公开(公告)号：US5140497A

公开(公告)日：1992-08-18

申请号：US700712

申请日：1991-05-16

申请人： Noboru Kato ,  Emiko Nogome ,  Hisatake Okamura ,  Teruhisa Tsuru ,  Tetsuo Taniguchi ,  Ken Tonegawa

发明人： Noboru Kato ,  Emiko Nogome ,  Hisatake Okamura ,  Teruhisa Tsuru ,  Tetsuo Taniguchi ,  Ken Tonegawa

IPC分类号： H01G4/12 ,  H01F27/00 ,  H01G4/255 ,  H01G4/40 ,  H03H3/00 ,  H03H5/02 ,  H03H7/01 ,  H03H7/09

CPC分类号： H03H7/1783 ,  H03H3/00 ,  H03H7/09 ,  H03H7/1708 ,  H03H7/1733 ,  H03H2001/0085 ,  Y10T29/435

摘要： A composite electronic component containing at least two circuit elements including an inductor. The composite electronic component comprises a component body including a laminated body of a plurality of non-conductive layers, an inductor electrode formed between either two adjacent non-conductive layers of the laminated body, a capacitor electrode formed between another two adjacent non-conductive layers of the laminated body, two shield electrodes formed on both surfaces of the laminated body, one of the shield electrodes being opposed to the capacitor electrode to constitute a capacitor, a frequency adjusting capacitor electrode which is formed outside at least one of the shield electrodes through a non-conductive layer and has a smaller area than the capacitor electrode, and a non-conductive protect layer, formed of a non-malleable material, for covering an outer surface of the frequency adjusting capacitor electrode and is to be trimmed along with the frequency adjusting capacitor electrode for frequency adjusting; and at least two connecting electrodes including a first connecting electrode connecting the capacitor electrode to the frequency adjusting capacitor electrode and a second connecting electrode connecting the two shield electrodes to each other.

摘要翻译： 包含至少两个包括电感器的电路元件的复合电子部件。 复合电子部件包括：包括多个非导电层的层叠体的组件体，形成在层叠体的两个相邻的非导电层之间的电感器电极，形成在另一个相邻的非导电层之间的电容器电极 层叠体的两个屏蔽电极，形成在层叠体的两面的两个屏蔽电极，其中一个屏蔽电极与电容器电极相对构成电容器，频率调节电容器电极形成在至少一个屏蔽电极之间的通过 非导电层并且具有比电容器电极更小的面积，以及由不可延展材料形成的用于覆盖调频电容器电极的外表面的非导电保护层，并且与 频率调节用电容电极; 以及至少两个连接电极，包括将电容器电极连接到频率调节电容器电极的第一连接电极和将两个屏蔽电极彼此连接的第二连接电极。

公开(公告)号：US5099387A

公开(公告)日：1992-03-24

申请号：US641881

申请日：1991-01-16

申请人： Noboru Kato ,  Emiko Nogome

发明人： Noboru Kato ,  Emiko Nogome

IPC分类号： H01G4/005 ,  H01G4/012 ,  H01G4/10 ,  H01G4/30

CPC分类号： H01G4/012

摘要： A multilayer capacitor in which a plurality of inner electrodes are arranged so as to be overlapped with each other while being separated by dielectric layers, at least one of the inner electrodes being provided with a slit extending in the direction of a current flowing in the inner electrode and having a width which is two times or more as large as the thickness of the dielectric layer which is in contact with the inner electrode.

摘要翻译： 一种层叠电容器，其中多个内部电极被布置成彼此重叠，同时被电介质层隔开，所述内部电极中的至少一个设置有沿着在内部电流中流动的电流的方向延伸的狭缝 电极，其宽度是与内电极接触的电介质层的厚度的两倍或更多倍的宽度。

公开(公告)号：US4690854A

公开(公告)日：1987-09-01

申请号：US777270

申请日：1985-09-18

申请人： Shinji Tomibe ,  Reizo Gomibuchi ,  Kiyofumi Takahashi ,  Noboru Kato

发明人： Shinji Tomibe ,  Reizo Gomibuchi ,  Kiyofumi Takahashi ,  Noboru Kato

IPC分类号： C08L101/00 ,  C08B15/00 ,  C08F8/42 ,  C08G85/00 ,  C08K3/00 ,  C08K3/28 ,  C08K3/30 ,  C08L101/02 ,  D06M11/00 ,  D06M11/42 ,  D06M11/53 ,  D06M13/02 ,  D06M13/244 ,  D06M13/248 ,  D06M13/252 ,  D06M13/322 ,  D06M13/46 ,  H01B1/12 ,  H01B1/20 ,  H01B1/22 ,  B05D3/10 ,  B05D5/12 ,  B32B15/08 ,  C08J7/00

CPC分类号： D06M11/53 ,  H01B1/122 ,  D06M2101/06 ,  D06M2101/32 ,  D06M2101/34 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/294 ,  Y10T428/31685 ,  Y10T428/31699

摘要： An electrically conducting material including a polymeric substrate containing mercapto, thiocarbonyl, quaternary ammonium salt, amino or isocyanato groups, and copper sulfide bound to the polymeric substrate. The electrically conducting material may be prepared by treating the polymeric substrate with a source of monovalent copper ions and a sulfur-containing compound to form copper sulfide bound to the polymeric substrate.

