公开(公告)号：US20230213852A1

公开(公告)日：2023-07-06

申请号：US18148051

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Young Dae Chung ,  Hyun Yoon

IPC: G03F1/78 ,  G03F1/70

CPC classification number: G03F1/78 ,  G03F1/70

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.

公开(公告)号：US20230213283A1

公开(公告)日：2023-07-06

申请号：US18147524

申请日：2022-12-28

Applicant: Semes Co., Ltd.

Inventor： Juyeon CHO ,  Youngjun Lee ,  Kwangsoo Kim ,  Kisang Eum ,  Wooram Lee ,  Jongwha Kang ,  Younghun Jung ,  Junghyun Lee ,  Dongwoon Park ,  Sunwook Jung

IPC: F27B17/00 ,  H01L21/67 ,  F27D5/00 ,  F27D1/18 ,  F27D17/00 ,  F27D9/00

CPC classification number: F27B17/0025 ,  H01L21/67103 ,  F27D5/0037 ,  F27D1/1858 ,  F27D17/001 ,  F27D9/00 ,  F27D2009/007

Abstract: A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.

公开(公告)号：US20230211957A1

公开(公告)日：2023-07-06

申请号：US18148152

申请日：2022-12-29

Applicant: SEMES CO., LTD

Inventor： Hyo Joo JEOUN

IPC: B65G17/12

CPC classification number: B65G17/12

Abstract: Disclosed is an article transferring apparatus, including: a vehicle traveling along a travel rail installed on a ceiling; a hoist module connected to the vehicle and transferring an article; a step difference measurement unit which is installed in the vehicle, and measures a step difference of the travel rail by measuring distances values to a traveling surface of the travel rail by a first displacement sensor and a second displacement sensor arranged at a predetermined interval along a travel direction; and a controller for determining whether there is a step difference of the travel rail by correcting an error between a first measurement value of the first displacement sensor and a second measurement value of the second displacement sensor according to an inclination of the vehicle.

公开(公告)号：US20230211495A1

公开(公告)日：2023-07-06

申请号：US17970209

申请日：2022-10-20

Applicant: SEMES CO., LTD.

Inventor： Sung Hyuk JUNG ,  Jin Woo SIM

IPC: B25J9/16 ,  G01S17/10

CPC classification number: B25J9/163 ,  B25J9/1694 ,  G01S17/10

Abstract: The present disclosure may provide an auto-teaching method and apparatus using a distance measuring sensor a semiconductor manufacturing facility having a transfer robot including the same, and a substrate processing apparatus including a test substrate according to an embodiment of the present disclosure, may include: a test substrate connected to a robot arm and entering a processing apparatus in a first predetermined direction; a distance measuring sensor connected to the test substrate, and measuring a distance from the processing apparatus in the first direction while scanning the processing apparatus in a predetermined second direction; and a position control unit determining a region in which a substrate may enter the processing apparatus in the second direction, based on predetermined processing apparatus-related information and a measured result of the distance measuring sensor.

公开(公告)号：US20230207363A1

公开(公告)日：2023-06-29

申请号：US18080743

申请日：2022-12-14

Applicant: SEMES CO., LTD.

Inventor： Eun Sang Yoon ,  Seung Keun Jun ,  Hyi Jae Kang

IPC: H01L21/677

CPC classification number: H01L21/67727

Abstract: An inter-floor transport apparatus and a logistics transport system including the inter-floor transport apparatus are provided. The logistics transport system includes: a stage module installed in space where semiconductor devices are fabricated, the stage module including a plurality of stages, which are installed on different floors; a frame module installed to have a direction intersecting the plurality of stages as a length direction; and an inter-floor transport apparatus moving along the frame module and transporting conveyed articles to each of the stages, wherein the inter-floor transport apparatus includes a first load unit, which transports the conveyed articles, a second load unit, which is disposed below the first load unit and transports the conveyed articles, a driving unit, which moves the first and second load units, and a control unit, which controls an operation of the driving unit, and transports a plurality of conveyed articles at the same time.

