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公开(公告)号：USRE49732E1
公开(公告)日：2023-11-21
申请号：US16427228
申请日：2019-05-30
Applicant: ASML Netherlands B.V.
Inventor： Paul IJmert Scheffers , Jan Andries Meijer , Erwin Slot , Vincent Sylvester Kuiper , Niels Vergeer
CPC classification number: H01J37/3045 , B82Y10/00 , B82Y40/00 , G03F7/707 , H01J2237/1502
Abstract: A multi-beamlet charged particle beamlet lithography system for transferring a pattern to a surface of a substrate. The system comprises a projection system (311) for projecting a plurality of charged particle beamlets (7) onto the surface of the substrate; a chuck (313) moveable with respect to the projection system; a beamlet measurement sensor (i.a. i.e., 505, 511) for determining one or more characteristics of one or more of the charged particle beamlets, the beamlet measurement sensor having a surface (501) for receiving one or more of the charged particle beamlets; and a position mark measurement system for measuring a position of a position mark (610, 620, 635), the position mark measurement system comprising an alignment sensor (361, 362). The chuck comprises a substrate support portion for supporting the substrate, a beamlet measurement sensor portion (460) for accommodating the surface of the beamlet measurement sensor, and a position mark portion (470) for accommodating the position mark.
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公开(公告)号：US11822252B2
公开(公告)日：2023-11-21
申请号：US17155951
申请日：2021-01-22
Applicant: ASML NETHERLANDS B.V.
Inventor： Dzmitry Labetski , Christianus Wilhelmus Johannes Berendsen , Rui Miguel Duarte Rodreigues Nunes , Alexander Igorevich Ershov , Kornelis Frits Feenstra , Igor Vladimirovich Fomenkov , Klaus Martin Hummler , Arun Johnkadaksham , Matthias Kraushaar , Andrew David Laforge , Marc Guy Langlois , Maksim Loginov , Yue Ma , Seyedmohammad Mojab , Kerim Nadir , Alexander Shatalov , John Tom Stewart , Henricus Gerardus Tegenbosch , Chunguang Xia
CPC classification number: G03F7/70033 , G03F7/70916 , H05G2/003 , H05G2/008
Abstract: An extreme ultraviolet radiation (EUV) source, including: a vessel having an inner vessel wall and an intermediate focus (IF) region; an EUV collector disposed inside the vessel, the EUV collector including a reflective surface configured to reflect EUV radiation toward the intermediate focus region, the reflective surface configured to directionally face the IF region of the vessel; a showerhead disposed along at least a portion of the inner vessel wall, the showerhead including a plurality of nozzles configured to introduce gas into the vessel; and one or more exhausts configured to remove gas introduced into the vessel, the one or more exhausts being oriented along at least a portion of the inner vessel wall so that the gas is caused to flow away from the EUV collector.
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公开(公告)号：US11815402B2
公开(公告)日：2023-11-14
申请号：US17425646
申请日：2019-12-19
Applicant: ASML Netherlands B.V.
Inventor： Sietse Thijmen Van Der Post , Peter Danny Van Voorst
CPC classification number: G01J9/00 , G01N23/207 , G02B3/0037 , G02B5/1819 , G02B5/1838 , G03F7/70616 , G21K1/065 , G01J2009/002
Abstract: Disclosed is a wavefront sensor for measuring a tilt of a wavefront at an array of locations across a beam of radiation, wherein said wavefront sensor comprises a film, for example of Zirconium, having an indent array comprising an indent at each of said array of locations, such that each indent of the indent array is operable to perform focusing of said radiation. Also disclosed is a radiation source and inspection apparatus comprising such a wavefront sensor.
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公开(公告)号：US20230359127A1
公开(公告)日：2023-11-09
申请号：US18026115
申请日：2021-08-24
Applicant: ASML NETHERLANDS B.V. , ASML HOLDING N.V.
Inventor： Hans BUTLER , Arie Jeffrey DEN BOEF , Mark Constant Johannes BAGGEN , Jeroen Arnoldus Leonardus Johannes RAAYMAKERS , Richard Carl ZIMMERMAN
IPC: G03F7/00
CPC classification number: G03F7/70625 , G03F7/706835
Abstract: A metrology tool that includes a substrate table to hold a substrate; a projection system configured to project a beam on a target portion of the substrate; an actuator configured to adjust a position of the projection system relative to the substrate on the substrate table; a sensor configured to determine a position of the substrate table; and a one or more processors configured to: determine, based on the position of the substrate table, a position error of the substrate table with respect to a reference; and control, via the actuator, a position of the projection system to compensate for the position error of the substrate table so that the beam projects on the target portion of the substrate.
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165.发明授权公开(公告)号：US11804358B2
公开(公告)日：2023-10-31
申请号：US17493837
申请日：2021-10-04
Applicant: ASML Netherlands B.V.
CPC classification number: H01J37/20 , H01L21/67288 , H01J2237/2001 , H01J2237/2814
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.
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Patent Agency Ranking
166.发明授权公开(公告)号：US11803127B2
公开(公告)日：2023-10-31
申请号：US17295193
申请日：2019-11-04
Applicant: ASML NETHERLANDS B.V.
