公开(公告)号：US20050285277A1

公开(公告)日：2005-12-29

申请号：US11158164

申请日：2005-06-20

Applicant: Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee ,  Kyoung-Sei Choi

Inventor： Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee ,  Kyoung-Sei Choi

IPC: G02F1/1345 ,  H01L21/44 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/0032 ,  H05K3/323 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.

Abstract translation: 为薄膜封装提供具有膜凸块的电路薄膜。 IC芯片通过膜凸块机械连接并电耦合到电路膜，而不是传统的芯片凸块。 在制造方法中，通过激光部分地蚀刻基底膜以产生限定从蚀刻区域相对升高的凸起部分的蚀刻区域。 然后，在基膜上选择性地形成电路图案，部分地在凸起部分上运行。 凸起部分和上覆电路图案构成具有不大于电路膜高度的高度的膜凸块。

公开(公告)号：US20050205524A1

公开(公告)日：2005-09-22

申请号：US11075639

申请日：2005-03-08

Applicant: Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon ,  Kyoung-Sei Choi

Inventor： Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon ,  Kyoung-Sei Choi

IPC: B23K26/36 ,  B23K101/42 ,  C23F1/00 ,  C23F1/18 ,  C23F4/00 ,  C23F4/02 ,  H01L21/60 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/08 ,  H05K3/46

CPC classification number: C23F1/18 ,  C23F1/02 ,  C23F4/02 ,  H05K3/027 ,  H05K3/06 ,  H05K2203/0369 ,  H05K2203/0783 ,  H05K2203/1121 ,  H05K2203/1476

Abstract: A method of manufacturing a tape wiring substrate, by which the production cost can be reduced by a simplified manufacturing process. A fine wiring pattern having fine pitches can be formed. The method of manufacturing a tape wiring substrate includes preparing a base film, forming a metal layer on the base film, and processing the metal layer into a wiring pattern using a laser. In addition, the metal layer is partially removed using the laser, and a wiring pattern is formed by a subsequent wet etching.

Abstract translation: 制造带状布线基板的方法，通过简化的制造工艺可以降低生产成本。 可以形成具有细间距的精细布线图案。 制造带状布线基板的方法包括制备基膜，在基膜上形成金属层，并使用激光将金属层加工成布线图案。 此外，使用激光部分地去除金属层，并且通过随后的湿蚀刻形成布线图案。

公开(公告)号：US20050017343A1

公开(公告)日：2005-01-27

申请号：US10898445

申请日：2004-07-22

Applicant: Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee

Inventor： Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/31 ,  H01L23/485

CPC classification number: H01L24/11 ,  H01L23/3114 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.

Abstract translation: 提供了一种形成凸起的方法，该凸块的上表面基本上是平的，并且其面积可以以均匀的垫间距扩大，以简化安装液晶显示驱动IC（LDI）和半导体芯片以及使用该方法的安装结构 芯片内部的焊盘区域。 因此，传统芯片的边缘上的焊盘区域被最小化，并且凸块形成在芯片内部的基本上平坦的位置，并且焊盘和凸块之间的电连接由再分布金属线执行。

