Light emitting device having vertical structure and method for manufacturing the same
    12.
    发明申请
    Light emitting device having vertical structure and method for manufacturing the same 有权
    具有垂直结构的发光器件及其制造方法

    公开(公告)号:US20080142809A1

    公开(公告)日:2008-06-19

    申请号:US11702679

    申请日:2007-02-06

    IPC分类号: H01L33/00

    摘要: A light emitting device having a vertical structure and a method for manufacturing the same, which are capable of damping impact generated during a substrate separation process and achieving an improvement in mass productivity, are disclosed. The light emitting device includes a semiconductor layer having a multilayer structure, a first electrode arranged at one surface of the semiconductor layer, a metal support arranged on the first electrode, and an impact damping layer arranged between the first electrode and the metal support, and made of a metal having a ductility higher than a ductility of a metal for the metal support.

    摘要翻译: 公开了具有垂直结构的发光器件及其制造方法,其能够抑制在衬底分离过程中产生的冲击并实现批量生产率的提高。 发光器件包括具有多层结构的半导体层,布置在半导体层的一个表面的第一电极,布置在第一电极上的金属支撑体和布置在第一电极和金属支撑体之间的冲击阻尼层,以及 由具有高于用于金属支撑件的金属的延展性的延展性的金属制成。

    Semiconductor light emitting device and fabrication method thereof
    15.
    发明授权
    Semiconductor light emitting device and fabrication method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US07109048B2

    公开(公告)日:2006-09-19

    申请号:US10950470

    申请日:2004-09-28

    IPC分类号: H01L21/00

    CPC分类号: H01L33/42 H01L33/387

    摘要: A semiconductor light emitting device and a fabrication method thereof includes: providing a substrate; forming an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer on the substrate; forming a first transparent electrode having holes per a certain region on the p-type semiconductor layer; and forming a first pad on the first transparent electrode.

    摘要翻译: 一种半导体发光器件及其制造方法,包括:提供衬底; 在基板上形成n型半导体层,发光层,p型半导体层; 在p型半导体层上形成每一个区域上具有孔的第一透明电极; 以及在所述第一透明电极上形成第一焊盘。

    Laser diode and method for fabricating the same
    16.
    发明授权
    Laser diode and method for fabricating the same 有权
    激光二极管及其制造方法

    公开(公告)号:US06395573B1

    公开(公告)日:2002-05-28

    申请号:US09626800

    申请日:2000-07-26

    IPC分类号: H01L2100

    摘要: Provided with a laser diode and its fabricating method including the steps of: sequentially forming a first conductivity type clad layer, an active layer, a second conductivity type first clad layer, an etch stop layer, a second conductivity type second clad layer, a second conductivity type InGaP layer, and a second conductivity type GaAs layer, on a first conductivity type substrate; forming an insulating layer on the second conductivity type GaAs layer and patterning it, exposing a defined region of the second conductivity type GaAs layer; performing a reactive ion etching using the patterned insulating layer as a mask, etching the second conductivity type GaAs layer, the second conductivity type InGaP layer, and the second conductivity type second clad layer to a specified depth and remaining part of the second conductivity type second clad layer; forming a photoresist on the whole surface including the insulating layer and patterning it, exposing the residual second conductivity type second clad layer; performing a wet etching using the patterned photoresist as a mask to etch the second conductivity type second clad layer, exposing the etch stop layer and etching the residual photoresist and insulating layer; forming a current blocking layer on the exposed etch stop layer, and a second conductivity type contact layer on the whole surface including the current blocking layer; and forming electrodes on the second conductivity type contact layer and beneath the substrate, respectively.

    摘要翻译: 提供一种激光二极管及其制造方法,包括以下步骤:顺序形成第一导电型覆盖层,有源层,第二导电型第一覆盖层,蚀刻停止层,第二导电型第二覆盖层,第二导电型 导电型InGaP层和第二导电型GaAs层,在第一导电型基板上; 在所述第二导电型GaAs层上形成绝缘层并对其进行构图,暴露所述第二导电类型GaAs层的限定区域; 使用图案化绝缘层作为掩模进行反应离子蚀刻,将第二导电型GaAs层,第二导电型InGaP层和第二导电型第二覆盖层蚀刻到指定深度并将第二导电类型第二次的剩余部分 包层 在包括绝缘层的整个表面上形成光致抗蚀剂并对其进行图案化,暴露残留的第二导电类型的第二覆盖层; 使用图案化的光致抗蚀剂作为掩模进行湿蚀刻以蚀刻第二导电类型的第二包层,暴露蚀刻停止层并蚀刻残留的光致抗蚀剂和绝缘层; 在暴露的蚀刻停止层上形成电流阻挡层,在包括电流阻挡层的整个表面上形成第二导电型接触层; 以及在第二导电型接触层上和在基底之下分别形成电极。

    Device and method for machining transparent medium by laser
    17.
    发明授权
    Device and method for machining transparent medium by laser 失效
    通过激光加工透明介质的装置和方法

    公开(公告)号:US6130401A

    公开(公告)日:2000-10-10

    申请号:US358768

    申请日:1999-07-22

    摘要: Transparent media having high hardness and poor light absorption is cut or scribed with characters or figures by a laser beam. The method includes forming a support of a medium which is a good absorber of a laser beam, and placing the transparent medium on the support, and focusing the laser beam onto the support through the transparent medium while the transparent medium and the laser beam are moved relative to each other. A flame is generated between the support and the transparent medium to machine the transport medium, allowing it to be cut or scribed with characters or figures.

    摘要翻译: 通过激光束切割或刻划具有高硬度和差的光吸收性的透明介质。 该方法包括形成作为激光束的良好吸收体的介质的支撑体,并且将透明介质放置在支撑体上,并且通过透明介质将激光束聚焦到支撑体上,同时使透明介质和激光束移动 相对于彼此。 在支撑件和透明介质之间产生火焰以加工输送介质,允许其用字符或图形切割或刻划。