公开(公告)号：US08742556B2

公开(公告)日：2014-06-03

申请号：US13349993

申请日：2012-01-13

Applicant: Takuya Kadoguchi ,  Tomomi Okumura ,  Tatsuya Miyoshi

Inventor： Takuya Kadoguchi ,  Tomomi Okumura ,  Tatsuya Miyoshi

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L23/3142 ,  H01L23/473 ,  H01L23/492 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3656 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area.

Abstract translation: 半导体模块包括：金属块; 半导体器件，其通过焊料层安装在所述金属块的表面上的半导体器件安装区域中; 以及通过在所述金属块和所述半导体器件上模制树脂而形成的模制部分; 其中金属块的表面包括电镀区域和粗糙区域，并且半导体器件安装区域设置在电镀区域中。

公开(公告)号：US20120181679A1

公开(公告)日：2012-07-19

申请号：US13349993

申请日：2012-01-13

Applicant: Takuya KADOGUCHI ,  Tomomi OKUMURA ,  Tatsuya MIYOSHI

Inventor： Takuya KADOGUCHI ,  Tomomi OKUMURA ,  Tatsuya MIYOSHI

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/4334 ,  H01L23/3142 ,  H01L23/473 ,  H01L23/492 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3656 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area.

Abstract translation: 半导体模块包括：金属块; 半导体器件，其通过焊料层安装在所述金属块的表面上的半导体器件安装区域中; 以及通过在所述金属块和所述半导体器件上模制树脂而形成的模制部分; 其中金属块的表面包括电镀区域和粗糙区域，并且半导体器件安装区域设置在电镀区域中。

公开(公告)号：US07517591B2

公开(公告)日：2009-04-14

申请号：US10559641

申请日：2004-06-14

Applicant: Tatsuya Miyoshi ,  Kenichi Sasaki ,  Naoto Yoshimi ,  Akira Matsuzaki ,  Kazuhisa Okai ,  Takao Ooshima ,  Takashi Nakano ,  Masahiro Murata ,  Syoichi Tanaka

Inventor： Tatsuya Miyoshi ,  Kenichi Sasaki ,  Naoto Yoshimi ,  Akira Matsuzaki ,  Kazuhisa Okai ,  Takao Ooshima ,  Takashi Nakano ,  Masahiro Murata ,  Syoichi Tanaka

IPC: B32B15/092 ,  C09D163/00

CPC classification number: C23C28/00 ,  C09D163/00 ,  C23C2/26 ,  C23C2222/20 ,  Y02T50/67 ,  Y10T428/12569 ,  Y10T428/12757 ,  Y10T428/12799 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/31529 ,  Y10T428/31551 ,  Y10T428/31612 ,  Y10T428/31678 ,  C08L2666/54

Abstract: The surface-treated steel sheet has a zinc-based plated steel sheet, a surface-treatment coating being formed on the surface of the zinc-based steel sheet by applying and drying a surface treatment coating composition thereon, and a top coating being formed by applying and drying a coating composition for top coating on the surface-treatment coating. The surface treatment coating composition contains a water-epoxy resin dispersion, a silane coupling agent, and phosphoric acid and/or a hexafluorometal acid. The coating composition for top coating contains a high molecular weight epoxy group-containing resin having number average molecular weights ranging from 6000 to 20000.

Abstract translation: 经表面处理的钢板具有锌基电镀钢板，通过在其上施加和干燥表面处理涂料组合物，在锌基钢板的表面上形成表面处理涂层，顶涂层由 涂覆和干燥表面处理涂层上的顶涂层用涂料组合物。 表面处理涂料组合物含有水环氧树脂分散体，硅烷偶联剂，磷酸和/或六氟金属酸。 用于顶涂层的涂料组合物含有数均分子量为6000至20000的高分子量环氧基树脂。

公开(公告)号：US07323225B2

公开(公告)日：2008-01-29

申请号：US10651062

申请日：2003-08-29

Applicant: Daigo Aoki ,  Masato Okabe ,  Hironori Kobayashi ,  Manabu Yamamoto ,  Tatsuya Miyoshi ,  Koji Arai ,  Hiroshi Kishimoto

Inventor： Daigo Aoki ,  Masato Okabe ,  Hironori Kobayashi ,  Manabu Yamamoto ,  Tatsuya Miyoshi ,  Koji Arai ,  Hiroshi Kishimoto

IPC: B32B9/04 ,  H01J1/62

CPC classification number: H01L51/0014 ,  H01L27/3239 ,  H01L27/3241 ,  H01L27/3281 ,  H01L51/0003 ,  H01L51/0023 ,  H01L51/56

Abstract: An EL device comprising a first electrode, an EL layer formed on the first electrode, and a second electrode formed on the EL layer, wherein at least one layer of a material whose wettability changes when light is applied thereto is formed. The invention provides EL devices that can be simply produced, and processes for producing the same.

