公开(公告)号：US20120260063A1

公开(公告)日：2012-10-11

申请号：US13082599

申请日：2011-04-08

申请人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

发明人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

IPC分类号： G06F15/76 ,  G06F9/02

CPC分类号： H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

摘要： A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

摘要翻译： 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

公开(公告)号：US08196281B2

公开(公告)日：2012-06-12

申请号：US13090676

申请日：2011-04-20

申请人： Benson Chan ,  Matthew J. Lauffer

发明人： Benson Chan ,  Matthew J. Lauffer

IPC分类号： H01S4/00

CPC分类号： H05K7/1061 ,  H05K7/1007 ,  Y10T29/49002 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53213 ,  Y10T29/53283 ,  Y10T29/53678

摘要： A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.

摘要翻译： 弹簧致动夹紧机构具有带有上表面和下表面的支承板。 沿着支撑板的周边形成一组孔。 背板的上表面具有至少一个支承板凹部，最好在其中形成四个凹部。 螺纹孔也形成在后板中。 还提供压缩板。 沿着压缩板的周边形成第二组孔。 压缩板的下表面具有至少一个压缩板凹部和至少一个压缩板孔。 至少一个压缩弹簧设置在支承板和压缩板之间。 螺钉张力释放机构拧入支承板螺纹孔并插入通过压板孔。 当释放机构松动时，支撑板向下受力，对夹紧机构所附着的印刷电路板或卡上的所有电触头施加均匀的力。

公开(公告)号：US07972178B2

公开(公告)日：2011-07-05

申请号：US12789642

申请日：2010-05-28

申请人： Benson Chan ,  David J. Alcoe

发明人： Benson Chan ,  David J. Alcoe

IPC分类号： H01R31/06

CPC分类号： H05K7/1061 ,  Y10T29/49117

摘要： A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array.

摘要翻译： 插入式插入器和配合插座，以便于在紧凑型电子电路封装中的一对基板之间移除高连接密度微器件的安装。 固定插入件具有一组通常为矩形阵列的内部触点，其与配合插座配合，允许诸如连接到第一印刷电路基板的MEMS装置的微型装置的可插拔连接。 插入器上的外部一组触点提供位于高连接密度微器件顶部的第一衬底和第二衬底之间的电互连，从而将微器件有效地夹在第一和第二衬底之间。 外套接触件可以以圆形阵列布置。

公开(公告)号：US20090109624A1

公开(公告)日：2009-04-30

申请号：US11976468

申请日：2007-10-25

申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K7/20 ,  H05K3/20

CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

公开(公告)号：US20080238323A1

公开(公告)日：2008-10-02

申请号：US11730404

申请日：2007-04-02

申请人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

发明人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

IPC分类号： H01J7/44

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21K9/69 ,  F21V29/85 ,  F21W2131/202 ,  F21W2131/205 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106

摘要： An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

摘要翻译： 一种LED照明组件，包括安装在公共的可弯曲的散热构件上的多个单独的LED，该散热构件被设计成在操作期间从LED移除热量并且还被形成（弯曲）以提供期望的光的方向和强度。 如本文也提供的，LED灯内可以使用若干这样的组件。 该灯是理想的在医疗和牙科环境中使用，以确保最佳的光照射到距离灯具指定距离的患者。

公开(公告)号：US20050039950A1

公开(公告)日：2005-02-24

申请号：US10955741

申请日：2004-09-30

申请人： Benson Chan ,  John Lauffer

发明人： Benson Chan ,  John Lauffer

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K7/06

CPC分类号： H01L23/5383 ,  H01L23/3128 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuitized substrate including a plurality of conductive and dielectric layers and also a plurality of conductive thru-holes therein for passing high speed signals, e.g., from one component to another mounted on the substrate. The substrate utilizes a signal routing pattern which uses the maximum length of each of the thru-holes wherever possible to thereby substantially eliminate signal loss (noise) due to thru-hole “stub” resonance. A multilayered circuitized substrate assembly using more than one circuitized substrate, an electrical assembly using a circuitized substrate and one or more electrical components, a method of making the circuitized substrate and an information handling system incorporating one or more circuitized substrate assemblies and attached components are also provided.

