被配置为以最大预定充电电流将低电压DC充电信号提供给至少一个充电器件。

公开(公告)号：US08531374B2

公开(公告)日：2013-09-10

申请号：US13150388

申请日：2011-06-01

Applicant: Wei-Jen Kao ,  Shao-Chun Cheng ,  Chuo-Hsien Lin ,  Ming-Chang Shih ,  Chia-Kong Huang ,  Wen-Pin Chen ,  Shih-Chyn Lin

Inventor： Wei-Jen Kao ,  Shao-Chun Cheng ,  Chuo-Hsien Lin ,  Ming-Chang Shih ,  Chia-Kong Huang ,  Wen-Pin Chen ,  Shih-Chyn Lin

IPC: G09G3/36

CPC classification number: G09G3/20 ,  G09G2310/0267 ,  G09G2330/028 ,  G09G2330/04

Abstract: A compensation circuitry of gate driving pulse signal is adapted to receive a gate driving pulse signal and includes a pre-processing circuit, a peak detector, a discharge circuit, a voltage buffer and a charge pump circuit. The pre-preprocessing circuit performs a pre-processing operation to the gate driving pulse signal to adjust a voltage thereof. The pre-processed gate driving pulse signal then is transmitted to the peak detector for obtaining a peak voltage after a charging operation, and also is transmitted to the discharge circuit to determine whether to enable the discharge circuit so that providing the peak detector with a discharge loop when the discharge circuit is enabled. The charge pump circuit acquires the peak voltage through the voltage buffer and then modulates a waveform of the gate driving pulse signal according to the peak voltage. A display device using the above compensation circuitry also is provided.

Abstract translation: 栅极驱动脉冲信号的补偿电路适于接收栅极驱动脉冲信号，并且包括预处理电路，峰值检测器，放电电路，电压缓冲器和电荷泵电路。 预处理电路对栅极驱动脉冲信号进行预处理操作，以调整其电压。 然后将预处理的栅极驱动脉冲信号传输到峰值检测器，以获得充电操作之后的峰值电压，并且还将其发送到放电电路以确定是否使能放电电路，使得为峰值检测器提供放电 当放电电路使能时回路。 电荷泵电路通过电压缓冲器获取峰值电压，然后根据峰值电压调制栅极驱动脉冲信号的波形。 还提供了使用上述补偿电路的显示装置。

公开(公告)号：US08525815B2

公开(公告)日：2013-09-03

申请号：US12728252

申请日：2010-03-21

Applicant: Cheng-Yi Lai ,  Chun-Cheng Ko

Inventor： Cheng-Yi Lai ,  Chun-Cheng Ko

IPC: G06F3/041

CPC classification number: G06F3/0421 ,  G06F3/0428

Abstract: An optical touch system includes a display screen having a contact surface, an infrared light source emitting infrared light to cover the contact surface, a linear infrared sensor having a sensing surface with a lengthwise direction thereof parallel to the contact surface, a processor, and a controller. The linear infrared sensor captures an image of the contact surface with an infrared portion representing a touch area of a contact object, the image having an aspect ratio greater than that of the contact surface. The processor determines the touch location of the contact object based on the aspect ratios of the image and the contact surface, the location of the infrared portion on the image, the area of the infrared portion and the area of the touch portion of the contact object on the contact surface. The controller executes an instruction according to the determined location of the contact object.

Abstract translation: 光学触摸系统包括具有接触表面的显示屏，发射红外光以覆盖接触表面的红外光源，具有其长度方向平行于接触表面的感测表面的线性红外传感器，处理器和 控制器。 线性红外传感器用表示接触物体的触摸区域的红外部分捕获接触表面的图像，该图像的纵横比大于接触表面的纵横比。 处理器基于图像和接触面的纵横比，图像上的红外部分的位置，红外部分的面积和接触对象的触摸部分的面积来确定接触对象的触摸位置 在接触面上。 控制器根据所确定的联系对象的位置来执行指令。

公开(公告)号：US20130222893A1

公开(公告)日：2013-08-29

申请号：US13441950

申请日：2012-04-09

Applicant: CHUN-CHENG KO

Inventor： CHUN-CHENG KO

IPC: G02B13/14 ,  G02B13/18 ,  G02B9/60

CPC classification number: G02B9/60 ,  G02B13/14 ,  G02B13/18

Abstract: An image lens, in the order from the object side to the image side thereof, includes a first lens including a first surface and a second surface, a second lens including a third surface and a fourth surface, a third lens including a fifth surface and a sixth surface, a fourth lens including a seventh surface and a eighth surface, a fifth lens including a ninth surface and a tenth surface, and an image plane. The image lens satisfies the following formulas: (1) D/TTL>0.94; (2) D/L>1.21; wherein D is the maximum image diameter of the image plane; TTL is a total length of the image lens, and L is a distance from an outmost edge of the tenth surface to an optical axis of the image lens along a direction perpendicular to the optical axis.

