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    Switching device for controlling large amount of current
    173.
    发明申请
    Switching device for controlling large amount of current 失效
    用于控制大电流的开关装置

    公开(公告)号：US20030206392A1

    公开(公告)日：2003-11-06

    申请号：US10396399

    申请日：2003-03-26

    Inventor： Hiroyuki Kawata

    IPC: H02B001/04

    CPC classification number: H05K1/0203 ,  B62D5/0406 ,  H05K7/1432 ,  H05K2201/10166 ,  H05K2201/10484 ,  H05K2201/1056

    Abstract: A switching device for controlling a large amount of current includes a circuit board carrying electronic components thereon, a power-switching element electrically connected to the circuit board, and a housing disposed underneath the circuit board and containing the power-switching element therein. The housing made of a heat-conductive material includes a heat-sink block having a sloped surface on which the power-switching element is mounted. Connecting leads extending from the power-switching element are positioned at an upper portion of the sloped surface which is close to the circuit board. In this manner, the length of connecting leads is shortened and heat and noises generated therein are suppressed.

    Abstract translation: 用于控制大量电流的开关装置包括在其上承载电子部件的电路板，电连接到电路板的电源开关元件以及设置在电路板下方并且在其中容纳电力开关元件的壳体。 由导热材料制成的壳体包括具有安装有功率开关元件的倾斜表面的散热块。 从电源开关元件延伸的连接引线位于靠近电路板的倾斜表面的上部。 以这种方式，连接引线的长度被缩短，并且抑制了其中产生的热和噪声。

    Board-to-board electrical coupling with conductive band
    174.
    发明申请
    Board-to-board electrical coupling with conductive band 审中-公开
    与导电带的板对板电耦合

    公开(公告)号：US20030193793A1

    公开(公告)日：2003-10-16

    申请号：US10426346

    申请日：2003-04-30

    Inventor： David Dent

    IPC: H01R012/16

    CPC classification number: H05K1/148 ,  H01R12/52 ,  H05K1/142 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2203/049

    Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive film, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

    Abstract translation: 第一印刷电路板具有接触区域，第二印刷电路板具有接触区域。 导电带将第一印刷电路板的接触区域耦合到第二印刷电路板的接触区域。 导电带可以选自基本上由焊料形成的带，由焊缝耦合的带，通过引线键耦合的带，包括导电膜的带和包括导电绳的带。 导电带可以将第一印刷电路板和第二印刷电路板耦合在基本共面的位置。

    BOARD-TO-BOARD ELECTRICAL COUPLING WITH CONDUCTIVE BAND
    175.
    发明申请
    BOARD-TO-BOARD ELECTRICAL COUPLING WITH CONDUCTIVE BAND 有权
    与导电带的板对电气耦合

    公开(公告)号：US20020012239A1

    公开(公告)日：2002-01-31

    申请号：US09409978

    申请日：1999-09-30

    Inventor： DAVID DENT

    IPC: H05K001/11 ,  H01R012/28

    CPC classification number: H05K1/148 ,  H01R12/52 ,  H05K1/142 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2203/049

    Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

    Abstract translation: 第一印刷电路板具有接触区域，第二印刷电路板具有接触区域。 导电带将第一印刷电路板的接触区域耦合到第二印刷电路板的接触区域。 导电带可以选自基本上由从焊料形成的带，由焊缝耦合的带，通过引线键耦合的带，包括导电粘合剂的带，包括导电膜的带，包括导电带的带 ，以及包括导电绳的带。 导电带可以将第一印刷电路板和第二印刷电路板耦合在基本共面的位置。

    High density board to board connector
    177.
    发明授权
    High density board to board connector 失效
    高密度板对板连接器

    公开(公告)号：US5895281A

    公开(公告)日：1999-04-20

    申请号：US918116

    申请日：1997-08-27

    Applicant: Richard Ellis Rothenberger

    Inventor： Richard Ellis Rothenberger

    IPC: H01R12/83 ,  H01R13/24 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R13/62

    CPC classification number: H01R12/83 ,  H05K1/141 ,  H01R13/24 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10734 ,  H05K3/3436 ,  H05K3/368

    Abstract: The invention is directed to an electrical connector comprising a housing having a plurality of contacts mounted therein to provide electrical connection from a daughter board to a circuit board. The contacts provide a linear array of first connection points to the circuit board. The circuit board converts the linear array of first connection points to an area array of second connection points and the area array of second connection points are connected to a mother board by way of a ball grid array. The housing provides an electrical connection between the daughter board and the mother board.