公开(公告)号：US20230207355A1

公开(公告)日：2023-06-29

申请号：US18145538

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Kun Hee PARK ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Dae Hun KIM ,  Seong Hyun YUN ,  Ye Jin CHOI ,  Eun Hyeok CHOI ,  Tae Ho KANG ,  Young Jin KIM

IPC: H01L21/67 ,  H01L21/687 ,  B08B13/00 ,  B08B3/02 ,  B08B1/00 ,  B08B1/02 ,  B25J15/00 ,  B25J11/00

CPC classification number: H01L21/67207 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68764 ,  H01L21/68707 ,  B08B13/00 ,  B08B3/022 ,  B08B1/002 ,  B08B1/02 ,  B25J15/0052 ,  B25J11/0085

Abstract: An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

公开(公告)号：US20230207337A1

公开(公告)日：2023-06-29

申请号：US17971615

申请日：2022-10-23

Applicant: SEMES CO., LTD.

Inventor： Jae Youl KIM ,  Cheol Yong SHIN ,  Jin Woo JANG

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67051 ,  H01L21/6779

Abstract: According to an embodiment of the present disclosure, a processing liquid supply nozzle includes a nozzle body, a nozzle tip member connected to a lower portion of the nozzle body, and a fastening member that is disposed between the nozzle body and the nozzle tip member to connect the nozzle body and the nozzle tip member to each other and introduces air into the nozzle body and the nozzle tip member.

公开(公告)号：US20230207280A1

公开(公告)日：2023-06-29

申请号：US18147381

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Sun Joo PARK ,  Kyung Seok MIN ,  Hyun Jong SHIM ,  Sun Wook JUNG ,  Sang Min MUN ,  Ho Joong SUN

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J2237/0262 ,  H01J2237/334

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a treatment space, in which a substrate is treated, a support unit that supports the substrate in the treatment space, a shower plate having a through-hole, through which a process gas flows to the treatment space, a plasma source that excites plasma by exciting the process gas supplied to the treatment space, and a density adjusting member that adjusts a density of the plasma generated in the treatment space by changing a dielectric permittivity, and the density adjusting member is located on the shower plate.

公开(公告)号：US20230207272A1

公开(公告)日：2023-06-29

申请号：US18056046

申请日：2022-11-16

Applicant: SEMES CO., LTD. ,  PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION

Inventor： Sang Jeong LEE ,  Yoon Seok CHOI ,  Sun Wook JUNG ,  Ho-Jun LEE ,  Sang Woo KIM

IPC: H01J37/32

CPC classification number: H01J37/32201 ,  H01J37/3244 ,  H01J37/32229

Abstract: An exemplary embodiment of the present invention provided an apparatus for treating a substrate. The apparatus for treating the substrate includes a process chamber having a treating space therein, a support unit for supporting the substrate in the treating space, gas supply unit for supplying treating gas to the treating space, and a microwave application unit for applying microwaves to the treating gas to generate plasma, wherein the microwave application unit includes a transmission plate disposed above the support unit to radiate the microwaves to the treating space, a first waveguide disposed above the transmission plate, and a first power supply for applying the microwaves to the first waveguide, wherein the first waveguide is provided in a ring shape.

公开(公告)号：US20230207265A1

公开(公告)日：2023-06-29

申请号：US18145413

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Shant ARAKELYAN ,  Ja Myung Gu ,  Ogsen Galstyan

IPC: H01J37/32

CPC classification number: H01J37/32165 ,  H01J37/32128 ,  H01J37/32568 ,  H01J37/3244 ,  H01J2237/032 ,  H01J2237/334

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus may include a chamber having an inner space, an electrode configured to generate plasma in the inner space, and a power supply unit configured to apply an RF voltage to the electrode, in which the power supply unit may include a first power supply configured to apply a first pulse voltage having a first frequency to the electrode, a second power supply configured to apply a second pulse voltage having a second frequency different from the first frequency to the electrode, a third power supply configured to apply an RF voltage having a third frequency different from the first frequency and the second frequency, and a phase control member for controlling at least one of the phases of the first pulse voltage and the second pulse voltage.