Abstract translation: 从物体侧到其像侧的顺序的图像透镜包括包括第一表面和第二表面的第一透镜，包括第三表面和第四表面的第二透镜，包括第五表面的第三透镜和 第六表面，包括第七表面和第八表面的第四透镜，包括第九表面和第十表面的第五透镜和图像平面。 图像透镜满足下列公式：（1）D / TTL> 0.94; （2）D / L> 1.21; 其中D是图像平面的最大图像直径; TTL是图像透镜的总长度，并且L是沿着与光轴垂直的方向从图像透镜的第十表面的最外边缘到光轴的距离。

公开(公告)号：US08485698B2

公开(公告)日：2013-07-16

申请号：US13281430

申请日：2011-10-26

Applicant: Chia-Chun Cheng ,  Lei-Lei Liu

Inventor： Chia-Chun Cheng ,  Lei-Lei Liu

IPC: F21V29/00 ,  F21V29/02 ,  F28D15/02

CPC classification number: F21V29/51 ,  F21V29/713 ,  F21V29/763 ,  F21Y2105/00 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.

Abstract translation: 散热模块包括第一导热板，第二导热板和至少一个热管。 第二导热板与第一导热板相对设置。 所述至少一个热管中的每一个包括第一固定部分，第一弯曲部分，第二固定部分，第二弯曲部分和连接部分。 第一固定部位于第一导热板上，第二固定部位于第二导热板上。 第一弯曲部分从第一固定部分弯曲并延伸。 第二弯曲部分从第二固定部分弯曲并延伸。 连接部分连接在第一弯曲部分和第二弯曲部分之间。 第一弯曲部分的至少部分和第二弯曲部分的至少部分不共面。

公开(公告)号：USD684941S1

公开(公告)日：2013-06-25

申请号：US29419117

申请日：2012-04-25

Applicant: Chen-Fu Chu ,  Hao-Chun Cheng

Designer： Chen-Fu Chu ,  Hao-Chun Cheng

公开(公告)号：US20130143361A1

公开(公告)日：2013-06-06

申请号：US13309311

申请日：2011-12-01

Applicant: Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

Abstract translation: 公开了用于半导体器件的封装加工工具和系统以及封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。 机械结构包括设置在其上的低热导率材料。

公开(公告)号：US20130099385A1

公开(公告)日：2013-04-25

申请号：US13280157

申请日：2011-10-24

Applicant: Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/538 ,  H01L21/66

CPC classification number: H01L25/50 ,  H01L21/31105 ,  H01L21/565 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

公开(公告)号：US20130099370A1

公开(公告)日：2013-04-25

申请号：US13277575

申请日：2011-10-20

Applicant: Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

Inventor： Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L24/16 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/1601 ,  H01L2224/16104 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.

Abstract translation: 半导体封装包括具有导电迹线的工件和具有导电柱的芯片。 芯片附着在工件上，并且在导电柱和导电迹线之间形成焊点区域。 导电柱和导电迹线之间的距离小于或等于约16μm。

公开(公告)号：US08405829B2

公开(公告)日：2013-03-26

申请号：US12632941

申请日：2009-12-08

Applicant: Chun-Cheng Ko

Inventor： Chun-Cheng Ko

IPC: G01J4/00

CPC classification number: G01N21/21 ,  G01M11/0285 ,  G01N2201/0221

Abstract: A portable electronic device includes a casing, a liquid crystal, a controlling module, and a button. The liquid crystal display is capable of emitting polarized light. The controlling module is received in the casing, the controlling module is configured for controlling the liquid crystal display to display a white screen when receiving a control signal. The button is configured for generating the control signal when triggered by a user.

Abstract translation: 便携式电子设备包括壳体，液晶，控制模块和按钮。 液晶显示器能够发射偏振光。 控制模块被接收在壳体中，控制模块被配置为在接收控制信号时控制液晶显示器显示白屏。 该按钮被配置为在由用户触发时产生控制信号。