    Abstract translation: 本发明涉及一种电连接器，其包括具有安装在其中的多个触点的壳体，以提供从子板到电路板的电连接。 触点提供与电路板的第一连接点的线性阵列。 电路板将第一连接点的线性阵列转换成第二连接点的区域阵列，并且第二连接点的区域阵列通过球栅阵列连接到母板。 外壳提供子板和母板之间的电气连接。

    Photoelectric imaging device photosensor array alignment apparatus and method
    178.
    发明授权
    Photoelectric imaging device photosensor array alignment apparatus and method 失效
    光电成像装置光传感器阵列对准装置及方法

    公开(公告)号：US5753908A

    公开(公告)日：1998-05-19

    申请号：US780912

    申请日：1997-01-09

    Applicant: Michael L. Christensen

    Inventor： Michael L. Christensen

    IPC: H05K3/30 ,  H01J5/02

    CPC classification number: H05K3/306 ,  H05K2201/10121 ,  H05K2201/10409 ,  H05K2201/10484 ,  H05K2201/10689 ,  H05K2203/0182

    Abstract: An apparatus and method for achieving alignment of a photosensor array in an imaging device is disclosed. The photosensor array is mounted in an integrated circuit package having a plurality of downwardly extending leads. The leads are received in a plurality of sockets which are attached to and extend through the retina board. A pair of holes are provided extending through the retina board proximate the ends of the integrated circuit package. An actuator, such as a screw, is associated with each hole such that the actuator is able to contact the rear surface of the integrated circuit package. In this manner, one of the actuators may be used to apply a force to one end of the integrated circuit package in order to move that end away from the retina board and thus achieve alignment with the light beam. After the desired alignment has been achieved, some of the integrated circuit package leads may be soldered within their respective sockets in order to lock the integrated circuit package and photosensor array in place. Alternatively, some of the sockets may be omitted such that the corresponding integrated circuit package leads may be soldered directly to the retina board in order to lock the package in place.

    Abstract translation: 公开了一种用于实现成像装置中的光电传感器阵列的对准的装置和方法。 光传感器阵列安装在具有多个向下延伸引线的集成电路封装中。 引线被接收在多个插座中，这些插座连接到并延伸穿过视网膜板。 在靠近集成电路封装的端部延伸穿过视网膜板的一对孔被提供。 诸如螺钉的致动器与每个孔相关联，使得致动器能够接触集成电路封装的后表面。 以这种方式，致动器中的一个可以用于向集成电路封装的一端施加力，以将该端部移动离开视网膜板，从而实现与光束的对准。 在实现期望的对准之后，一些集成电路封装引线可以焊接在它们各自的插座内，以便将集成电路封装和光电传感器阵列锁定就位。 或者，可以省略一些插座，使得相应的集成电路封装引线可以直接焊接到视网膜板，以便将封装件锁定就位。

    Packages for stacked integrated circuit chip cubes
    180.
    发明授权
    Packages for stacked integrated circuit chip cubes 失效
    堆叠集成电路芯片立方体的封装

    公开(公告)号：US5343366A

    公开(公告)日：1994-08-30

    申请号：US903838

    申请日：1992-06-24

    Applicant: Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    Inventor： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R23/68

    CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092

    Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically inter-connecting a plurality of these cuboids. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cuboid structures.

    Abstract translation: 本发明涉及将集成电路芯片三维封装成堆栈以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在其至少一侧上具有电导体的第一基板的凸起从该侧延伸形成。 或者，销状结构可以由从第一基板的边缘的两侧悬臂的导体形成，并且其中来自两侧的相应导体对准并且间隔开第一基板厚度。 这些空间包含焊料并形成焊料加载的针状结构。 销状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些长方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与长方体结构的相对侧紧密接触。

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