Abstract translation: 一种EL器件，包括第一电极，形成在第一电极上的EL层和形成在EL层上的第二电极，其中至少一层当其上施加光时润湿性改变的材料层。 本发明提供了可简单制造的EL器件及其制造方法。

公开(公告)号：US10100381B2

公开(公告)日：2018-10-16

申请号：US14123872

申请日：2012-05-23

Applicant: Tatsuya Miyoshi ,  Seiji Nakajima ,  Hiroki Nakamaru

Inventor： Tatsuya Miyoshi ,  Seiji Nakajima ,  Hiroki Nakamaru

IPC: C21D8/02 ,  B32B15/00 ,  C23C28/00 ,  B32B15/04 ,  C23C28/02 ,  B32B15/01 ,  C22C18/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/28 ,  C22C38/32 ,  C22C38/60 ,  C25D5/36 ,  C25D5/50 ,  C25D7/06 ,  C21D1/673 ,  C25D3/56

Abstract: A hot-pressing steel sheet has excellent oxidation resistance to be capable of suppressing the formation of scales and ZnO during hot pressing as well as is excellent in cold pressing properties. A process of manufacturing a hot pressed member uses the steel sheet. The hot-pressing steel sheet includes a coating layer containing 10 to 25 mass % of Ni and a balance of Zn and inevitable impurities and having a mass per unit area of 10 to 90 g/m2, and a lubricating layer containing a solid lubricant, in the order named on the surface of a steel sheet.

公开(公告)号：US20120321903A1

公开(公告)日：2012-12-20

申请号：US13504755

申请日：2010-10-28

Applicant: Hiroki Nakamaru ,  Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroyuki Masuoka ,  Shinji Ootsuka

Inventor： Hiroki Nakamaru ,  Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroyuki Masuoka ,  Shinji Ootsuka

IPC: B32B15/04 ,  B21D31/00 ,  B32B9/00

CPC classification number: C21D8/0247 ,  B32B15/01 ,  B32B15/013 ,  B32B15/015 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  C21D1/673 ,  C21D8/0457 ,  C21D2251/02 ,  C22C18/00 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/14 ,  C22C38/18 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  C22C38/38 ,  C22C38/60 ,  C23C2/06 ,  C23C2/26 ,  C23C2/28 ,  C23C10/28 ,  C23C10/60 ,  C23C26/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/325 ,  C23C28/345 ,  C23C30/005 ,  C25D3/565 ,  C25D5/48 ,  C25D5/50 ,  Y10T428/12486 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12674 ,  Y10T428/12757 ,  Y10T428/12792 ,  Y10T428/12799 ,  Y10T428/12806 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/264 ,  Y10T428/265

Abstract: A hot-pressed member includes a steel sheet, a Ni-diffusion region present in a surface layer of the steel sheet, and an intermetallic compound layer and a ZnO layer which are provided in order on the Ni-diffusion region, the intermetallic compound layer corresponding to a γ phase present in a phase equilibrium diagram of a Zn—Ni alloy, wherein a spontaneous immersion potential indicated in a 0.5 M NaCl aqueous air-saturated solution at 25° C.±5° C. is −600 to −360 mV based on a standard hydrogen electrode.

Abstract translation: 热压部件包括钢板，存在于钢板的表层中的Ni扩散区域和在Ni扩散区域上依次设置的金属间化合物层和ZnO层，金属间化合物层 对应于存在于Zn-Ni合金的相平衡图中的γ相，其中在25℃±5℃下在0.5M NaCl饱和空气饱和溶液中指示的自发浸渍电位为-600至-360 基于标准氢电极的mV。

公开(公告)号：US20080070018A1

公开(公告)日：2008-03-20

申请号：US11977868

申请日：2007-10-26

Applicant: Tatsuya Miyoshi ,  Kenichi Sasaki ,  Naoto Yoshimi ,  Akira Matsuzaki ,  Kazuhisa Okai ,  Takao Ooshima ,  Takashi Nakano ,  Masahiro Murata ,  Syoichi Tanaka

Inventor： Tatsuya Miyoshi ,  Kenichi Sasaki ,  Naoto Yoshimi ,  Akira Matsuzaki ,  Kazuhisa Okai ,  Takao Ooshima ,  Takashi Nakano ,  Masahiro Murata ,  Syoichi Tanaka

IPC: B32B7/02 ,  B05D3/02

CPC classification number: C23C28/00 ,  C09D163/00 ,  C23C2/26 ,  C23C2222/20 ,  Y02T50/67 ,  Y10T428/12569 ,  Y10T428/12757 ,  Y10T428/12799 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/31529 ,  Y10T428/31551 ,  Y10T428/31612 ,  Y10T428/31678 ,  C08L2666/54

Abstract: A surface-treated steel sheet has a zinc-based or an aluminum-based plated steel sheet, a surface-treatment coating being formed on the surface of the zinc-based or aluminum-based steel sheet by applying and drying a surface treatment coating composition thereon, and a top coating being formed by applying and drying a coating composition for top coating on the surface-treatment coating. The surface treatment coating composition contains a water-epoxy resin dispersion, a water dispersed polyurethane resin, a silane coupling agent, and phosphoric acid and/or a hexafluorometal acid. The coating composition for a top coating contains a high molecular weight epoxy group-containing resin average molecular weight of 6,000 to 20,000.

