公开(公告)号：US20050239300A1

公开(公告)日：2005-10-27

申请号：US11055579

申请日：2005-02-09

Applicant: Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

IPC: H01R12/00 ,  H01R12/16

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US20050189640A1

公开(公告)日：2005-09-01

申请号：US11055578

申请日：2005-02-09

Applicant: Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

IPC: H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US07014472B2

公开(公告)日：2006-03-21

申请号：US10756924

申请日：2004-01-13

Applicant: Joseph C. Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

Inventor： Joseph C. Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K7/1431 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/716 ,  H01R12/721 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/1053 ,  H05K2201/10734

Abstract: A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

Abstract translation: 设备模块可以用于承载诸如存储设备或其他组件的多个设备。 设备模块可以包括板，第一组接触点和第二组接触点。 多个信号路径可以设置在板上，其中每个信号路径在第一组中的接触点和第二组中的接触点之间延伸。 多个信号路径中的每一个在板上具有基本上相同的长度和相同的匝数。

公开(公告)号：US20060034061A1

公开(公告)日：2006-02-16

申请号：US11097450

申请日：2005-04-01

Applicant: Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

IPC: H01R12/16

CPC classification number: H01R12/52 ,  H01R12/7011 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/716 ,  H01R12/721 ,  H01R13/24 ,  H01R31/06 ,  H05K1/0237 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K7/1441 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

公开(公告)号：US20050093127A1

公开(公告)日：2005-05-05

申请号：US10947686

申请日：2004-09-23

Applicant: Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy

Inventor： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy

IPC: H01L20060101 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L24/85 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/32245

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Abstract translation: 具有多个表面的IC封装，用于与互连元件互连，从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子，并且与空间上分离的其它器件或组件互连。

公开(公告)号：US20050014395A1

公开(公告)日：2005-01-20

申请号：US10756924

申请日：2004-01-13

Applicant: Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

Inventor： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Gary Yasumura

IPC: H01R12/16 ,  H01R12/18 ,  H05K1/14 ,  H05K3/22 ,  H05K7/14 ,  H01R12/00

CPC classification number: H05K7/1431 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/716 ,  H01R12/721 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/1053 ,  H05K2201/10734

Abstract: A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

Abstract translation: 设备模块可以用于承载诸如存储设备或其他组件的多个设备。 设备模块可以包括板，第一组接触点和第二组接触点。 多个信号路径可以设置在板上，其中每个信号路径在第一组中的接触点和第二组中的接触点之间延伸。 多个信号路径中的每一个在板上具有基本上相同的长度和相同的匝数。