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    SUBSTRATE SUPPORTS, SEMICONDUCTOR PROCESSING SYSTEMS, AND MATERIAL LAYER DEPOSITION METHODS
    11.
    发明公开
    SUBSTRATE SUPPORTS, SEMICONDUCTOR PROCESSING SYSTEMS, AND MATERIAL LAYER DEPOSITION METHODS 审中-公开

    公开(公告)号：US20230386874A1

    公开(公告)日：2023-11-30

    申请号：US18324411

    申请日：2023-05-26

    Applicant: ASM IP Holding, B.V.

    Inventor： Shujin Huang ,  Junwei Su ,  Wentao Wang ,  Xing Lin

    IPC: H01L21/673 ,  H01L21/687 ,  H01L21/02 ,  H01L21/3213

    CPC classification number: H01L21/67316 ,  H01L21/68742 ,  H01L21/02293 ,  H01L21/3213

    Abstract: A substrate support includes a disc body with upper and lower surfaces spaced apart by a thickness. The upper surface has a circular concavity extending about a rotation axis, an annular ledge portion radially outward of the concavity extending circumferentially about the concavity, and an annular rim portion radially outward of the ledge portion extending circumferentially about the ledge portion. The concavity has a circular perforated portion and an annular unperforated portion. The perforated portion extends about the rotation axis and defines two or more perforations to issue an etchant into a cavity defined between the concavity and a backside of a substrate seated on the substrate support. The unperforated portion is radially outward of the perforated portion and extends circumferentially about the perforated portion to limit etching of the backside of the substrate by the etchant. Semiconductor processing systems and material layer deposition methods are also described.

    Combined susceptor, support, and lift system
    15.
    外观设计
    Combined susceptor, support, and lift system 有权

    公开(公告)号：USD1031676S1

    公开(公告)日：2024-06-18

    申请号：US29760951

    申请日：2020-12-04

    Applicant: ASM IP HOLDING B.V.

    Designer： Peipei Gao ,  Wentao Wang ,  Xing Lin ,  Han Ye ,  Ion Hong Chao ,  Siyao Luan ,  Alexandros Demos ,  Fan Gao

    Abstract: FIG. 1 is a front perspective view of a combined susceptor, support, and lift system;
    FIG. 2 is a back perspective view thereof;
    FIG. 3 is a side view thereof;
    FIG. 4 is a cross-sectional view taken along line 4-4 as indicated in FIG. 3;
    FIG. 5 is an enlarged view of FIG. 4 shown without broken line environmental subject matter for clarity of the claimed subject matter;
    FIG. 6 is a top perspective view of the lift pin thereof;
    FIG. 7 is a bottom perspective view of the lift pin thereof;
    FIG. 8 is a front view of the lift pin thereof;
    FIG. 9 is a back view of the lift pin thereof;
    FIG. 10 is a left view of the lift pin thereof;
    FIG. 11 is a right view of the lift pin thereof;
    FIG. 12 is a top view of the lift pin thereof; and,
    FIG. 13 is a bottom view of the lift pin thereof.
    The dash-dash broken lines within the shaded area and the dash-dash broken lines in FIGS. 1-13 depicting various components of the susceptor, support, and lift system are for the purpose of illustrating environmental subject matter and portions of the article that form no part of the claimed design. The dot-dash broken line in FIG. 3 is for the purpose of defining the cross-sectional view shown in FIG. 4.

    SUBSTRATE SUPPORTS FOR SEMICONDUCTOR PROCESSING SYSTEMS
    17.
    发明申请
    SUBSTRATE SUPPORTS FOR SEMICONDUCTOR PROCESSING SYSTEMS 有权

    公开(公告)号：US20230128390A1

    公开(公告)日：2023-04-27

    申请号：US18048099

    申请日：2022-10-20

    Applicant: ASM IP Holding, B.V.

    Inventor： Shujin Huang ,  Junweli Su ,  Wentao Wang ,  Zhizhong Chen ,  Xing Lin ,  Jiwen Xiang

    IPC: H01L21/687

    Abstract: A substrate support includes a disc body with an upper surface and an opposite lower surface arranged along a rotation axis. The upper surface has a circular concave portion extending about the rotation axis, an annular ledge portion extending circumferentially about the concave portion, and an annular rim portion extending circumferentially about the ledge portion connecting to the concave portion of the disc body by the ledge portion of the disc body. The ledge portion slopes downward radially outward from the rotation axis to seat a substrate on the disc body such that a beveled edge of the substrate is cantilevered above the ledge portion of the upper surface of the disc body. Substrate support assemblies, semiconductor processing systems, and film deposition methods are also described.

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