公开(公告)号：US20180164155A1

公开(公告)日：2018-06-14

申请号：US15890533

申请日：2018-02-07

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Pascal Mellot

IPC: G01J1/42 ,  G01J1/44 ,  G01J1/18 ,  H04N1/00

CPC classification number: G01J1/4204 ,  G01J1/18 ,  G01J1/42 ,  G01J1/44 ,  G01J2001/4426 ,  H04N1/00917

Abstract: The following steps are performed in connection with a photodiode circuit: a) resetting the photodiode circuit; b) determining when a photodiode voltage changes in response to illumination to reach a threshold; and c) updating a counter in response to the determination in step b). The steps a) to c) are repeated until an end of a measurement period is reached. The value of the counter at the end of the measurement period is then output to indicate an intensity of the illumination.

公开(公告)号：US20180157376A1

公开(公告)日：2018-06-07

申请号：US15367780

申请日：2016-12-02

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Olivier Lemarchand

IPC: G06F3/042 ,  G01S17/10 ,  G01V8/12

Abstract: An embodiment device includes an optical source configured to transmit an optical pulse and an optical sensor configured to receive a reflection of the optical pulse. The device further includes a processor configured to determine a parameter based on the reflection, the parameter indicative of a distance between the device and a target; and a controller configured to generate a first control signal based on the parameter, the first control signal being configured to control an operation of the optical source.

公开(公告)号：US20180150946A1

公开(公告)日：2018-05-31

申请号：US15365086

申请日：2016-11-30

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Grégory Roffet ,  Mathieu Thivin

IPC: G06T5/00 ,  G06T7/40 ,  G06T5/40 ,  H04N9/64

CPC classification number: G06T5/009 ,  G06T5/007 ,  G06T5/40 ,  G06T2207/10024 ,  G06T2207/20072 ,  G06T2207/20208 ,  H04N5/23229 ,  H04N5/243 ,  H04N9/045 ,  H04N9/68 ,  H04N9/77

Abstract: Tone mapping is applied to pixels of a digital image. A luminance value of a pixel is determined based on whether one or more pixel intensity values of a pixel in a color space are within a pixel saturation range. A pixel gain is determined based on the determined luminance value of the pixel, and the determined pixel gain is applied to the pixel. The luminance value may also or instead be determined based on whether one or more of the pixel intensity values is within a pixel black-out range. A weight may be employed to determine the luminance value.

公开(公告)号：US09960295B2

公开(公告)日：2018-05-01

申请号：US14781333

申请日：2014-06-20

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Stuart McLeod ,  Pascal Mellot ,  Lindsay Grant

IPC: H01J40/14 ,  H01L31/0232 ,  H01L27/146 ,  G01T1/24 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/107 ,  G01J1/42 ,  G01J1/44 ,  H01L27/144 ,  H01L31/18 ,  H01L27/148

CPC classification number: H01L31/02327 ,  G01J1/4228 ,  G01J1/44 ,  G01T1/248 ,  H01L27/1443 ,  H01L27/1446 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/1461 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14818 ,  H01L31/02027 ,  H01L31/02164 ,  H01L31/107 ,  H01L31/18

Abstract: A Single-Photon Avalanche Diode (SPAD) is disclosed. The SPAD may include an active region for detection of incident radiation, and a cover configured to shield part of the active region from the incident radiation. An array is also disclosed and includes SPADs arranged in rows and columns. A method for making the SPAD is also disclosed.

公开(公告)号：US20180106864A1

公开(公告)日：2018-04-19

申请号：US15689237

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Nicolas Moeneclaey

IPC: G01R31/3193 ,  G01R31/3187 ,  H04L7/00 ,  H03L7/18 ,  H03L7/085 ,  G01R31/317

CPC classification number: G01R31/31937 ,  G01R31/31718 ,  G01R31/3187 ,  H01L27/14643 ,  H03L7/085 ,  H03L7/18 ,  H03M1/00 ,  H03M1/12 ,  H03M2201/4233 ,  H04L7/0025 ,  H04N3/155 ,  H04N5/335 ,  H04N5/3765 ,  H04N5/378

Abstract: A method can be used to generate a reference clock signal having a reference frequency. N clock sub-signals are generated, where N is greater than or equal to 2. The N clock sub-signals are successively mutually shifted out of phase by π/N and each clock sub-signal has an elementary frequency that is equal to the reference frequency divided by N. The N clock sub-signals are propagated over propagation paths. The elementary frequency and a length of the longest propagation path are chosen so that each sub-signal has an acceptable degree of deformation. The duration of each sub-signal edge is longer than quarter of the period of the reference frequency. The reference clock signal is generated by EXCLUSIVE OR combining the propagated clock sub-signals at the end of their respective propagation paths.