公开(公告)号：US06555921B2

公开(公告)日：2003-04-29

申请号：US09982338

申请日：2001-10-17

Applicant: Yong Hwan Kwon ,  Sa Yoon Kang ,  Nam Seog Kim ,  Dong Hyeon Jang

Inventor： Yong Hwan Kwon ,  Sa Yoon Kang ,  Nam Seog Kim ,  Dong Hyeon Jang

IPC: H01L2348

CPC classification number: H01L24/11 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/12 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor package manufacturing method includes: providing a rerouting film; attaching a semiconductor wafer having integrated circuits to the rerouting film, such that chip pads of the integrated circuits correspond to via holes of the rerouting film; forming a solder filling in each of the via holes to electrically connect the chip pads to the metal pattern layer; forming external terminals on terminal pads of the rerouting film; and separating the wafer and the rerouting film into individual semiconductor packages. A method further includes forming a protection layer on the solder filling. Instead of the semiconductor wafer, individual integrated circuit chips can be attached on the rerouting film. The semiconductor package includes: an integrated circuit having chip pads; a substrate attached to the integrated circuit so that via holes of the substrate are above the chip pads; solder fillings inside the via holes, the solder fillings electrically connecting the chips pads to the pattern metal layer; and another dielectric layer between the substrate and the semiconductor integrated circuit. The semiconductor package further includes external terminals, interconnection bumps on the chip pads, and polymer protection layers on the solder fillings.

公开(公告)号：US06476494B1

公开(公告)日：2002-11-05

申请号：US09438727

申请日：1999-11-11

Applicant: Nam-jung Hur ,  Yong-hwan Kwon ,  Jong-han Park

Inventor： Nam-jung Hur ,  Yong-hwan Kwon ,  Jong-han Park

IPC: H01L23488

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05155

Abstract: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.

Abstract translation: 通过在微电子基板上形成掩模的下凸点冶金层来制造银锡合金焊料凸块，以限定底部焊接冶金层的暴露部分，在底部焊接冶金的暴露部分上镀银，在锡上镀锡并回流以形成 银锡合金焊锡凸块。 因此，银 - 锡合金不被电镀。 相反，银和锡的各层被镀覆，然后回流以形成银 - 锡合金焊料凸块。

公开(公告)号：US06407459B2

公开(公告)日：2002-06-18

申请号：US09853950

申请日：2001-05-10

Applicant: Yong Hwan Kwon ,  Sa Yoon Kang

Inventor： Yong Hwan Kwon ,  Sa Yoon Kang

IPC: H01L2144

CPC classification number: H01L24/94 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/03003 ,  H01L2224/03438 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/02 ,  H01L2924/00 ,  H01L2224/03

Abstract: A semiconductor package which includes: a semiconductor integrated circuit having chip pads formed thereon; interconnection bumps overlying on the chip pads; a patterned metal layer connecting to the interconnection bumps; a first dielectric layer under the patterned metal layer; a second dielectric layer overlying on the patterned metal layer; and terminal pads connecting to the patterned metal layer. The semiconductor package can further include external terminals connecting to the terminal pads, a third dielectric layer filling a gap between the first dielectric layer and the semiconductor integrated circuit.

Abstract translation: 一种半导体封装件，包括：其上形成有芯片焊盘的半导体集成电路; 互连凸块覆盖在芯片焊盘上; 连接到互连凸块的图案化金属层; 图案化金属层下面的第一介电层; 覆盖在图案化金属层上的第二电介质层; 以及连接到图案化金属层的端子焊盘。 半导体封装还可以包括连接到端子焊盘的外部端子，填充第一介电层和半导体集成电路之间的间隙的第三介电层。

公开(公告)号：US6013572A

公开(公告)日：2000-01-11

申请号：US63716

申请日：1998-04-21

Applicant: Nam-jung Hur ,  Yong-hwan Kwon ,  Jong-han Park

Inventor： Nam-jung Hur ,  Yong-hwan Kwon ,  Jong-han Park

IPC: G01N21/88 ,  G01N21/956 ,  H01L21/60 ,  H01L23/48 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

Abstract: Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.

Abstract translation: 通过在微电子基板上形成掩模的下凸点冶金层来制造银锡合金焊料凸块，以限定底部焊接冶金层的暴露部分，在底部焊接冶金的暴露部分上镀银，在锡上镀锡并回流以形成 银锡合金焊锡凸块。 因此，银 - 锡合金不被电镀。 相反，银和锡的各层被镀覆，然后回流以形成银 - 锡合金焊料凸块。

公开(公告)号：US08479232B2

公开(公告)日：2013-07-02

申请号：US12630533

申请日：2009-12-03

Applicant: Won-il Kim ,  Yong-hwan Kwon ,  Joon-hwan Kim ,  Heui-jin Kwon ,  Chang-soo Lee ,  Jeong-yeon Lee ,  Victor Szilagyi