摘要翻译： 电路化基板，其包括多个导电和电介质层，并且还包括多个导电通孔，用于使高速信号例如从安装在基板上的一个部件传递到另一个部件。 衬底利用信号路由图案，其中尽可能地使用每个通孔的最大长度，从而基本上消除由于通孔“短线”共振引起的信号损失（噪声）。 使用多于一个电路化基板的多层电路化基板组件，使用电路化基板和一个或多个电气部件的电气组件，制造电路化基板的方法和结合有一个或多个电路化基板组件和附接部件的信息处理系统也是 提供。

公开(公告)号：US06224396B1

公开(公告)日：2001-05-01

申请号：US09329537

申请日：1999-06-10

申请人： Benson Chan ,  Kishor V. Desai ,  John H. Sherman

发明人： Benson Chan ,  Kishor V. Desai ,  John H. Sherman

IPC分类号： H01R1200

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R12/714 ,  H05K3/325

摘要： An interposer for connecting two circuit members. The interposer has two extending conductive ends, is “Z” shaped, and has a center of gravity positioned relative to one of the conductive ends such that the interposer is capable of standing upright upon that end without external support. The interposer may be composed of a plated metal, and at least one of the extending conductive ends may have deposited dendrites or a raised bump. The Z-shaped interposer prevents bowing or cracking of the connected structure which otherwise occurs during use due to the different thermal coefficients of expansion of the two circuit members.

摘要翻译： 用于连接两个电路部件的插入器。 插入器具有两个延伸的导电端，为“Z”形，并且具有相对于导电端之一定位的重心，使得插入件能够在该端部处直立而无需外部支撑。 插入器可以由电镀金属组成，并且至少一个延伸的导电端可以具有沉积的枝晶或凸起的凸起。 由于两个电路构件的不同的热膨胀系数，Z形插入件防止在使用期间发生的连接结构的弯曲或破裂。

公开(公告)号：US5468996A

公开(公告)日：1995-11-21

申请号：US218002

申请日：1994-03-25

申请人： Benson Chan ,  Fletcher L. Chapin ,  Vincent M. Fiacco ,  John R. Mankus ,  Robert S. Pokrzywa

发明人： Benson Chan ,  Fletcher L. Chapin ,  Vincent M. Fiacco ,  John R. Mankus ,  Robert S. Pokrzywa

IPC分类号： H01L21/60 ,  H01L23/02 ,  H01L23/50 ,  H05K1/03 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H01L23/34

CPC分类号： H05K1/141 ,  H05K3/365 ,  H05K1/0306 ,  H05K1/148 ,  H05K2201/10393 ,  H05K2201/1053 ,  H05K3/301 ,  H05K3/368

摘要： An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.

摘要翻译： 一种电子封装，其包括基部构件和相关联的盖构件，其被设计用于定位在一起以压缩位于其中的至少两个电路化基板（例如，陶瓷基板和多个柔性基板）。 其中一个基板是基本上刚性的，并且在基座内以受保护的对齐方式被正确定位。 此外，柔性基底精确对准并且最初固定到刚性基底上，本发明还使用另外的弹性装置来在包装被完全组装时作用在每个柔性基底上。 盖子固定到基座上以实现内部元件的最终压缩。 该封装可以被定位在电耦合到另一个电路化的衬底（例如PCB）上。

公开(公告)号：US09451693B2

公开(公告)日：2016-09-20

申请号：US13198756

申请日：2011-08-05

申请人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

发明人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

IPC分类号： H05K1/11 ,  H05K1/03

CPC分类号： H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

摘要翻译： 用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。 具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。 导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

公开(公告)号：US20090306933A1

公开(公告)日：2009-12-10

申请号：US12133819

申请日：2008-06-05

申请人： Benson Chan ,  Kenneth Ramaley ,  Andrew Melton Bridgeman

发明人： Benson Chan ,  Kenneth Ramaley ,  Andrew Melton Bridgeman

IPC分类号： G06F17/18

CPC分类号： G06Q30/0203 ,  G06Q30/02

摘要： Sampling sufficiency determinations are performed using probability calculations and statistical analysis during a testing process of a population of items. For example, an auditing or reviewing process may involve testing a predetermined sample set of items from the population in order to draw statistical conclusions about the passing or failing rate of the population as a whole. During an ongoing testing process, probability calculations and statistical analyses may be performed regarding the likelihood of the population to pass or fail according to an acceptable failure rate, based on the test results of a subset of the sample set. The sampling sufficiency analyses may potentially allow determinations that the testing process may be stopped before the complete testing of the sample set, and that the population may be declared a passing or failing population within a desired level of confidence.

摘要翻译： 在项目群体的测试过程中使用概率计算和统计分析来执行抽样自给性确定。 例如，审计或审查过程可能包括从人口中测试预定的样本集合，以便得出关于整体人口通过率或失败率的统计结论。 在正在进行的测试过程中，可以基于样本集的子集的测试结果，根据可接受的故障率来执行概率计算和统计分析关于群体通过或失败的可能性。 抽样充分性分析可能允许确定测试过程可能在样本集的完整测试之前停止，并且可以在所需的置信度范围内将人口宣告为通过或失败的人群。