Inventor： Chenxi Lin , Cyrus Emil Tabery , Hakki Ergün Cekli , Simon Philip Spencer Hastings , Boris Menchtchikov , Yi Zou , Yana Cheng , Maxime Philippe Frederic Genin , Tzu-Chao Chen , Davit Harutyunyan , Youping Zhang
IPC: G03F7/00 , G05B13/02 , G05B19/418 , H01L21/66
CPC classification number: G03F7/705 , G05B13/027 , G05B19/41875 , H01L22/20 , G05B2219/32193 , G05B2219/32368 , G05B2219/45031
Abstract: A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.
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167.发明公开公开(公告)号：US20230335374A1
公开(公告)日：2023-10-19
申请号：US18019088
申请日：2021-07-27
Applicant: ASML Netherlands B.V.
Inventor： Benoit Herve GAURY , Jun JIANG , Bruno LA FONTAINE , Shakeeb Bin HASAN , Kenichi KANAI , Jasper Frans Mathijs VAN RENS , Cyrus Emil TABERY , Long MA , Oliver Desmond PATTERSON , Jian ZHANG , Chih-Yu JEN , Yixiang WANG
IPC: H01J37/26 , G01N23/2251 , H01J37/244 , H01J37/22
CPC classification number: H01J37/265 , G01N23/2251 , H01J37/244 , H01J37/228 , H01J2237/2482
Abstract: Systems and methods of observing a sample using a charged-particle beam apparatus in voltage contrast mode are disclosed. The charged-particle beam apparatus comprises a charged-particle source, an optical source, a charged-particle detector configured to detect charged particles, and a controller having circuitry configured to apply a first signal to cause the optical source to generate the optical pulse, apply a second signal to the charged-particle detector to detect the second plurality of charged particles, and adjust a time delay between the first and the second signals. In some embodiments, the controller having circuitry may be further configured to acquire a plurality of images of a structure, to determine an electrical characteristic of the structure based on the rate of gray level variation of the plurality of images of the structure, and to simulate, using a model, a physical characteristic of the structure based on the determined electrical characteristic.
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公开(公告)号：US20230324318A1
公开(公告)日：2023-10-12
申请号：US18327847
申请日：2023-06-01
Applicant: ASML Netherlands B.V.
Inventor： Yan REN , Erwin SLOT , Albertus Victor, Gerardus MANGNUS , Marijke SCOTUZZI , Erwin Paul SMAKMAN
IPC: G01N23/2251 , H01J37/244 , H01J37/09 , H01J37/12 , H01J37/147
CPC classification number: G01N23/2251 , H01J37/244 , H01J37/09 , H01J37/12 , H01J37/1472 , G01N2223/303 , H01J2237/2448 , H01J2237/0453 , H01J37/20
Abstract: A charged-particle tool configured to generate a plurality of sub-beams from a beam of charged particles and direct the sub-beams downbeam toward a sample position, the tool charged-particle tool comprising at least three charged-particle-optical components; a detector module; and a controller. Thea detector module is configured to generate a detection signal in response to charged particles that propagate upbeam from the direction of the sample position. The controller is configured to operate the tool in a calibration mode. The charged-particle-optical components include: a charged-particle source configured to emit a beam of charged particles and a beam generator configured to generate the sub-beams. The detection signal contains information about alignment of at least two of the charged-particle-optical components. The charged-particle optical components comprise two or more charged-particle optical elements comprising an array of apertures for which the charged particles may be monitored.
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公开(公告)号：US20230315027A1
公开(公告)日：2023-10-05
申请号：US18013154
申请日：2021-06-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Koos VAN BERKEL , Joost Johan BOLDER , Stijn BOSMA
CPC classification number: G05B13/027 , G03F7/706841 , G06N3/084
Abstract: Variable setpoints and/or other factors may limit iterative learning control for moving components of an apparatus. The present disclosure describes a processor configured to control movement of a component of an apparatus with at least one prescribed movement. The processor is configured to receive a control input such as and/or including a variable setpoint. The control input indicates the at least one prescribed movement for the component. The processor is configured to determine, with a trained artificial neural network, based on the control input, a feedforward output for the component. The artificial neural network is pretrained with a training data set such that the artificial neural network determines the output regardless of whether or not the control input falls outside the training data set. The processor controls the component based on at least the output.
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170.发明授权公开(公告)号：US11774671B2
公开(公告)日：2023-10-03
申请号：US17077756
申请日：2020-10-22
Applicant: ASML NETHERLANDS B.V.
Inventor： Patrick Sebastian Uebel , Peter Maximilian Götz , Sebastian Thomas Bauerschmidt , Coen Hubertus Matheus Baltis , Janneke Ravensbergen
CPC classification number: G02B6/02328 , C03B37/15 , G02B6/0096 , G02B6/02347 , G03F7/7085 , G03F9/7034 , G03F9/7065 , C03B2203/16 , C03B2203/42
Abstract: Optical components and methods of manufacture thereof. A first optical component has a hollow-core photonic crystal fiber includes internal capillaries for guiding radiation and an outer capillary sheathing the internal capillaries; and at least an output end section having a larger inner cross-sectional dimension over at least a portion of the output end section than an inner cross-sectional dimension of the outer capillary along a central portion of the hollow-core photonic crystal fiber prior to the output end section. A second optical component includes a hollow-core photonic crystal fiber and a sleeve arrangement.
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