公开(公告)号：US09948981B2

公开(公告)日：2018-04-17

申请号：US15078825

申请日：2016-03-23

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Neil Robertson ,  Jean-Yves Couet

IPC: H04N21/442 ,  H04N21/437 ,  H04N21/61 ,  H04N7/173

CPC classification number: H04N21/44245 ,  H04N7/17309 ,  H04N21/437 ,  H04N21/6118 ,  H04N21/6168 ,  H04N21/6193

Abstract: An upstream signal capture device includes a signal capture circuit having a first port and a second port. The first port of the signal capture circuit is arranged for coupling to a diplexer. The upstream signal capture device also includes an amplifier having a first port and a second port, the first port of the amplifier coupled to the second port of the signal capture circuit, and an analog-to-digital converter (ADC) having a first port and a second port, the first port of the ADC coupled to the second port of the amplifier. The upstream signal capture device further includes a digital threshold detector having an input and output, the input of the digital threshold detector coupled to the second port of the analog-to-digital converter, and a memory configured to capture samples of the upstream signal. When using the upstream signal capture device to capture an upstream signal, a portion of an upstream signal is diverted into an analog-to-digital converter (ADC). A portion of the upstream signal is converted into a digital signal, and when the digital signal exceeds a threshold, the signal is captured in a memory.

公开(公告)号：US09934550B2

公开(公告)日：2018-04-03

申请号：US14838467

申请日：2015-08-28

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Gilles Ries

IPC: G09G5/00 ,  G06T1/60 ,  G06T1/20 ,  G06T11/60 ,  H04N5/272 ,  G09G5/397 ,  G09G5/14

CPC classification number: G06T1/60 ,  G06T1/20 ,  G06T11/60 ,  G09G5/14 ,  G09G5/397 ,  G09G2340/12 ,  G09G2350/00 ,  H04N5/272

Abstract: A method for composing a multilayer video image of which the values of the pixels of the image layers are stored in a memory. The video image may include at least one first image layer and a second image layer located in front of the at least one first layer and having an opaque area. The method may include defining a region of the at least one first image layer to be hidden by the opaque area, reading from the memory the stored pixel values, with the exception of the values of the pixels of the region of the at least one first image layer, and composing the video image at least from the read pixel values.

公开(公告)号：US20180074574A1

公开(公告)日：2018-03-15

申请号：US15444724

申请日：2017-02-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean Camiolo ,  Christophe Lorin

IPC: G06F1/32 ,  H01R24/60 ,  H01R24/28 ,  G06F13/42 ,  G06F13/38 ,  G06F13/24

CPC classification number: G06F1/3296 ,  G05F1/00 ,  G06F1/26 ,  G06F1/266 ,  G06F1/3287 ,  G06F13/24 ,  G06F13/385 ,  G06F13/4282 ,  H01R24/28 ,  H01R24/60 ,  H01R2107/00

Abstract: A method can be used for managing a power supply voltage on an output power supply pin of a USB Type-C source device coupled to a USB Type-C receiver device via a USB Type-C cable. A first measurement of a first voltage on a channel configuration pin of the cable is performed when the receiver device is not powered and a second measurement of a second voltage on the channel configuration pin is performed when the receiver device is powered. A difference between the first and second voltages is calculated and the power supply voltage is modified as a function of a value of the difference.

公开(公告)号：US09917124B2

公开(公告)日：2018-03-13

申请号：US14919836

申请日：2015-10-22

Applicant: Commissariat à l'Energie Atomique et aux Energies Alternatives ,  STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (GRENOBLE 2) SAS

Inventor： Yvon Cazaux ,  François Roy ,  Arnaud Laflaquiere ,  Marie Guillon

IPC: H01L27/146 ,  H01L27/148 ,  H01L27/12

CPC classification number: H01L27/14636 ,  H01L27/1203 ,  H01L27/14605 ,  H01L27/14614 ,  H01L27/1463

Abstract: An image sensor arranged inside and on top of a semi-conductor substrate having a front surface and a rear surface, the sensor including a plurality of pixels, each including: a photosensitive area, a reading area, and a storage area extending between the photosensitive area and the reading area; a vertical insulated electrode including an opening of transfer between the photosensitive area and the storage area; and at least one insulation element among the following: a) a layer of an insulating material extending under the surface of the photosensitive area and of the storage area and having its front surface in contact with the rear surface of the electrode; and b) an insulating wall extending vertically in the opening, or under the opening.

公开(公告)号：US20180033710A1

公开(公告)日：2018-02-01

申请号：US15728969

申请日：2017-10-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Luc Petit

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/17 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/81

Abstract: An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.