摘要翻译： 包含含有巯基，硫代羰基，季铵盐，氨基或异氰酸酯基的聚合物底物和与聚合物基质结合的硫化铜的导电材料。 导电材料可以通过用一价铜离子源和含硫化合物处理聚合物基底以形成结合到聚合物基底上的硫化铜来制备。

公开(公告)号：US09136212B2

公开(公告)日：2015-09-15

申请号：US13247031

申请日：2011-09-28

申请人： Noboru Kato

发明人： Noboru Kato

IPC分类号： H05K1/00 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K3/46

CPC分类号： H05K1/115 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/16 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0352 ,  H05K2201/09672 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in plan in the z-axis direction, are overlaid on the external electrodes and are not connected to one another in regions in which the internal conductors are overlaid on the external electrodes.

摘要翻译： 电路板包括层压体，其包括由柔性材料制成的多个绝缘材料层的层叠体。 外部电极设置在层压体的顶表面上。 电子部件安装在外部电极上。 当沿着z轴方向平面地观察时，多个内部导体重叠在外部电极上，并且在内部导体重叠在外部电极上的区域中彼此不连接。

公开(公告)号：US08917218B2

公开(公告)日：2014-12-23

申请号：US13294310

申请日：2011-11-11

申请人： Noboru Kato ,  Jun Sasaki

发明人： Noboru Kato ,  Jun Sasaki

IPC分类号： H01Q7/08 ,  H01Q1/00 ,  H05K1/02 ,  H01Q1/20 ,  H01L23/66 ,  H01Q7/00 ,  H01L23/538 ,  H05K1/18 ,  H05K1/16 ,  H05K3/46

CPC分类号： H01Q7/06 ,  H01L23/5387 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/20 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0281 ,  H05K1/165 ,  H05K1/189 ,  H05K3/4632 ,  H05K2201/05 ,  H05K2201/09336 ,  H05K2201/10098 ,  H05K2201/10189 ,  H01L2924/00

摘要： A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.

摘要翻译： 电路板和电路模块更准确地提供天线线圈和与天线线圈电连接的电子部件之间的阻抗匹配，并且包括板主体，其包括由柔性材料制成的板部分和多个层叠绝缘材料层。 天线线圈包括设置在板部分中的线圈导体。 配线导体设置在电路板部分中并电连接到天线线圈。 板部分具有不如板部分变形的结构。 电连接到布线导体的集成电路安装在基板部分上。

公开(公告)号：US08424769B2

公开(公告)日：2013-04-23

申请号：US13472520

申请日：2012-05-16

申请人： Noboru Kato

发明人： Noboru Kato

IPC分类号： G06K19/00

CPC分类号： H01Q7/00 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q5/378

摘要： In an antenna for an RFID device, a feed coil is coupled to a first booster coil and a second booster coil through an electromagnetic field. In the feed coil, a first region and a second region are disposed so as to overlap with the first booster coil and the second booster coil, respectively. The first region of the feed coil is coupled to the first booster coil through an electromagnetic field, and the second region of the feed coil is coupled to the second booster coil through an electromagnetic field. Accordingly, the antenna has a high degree of coupling between the feed coil and a booster antenna and superior transmission efficiency of an RF signal, and prevents the occurrence of a null point.

摘要翻译： 在用于RFID设备的天线中，馈电线圈通过电磁场耦合到第一升压线圈和第二升压线圈。 在馈送线圈中，第一区域和第二区域分别设置成与第一升压线圈和第二升压线圈重叠。 馈电线圈的第一区域通过电磁场耦合到第一升压线圈，馈电线圈的第二区域通过电磁场耦合到第二升压线圈。 因此，天线在馈电线圈和增强天线之间具有高度的耦合度，并且RF信号的传输效率优异，并且防止产生零点。

公开(公告)号：US08378501B2

公开(公告)日：2013-02-19

申请号：US12833083

申请日：2010-07-09

申请人： Kosuke Yamada ,  Noboru Kato

发明人： Kosuke Yamada ,  Noboru Kato

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06131 ,  H01L2224/06179 ,  H01L2224/06505 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3511

