公开(公告)号：US20060076156A1

公开(公告)日：2006-04-13

申请号：US11287813

申请日：2005-11-28

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： H01B3/44

CPC分类号： H01B11/12 ,  H01B7/30

摘要： An audio signal cable, the features of which are that the audio signal cable has arrayed solid and tinsel wire conductors. After each of the conductors are insulated and bundled, they are placed into a surrounding insulation. The solid conductors are of a circular and a flat, thin shape. The solid conductors are of differing larger and smaller diameters and, furthermore, disposed in unequal quantities.

公开(公告)号：US20060050508A1

公开(公告)日：2006-03-09

申请号：US10936474

申请日：2004-09-09

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： B60Q1/26

CPC分类号： F21V33/0056 ,  F21S4/20 ,  F21W2131/406

摘要： The present invention relates to a luminous A/V cable assembly. The luminous A/V cable assembly comprises an A/V transmission line and a power line, wherein a plurality of light bulbs is connected to the power line; the plurality of light bulbs is connected in series to define a light bulb group, or using in series and(or) in parallel or any combination of in series and in parallel connecting method; the A/V transmission cable and the power cable being connected to the plurality of light bulb groups are clad with a plastic material to constitute an A/V cable having an overall different colored luminous effect.

摘要翻译： 本发明涉及一种发光A / V电缆组件。 发光A / V电缆组件包括A / V传输线和电力线，其中多个灯泡连接到电力线; 多个灯泡串联连接以限定灯泡组，或并联或（或）并联或并联或并联连接方式的任何组合使用; 连接到多个灯泡组的A / V传输电缆和电力电缆用塑料材料包覆以构成具有总体不同的着色发光效果的A / V电缆。

公开(公告)号：US20050006115A1

公开(公告)日：2005-01-13

申请号：US10740496

申请日：2003-12-22

申请人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

发明人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

IPC分类号： B81B1/00 ,  F25D17/02 ,  F28D15/02 ,  H01L23/473 ,  H05K1/02 ,  H05K7/20 ,  H01B7/42

CPC分类号： H01L23/473 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F2210/02 ,  H01L2924/0002 ,  H05K1/0272 ,  H01L2924/00

摘要： A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

摘要翻译： 散热微型装置包括板，流体微系统和冷却剂。 板包括具有第一表面和第二表面的绝缘体层，形成在第一表面上的导体层和设置在第二表面上的盖构件。 流体微系统形成在板的绝缘体层中，并且包括第一和第二微通道结构以及允许第一和第二微通道结构之间的流体连通的第一和第二微管结构。 冷却剂被包含在流体微系统中，并且通过第一微通道结构从第二微通道结构流动到第一微通道结构，并且从第一微通道结构返回到第二微通道结构 第二个微管道结构。

公开(公告)号：US06403896B1

公开(公告)日：2002-06-11

申请号：US09670352

申请日：2000-09-27

申请人： Shu Jung Ma ,  Chi Tsung Chiu ,  Chang Chi Lee

发明人： Shu Jung Ma ,  Chi Tsung Chiu ,  Chang Chi Lee

IPC分类号： H05K111

CPC分类号： H01L23/49838 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate for use in packaging of a semiconductor chip having opposing upper and lower surfaces has a lower surface which comprises an outer array of contact pads, a center array of contact pads and a plurality of intermediate pads located between the outer array of contact pads and the center array of contact pads. All of the intermediate pads are electrically connected to the ground ring.

摘要翻译： 用于封装具有相对的上表面和下表面的半导体芯片的衬底具有下表面，其包括接触焊盘的外部阵列，接触焊盘的中心阵列和位于外部接触焊盘阵列之间的多个中间焊盘，以及 接触垫的中心阵列。 所有中间焊盘都与接地环电连接。

公开(公告)号：US20120074532A1

公开(公告)日：2012-03-29

申请号：US13084879

申请日：2011-04-12

申请人： MENG-KAI SHIH ,  CHANG-CHI LEE

发明人： MENG-KAI SHIH ,  CHANG-CHI LEE

IPC分类号： H01L23/58 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L23/3171 ,  H01L21/563 ,  H01L23/49894 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13027 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/14104 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： A semiconductor package includes a substrate and a semiconductor device. The semiconductor device includes a body having a center, a layer disposed adjacent to the body, and a plurality of conductive pillars configured to electrically connect the semiconductor device to the substrate. The layer defines a plurality of openings. Each of the plurality of conductive pillars extends at least partially through a corresponding one of the plurality of openings. An offset between a first central axis of the each of the plurality of conductive pillars and a second central axis of the corresponding one of the plurality of openings varies with distance between the first central axis and the center of the body. The second central axis of the corresponding one of the plurality of openings is disposed between the first central axis of the each of the plurality of conductive pillars and the center of the body.