Abstract translation: 表面处理钢板具有锌基或铝系电镀钢板，通过将表面处理用涂料组合物进行涂布，干燥，在锌系或铝系钢板的表面形成表面处理用涂料 并且通过施加和干燥表面处理涂层上的顶涂层用涂料组合物形成顶涂层。 表面处理涂料组合物含有水环氧树脂分散体，水分散聚氨酯树脂，硅烷偶联剂，磷酸和/或六氟金属酸。 用于顶涂层的涂料组合物含有高分子量环氧基的树脂平均分子量为6000至20,000。

公开(公告)号：US09321246B2

公开(公告)日：2016-04-26

申请号：US13824772

申请日：2011-09-27

Applicant: Katsuya Hoshino ,  Shinji Ootsuka ,  Takayoshi Yano ,  Tatsuya Miyoshi

Inventor： Katsuya Hoshino ,  Shinji Ootsuka ,  Takayoshi Yano ,  Tatsuya Miyoshi

IPC: B32B15/06 ,  B32B15/18 ,  C10M169/04 ,  C08G18/64 ,  C08G18/80 ,  C09D175/04 ,  C09D175/06 ,  C10M111/04 ,  B05D1/28

CPC classification number: B32B15/06 ,  B05D1/28 ,  B05D2202/10 ,  B32B15/18 ,  C08G18/643 ,  C08G18/8061 ,  C09D175/04 ,  C09D175/06 ,  C10M111/04 ,  C10M169/04 ,  C10M2201/062 ,  C10M2201/0623 ,  C10M2201/081 ,  C10M2201/082 ,  C10M2201/084 ,  C10M2201/1023 ,  C10M2207/122 ,  C10M2207/1233 ,  C10M2207/1273 ,  C10M2207/141 ,  C10M2207/1423 ,  C10M2209/0845 ,  C10M2209/1023 ,  C10M2209/1033 ,  C10M2217/0453 ,  C10M2219/042 ,  C10M2229/02 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2210/05 ,  C10N2210/06 ,  C10N2210/08 ,  C10N2230/06 ,  C10N2240/402 ,  C10N2240/405 ,  C10N2240/408 ,  C10N2240/58 ,  C10N2250/121 ,  C10N2280/00 ,  Y10T428/265 ,  C08L61/20

Abstract: In order to obtain a cold rolled steel sheet having excellent press formability, a cold rolled steel sheet has, on a surface thereof, an organic-inorganic composite film containing: an organic resin; and a crystalline layered material. The organic-inorganic composite film has an average film thickness of 0.10 to 2.0 μm and contains 0.5 part or more by weight of the crystalline layered material as a solid with respect to 100 parts by weight of a solid of the organic resin. The crystalline layered material preferably is, for example, a layered double hydroxide represented by [M2+1-xM3+x(OH)2][An−]x/n.zH2O, where: M2+ is one or more of Mg2+, Ca2+, Fe2+, Ni2+, and Zn2+; M3+ is one or more of Al3+, Fe3+, and Cr3+; and An− is one or more of OH−, CO32−, Cl−, and (SO4)2−.

Abstract translation: 为了获得具有优异的压制成形性的冷轧钢板，其表面上具有含有有机树脂的有机 - 无机复合膜; 和结晶层状材料。 有机无机复合膜的平均膜厚为0.10〜2.0μm，相对于100重量份的有机树脂的固体，含有0.5重量份以上的结晶层状材料为固体。 结晶层状材料优选为例如由[M2 + 1-xM3 + x（OH）2] [An-] x / n.zH2O表示的层状双氢氧化物，其中：M2 +为Mg2 +，Ca2 + ，Fe2 +，Ni2 +和Zn2 +; M3 +是Al3 +，Fe3 +和Cr3 +中的一种或多种; 和 - 是OH-，CO32-，Cl-和（SO4）2-中的一种或多种。

公开(公告)号：US09059145B2

公开(公告)日：2015-06-16

申请号：US13590707

申请日：2012-08-21

Applicant: Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

Inventor： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC: H05K7/20 ,  H01L23/433 ,  H01L23/051 ,  H01L25/07 ,  H01L23/473 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/051 ,  H01L23/3107 ,  H01L25/071 ,  H01L2224/33 ,  H01L2924/0002 ,  H01L2924/181 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.

Abstract translation: 公开了一种功率模块，其包括半导体元件，第一冷却构件和被配置为将半导体元件夹在其间的第二冷却构件，构造成将半导体元件支撑在第一冷却构件和第二冷却构件之间的框架构件和模制树脂 设置在第一冷却构件和第二冷却构件之间，其中框架构件包括调节构件，其调节第一冷却构件和第二冷却构件之间的距离。

公开(公告)号：US08810026B2

公开(公告)日：2014-08-19

申请号：US13819221

申请日：2010-09-02

Applicant: Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

Inventor： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract translation: 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。