摘要： A semiconductor package is provided with a functionally necessary minimum number of components with which stress concentrated on specific solder bumps is reduced and ruptures of the bumps are prevented even when stress caused by physical bending or a difference in thermal expansion coefficient is applied to the package. The semiconductor package includes a tabular die and bonding pads arranged on a mounting surface of the die. A passivation layer and a protective film are provided on the mounting surface such that central areas of the bonding pads are open. Under-bump metals (UBMs) connected to the bonding pads are provided in the openings, and solder bumps are provided on the surfaces of the UBMs. The diameter of the UBMs provided at corners of the die is less than that of the UBM provided at the approximate center of the die so that the elastic modulus of the UBMs provided at the corners is small.

摘要翻译： 半导体封装设置有功能上必需的最小数量的组件，其中集中在特定焊料凸块上的应力被减小，并且即使当由物理弯曲引起的应力或热膨胀系数的差异施加到封装时，也可以防止凸块的破裂。 半导体封装包括布置在管芯的安装表面上的片状管芯和焊盘。 在安装表面上设置钝化层和保护膜，使得焊盘的中心区域是开放的。 连接到接合焊盘的凹凸下金属（UBM）设置在开口中，并且在UBM的表面上设置焊料凸块。 设置在模具角落处的UBM的直径小于设置在模具的大致中心处的UBM的直径，使得设置在拐角处的UBM的弹性模量小。

公开(公告)号：US08179329B2

公开(公告)日：2012-05-15

申请号：US12845846

申请日：2010-07-29

申请人： Noboru Kato

发明人： Noboru Kato

IPC分类号： H01Q21/00

CPC分类号： G06K19/07749 ,  G06K19/07767 ,  G06K19/07777 ,  G06K19/07779 ,  G06K19/07786 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/26 ,  H01Q9/285

摘要： A composite antenna achieves favorable radiation characteristics and favorable communication performance, and can be used in short distance communication as well as long distance communication. The composite antenna includes a dipole antenna having an elongated shape, a loop antenna including at least one pair of opposing end portions, and a connection portion arranged to connect the dipole antenna and a point of the loop antenna at which the amplitude of a current flowing in the loop antenna has a maximum value. The dipole antenna performs long distance communication utilizing an electric field, and the loop antenna performs short distance communication utilizing a magnetic field. This composite antenna may be used as a wireless IC device in RFID systems.

摘要翻译： 复合天线实现良好的辐射特性和良好的通信性能，可用于短距离通信以及远距离通信。 复合天线包括具有细长形状的偶极天线，包括至少一对相对的端部的环形天线，以及连接部分，其连接偶极子天线和环形天线的点，其中流动的电流的振幅 在环形天线中具有最大值。 偶极天线利用电场进行长距离通信，环形天线利用磁场进行短距离通信。 该复合天线可以用作RFID​​系统中的无线IC器件。

公开(公告)号：US08006910B2

公开(公告)日：2011-08-30

申请号：US12789610

申请日：2010-05-28

申请人： Noboru Kato

发明人： Noboru Kato

IPC分类号： G06K19/06

CPC分类号： H04B5/0012 ,  B65D2203/10 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07771 ,  H01L2224/16225 ,  H01Q1/2225 ,  H01Q7/00

摘要： An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.

摘要翻译： 由例如铝蒸发层压膜形成的物品包装在边缘上包括没有铝蒸发层的切口部分。 电磁耦合模块设置在切口部分中。 无线IC器件由电磁耦合模块和封装的铝蒸发层构成。 电磁耦合模块的磁场天线耦合到封装的铝蒸发层。 整个文章包作为天线的散热器。

公开(公告)号：US07990337B2

公开(公告)日：2011-08-02

申请号：US12336629

申请日：2008-12-17

申请人： Noboru Kato ,  Jun Sasaki

发明人： Noboru Kato ,  Jun Sasaki

IPC分类号： H01Q1/36

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  H01F2017/002

摘要： A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and/or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.

摘要翻译： 射频IC器件包括射频IC芯片，馈电电路基板和散热板。 供电电路基板包括电连接到无线电IC芯片并且包括谐振电路和/或包括电感元件的匹配电路的馈电电路。 供电电路基板被接合到辐射板，辐射从馈电电路提供的传输信号，并将接收到的信号提供给馈电电路。 电感元件以相反方向缠绕的螺旋图案布置，并以相反的方式相互耦合。 无线射频IC器件能够获得不易受到使用环境影响的射频IC器件，使辐射特性的变化最小化，可以在宽频带中使用。