摘要翻译： 半导体封装包括衬底和半导体器件。 半导体器件包括具有中心的主体，邻近本体设置的层以及被配置为将半导体器件电连接到衬底的多个导电柱。 该层限定多个开口。 多个导电柱中的每一个至少部分地延伸穿过多个开口中的对应的一个。 多个导电柱中的每一个的第一中心轴线和多个开口中的相应一个开口的第二中心轴线之间的偏移随第一中心轴线和主体中心之间的距离而变化。 多个开口中的相应一个开口的第二中心轴设置在多个导电柱中的每一个的第一中心轴线和主体的中心之间。

公开(公告)号：US08035213B2

公开(公告)日：2011-10-11

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L23/12 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US08022534B2

公开(公告)日：2011-09-20

申请号：US12408118

申请日：2009-03-20

申请人： Tong Hong Wang ,  Chang Chi Lee

发明人： Tong Hong Wang ,  Chang Chi Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/49833 ,  H01L23/3675 ,  H01L23/38 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a carrier, a chip, a stiffener, a heat spreader and an active type heat-spreading element. The chip and the stiffener are disposed on the carrier. The heat spreader is disposed on the stiffener and includes a through opening. The active type heat-spreading element is disposed on the chip and located in the through opening.

摘要翻译： 半导体封装包括载体，芯片，加强件，散热器和有源热扩散元件。 芯片和加强件设置在载体上。 散热器设置在加强件上并且包括通孔。 主动式散热元件设置在芯片上并位于通孔中。

公开(公告)号：US20090102066A1

公开(公告)日：2009-04-23

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了一种芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US20080222988A1

公开(公告)日：2008-09-18

申请号：US11931980

申请日：2007-10-31

申请人： CHANG CHI LEE

发明人： CHANG CHI LEE

IPC分类号： E04D13/18

CPC分类号： H02S30/10 ,  F24S25/20 ,  F24S2080/09 ,  Y02E10/47

摘要： An integrated fixing frame for a solar energy module includes a frame body having a plurality of assembling frames which comprise a first sideboard, a second sideboard and an inner board. Wherein a curving rib is installed in between the first sideboard and second sideboard, and a locking chute is defined in between the second sideboard and the inner board. Relying upon the curving rib stated above, the assembling frame is able to resist the external forces efficiently, as well as the locking chute of the assembling frame which enables the solar panel to be fixed more stably, so that the fixing stability and the high external forces resistance can be achieved.

摘要翻译： 一种用于太阳能模块的集成固定框架包括具有多个组装框架的框架体，所述组装框架包括第一侧板，第二侧板和内板。 其中弯曲肋安装在第一侧板和第二侧板之间，并且锁定滑槽限定在第二侧板和内板之间。 依靠上述弯曲肋，组装框架能够有效地抵抗外力以及组装框架的锁定滑槽，使得太阳能面板能够更稳定地固定，使得固定稳定性和高外部尺寸 可以实现力的阻力。

公开(公告)号：US07091420B2

公开(公告)日：2006-08-15

申请号：US11287813

申请日：2005-11-28

申请人： Chang-Chi Lee ,  Jay Victor

发明人： Chang-Chi Lee ,  Jay Victor

IPC分类号： H01B7/00

CPC分类号： H01B11/12 ,  H01B7/30

摘要： An audio signal cable, the features of which are that the audio signal cable has arrayed solid and tinsel wire conductors. After each of the conductors are insulated and bundled, they are placed into a surrounding insulation. The solid conductors are of a circular and a flat, thin shape. The solid conductors are of differing larger and smaller diameters and, furthermore, disposed in unequal quantities.