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    Systems and methods for transfer of micro-devices
    11.
    发明授权
    Systems and methods for transfer of micro-devices 有权

    公开(公告)号：US10032827B2

    公开(公告)日：2018-07-24

    申请号：US15270763

    申请日：2016-09-20

    Applicant: Applied Materials, Inc.

    Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

    IPC: H01L21/677 ,  H01L21/683 ,  H01L27/15 ,  H01L33/48 ,  H01L23/00 ,  H01L21/66

    Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

    PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM
    14.
    发明公开
    PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM 审中-公开

    公开(公告)号：US20240096854A1

    公开(公告)日：2024-03-21

    申请号：US18244466

    申请日：2023-09-11

    Applicant: Applied Materials, Inc.

    Inventor： Zhiyong Li ,  Sivapackia Ganapathiappan ,  Kulandaivelu Sivanandan ,  Hao Yu ,  Hou T. Ng ,  Nag Patibandla ,  Mingwei Zhu ,  Lisong Xu ,  Kai Ding

    IPC: H01L25/075

    CPC classification number: H01L25/0753 ,  H01L33/56

    Abstract: Processing methods are described that include forming a group of LED structures on a substrate layer to form a patterned LED substrate. The methods also include depositing a light absorption material on the pattered LED substrate, where the light absorption material includes at least one photocurable compound and at least one ultraviolet light absorbing material. The methods further include exposing a portion of the light absorption material to patterned light, wherein the patterned light cures the exposed portion of the light absorption material into pixel isolation structures. The methods additionally include depositing an isotropic layer on a top portion and a side portion of the pixel isolation structures, where the LED structures are substantially free of the as-deposited isotropic light reflecting layer.

    Polishing pads for high temperature processing
    15.
    发明授权
    Polishing pads for high temperature processing 有权

    公开(公告)号：US11911870B2

    公开(公告)日：2024-02-27

    申请号：US17472006

    申请日：2021-09-10

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Yingdong Luo ,  Aniruddh Jagdish Khanna ,  You Wang ,  Daniel Redfield

    IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22

    CPC classification number: B24B37/24 ,  B24B37/26 ,  B24B37/22

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

    LED TRANSFER MATERIALS AND PROCESSES
    20.
    发明申请
    LED TRANSFER MATERIALS AND PROCESSES 有权

    公开(公告)号：US20220302339A1

    公开(公告)日：2022-09-22

    申请号：US17671235

    申请日：2022-02-14

    Applicant: Applied Materials, Inc.

    Inventor： Hou T. Ng ,  Nag Patibandla ,  Uma Sridhar ,  Sivapackia Ganapathiappan ,  Mingwei Zhu

    IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

    Abstract: Exemplary processing methods of forming an LED structure on a backplane may include coupling a first transfer substrate with an LED source substrate. The LED source substrate may include a plurality of fabricated LEDs. The coupling of the first transfer substrate may be produced with a first coupling material extending between the first transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the LED source substrate from the LEDs. The methods may include coupling a second transfer substrate with the first transfer substrate. The coupling of the first transfer substrate may be produced with a second coupling material extending between the second transfer substrate and each LED of the plurality of fabricated LEDs. The methods may include separating the first transfer substrate from the second transfer substrate. The methods may include bonding the plurality of fabricated LEDs with a display backplane.

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