Inventor： Won-il Kim ,  Yong-hwan Kwon ,  Joon-hwan Kim ,  Heui-jin Kwon ,  Chang-soo Lee ,  Jeong-yeon Lee ,  Victor Szilagyi

IPC: G06F13/00

CPC classification number: H04N21/47214 ,  H04N5/44543 ,  H04N21/482 ,  H04N21/4821

Abstract: A display apparatus and a method for scheduling a broadcast using the same. The broadcast scheduling method includes generating a program information table, in which broadcast information is arranged, if a broadcast program selected by a user in the program information table is moved into an area adjacent to an icon, displaying the broadcast program being added to an item folder, and scheduling the broadcast program.

公开(公告)号：US20130156394A1

公开(公告)日：2013-06-20

申请号：US13611119

申请日：2012-09-12

Applicant: Joong-Seon CHOE ,  Jong-Hoi Kim ,  Kwang-Seong Choi ,  Chun Ju Youn ,  Duk Jun Kim ,  Yong-Hwan Kwon ,  Eun Soo Nam

Inventor： Joong-Seon CHOE ,  Jong-Hoi Kim ,  Kwang-Seong Choi ,  Chun Ju Youn ,  Duk Jun Kim ,  Yong-Hwan Kwon ,  Eun Soo Nam

IPC: G02B6/10 ,  B32B37/14

CPC classification number: G02B6/4267 ,  G02B6/4239 ,  G02B6/4245 ,  G02B6/4272 ,  Y10T156/10

Abstract: The inventive concept relates to an optical communication module. The optical communication module may include a metal block: an electrical device formed on the metal block; an optical device adhesive block formed on the metal block; an optical device formed on the optical device adhesive block and connected to the electrical device through a bonding interconnection; and a flat type optical waveguide formed on one side of the optical device adhesive block and optically aligned with the optical device.

Abstract translation: 本发明构思涉及光通信模块。 光通信模块可以包括金属块：形成在金属块上的电气装置; 形成在所述金属块上的光学装置粘合块; 光学装置，形成在光学装置粘合块上并通过粘合互连连接到电气装置; 以及形成在光学器件粘合块的一侧上并与光学器件光学对准的平面型光波导。

公开(公告)号：US20130050093A1

公开(公告)日：2013-02-28

申请号：US13584285

申请日：2012-08-13

Applicant: Joo-youn KIM ,  Yong-hwan KWON

Inventor： Joo-youn KIM ,  Yong-hwan KWON

IPC: G06F3/02 ,  G06F3/01

CPC classification number: H04N21/4222 ,  G06F9/54 ,  G06F2209/549 ,  H04N21/42207 ,  H04N21/42209 ,  H04N21/42221 ,  H04N21/812 ,  H04N21/8173

Abstract: A display apparatus, a method for executing an application thereof, an external device remotely controlling the display apparatus, and a method for providing an application control screen thereof are provided. The display apparatus includes a display that displays an application execution screen, the application execution screen displaying an application; a communication unit that communicates with an external server and an external device that remotely controls the display apparatus; and a control unit that transmits to the external device a generation signal that instructs the external device to generate an application control screen in response to receiving an input command to execute the application, controls the communication unit to receive a command from the external device input through the application control screen, and operates the application according to the received command.

Abstract translation: 提供一种显示装置，其执行方法，远程控制显示装置的外部装置及其应用控制画面的提供方法。 显示装置包括显示应用程序执行画面的显示器，显示应用程序的应用程序执行画面; 与远程控制显示装置的外部服务器和外部设备通信的通信单元; 以及控制单元，响应于接收到执行应用的输入命令，向外部设备发送指示外部设备生成应用控制屏幕的生成信号，控制通信单元从外部设备输入接收命令，通过 应用程序控制屏幕，并根据接收的命令操作应用程序。