公开(公告)号：US09370090B2

公开(公告)日：2016-06-14

申请号：US14500530

申请日：2014-09-29

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Stuart Connolly ,  Binoy Milan Shah ,  Brian Hoden ,  Joo Han Kim

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  G06F1/20

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/30 ,  H05K3/368 ,  H05K7/1461 ,  H05K7/20672

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。

公开(公告)号：US20150282380A1

公开(公告)日：2015-10-01

申请号：US14225461

申请日：2014-03-26

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus De Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Joo Han Kim

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H01L23/42 ,  H01L23/427 ,  H01L23/4275 ,  H01L23/433 ,  H01L2924/15311

Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

Abstract translation: 提供具有容纳结构和热导体的热接口装置。 此外，容纳结构包括至少一个壁，其中容纳结构构造成有助于热量的通过。 此外，热接口装置包括至少设置在容纳结构的一部分中的热导体。 此外，热导体构造成在固态和液态之间可逆地切换。 此外，热接口设备是可重新加工的设备。

公开(公告)号：US20140264800A1

公开(公告)日：2014-09-18

申请号：US13897685

申请日：2013-05-20

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181

Abstract: A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second surface of the semiconductor device and a second surface of the conducting shim. A metallization layer is coupled to the first surface of the semiconductor device and the first surface of the conducting shim. The metallization layer extends through the dielectric layer and is electrically connected to the second surface of the semiconductor device by way of the conducting shim and the heatspreader.

Abstract translation: 半导体器件模块包括电介质层，具有耦合到电介质层的第一表面的半导体器件和具有耦合到电介质层的第一表面的导电垫片。 半导体器件还包括具有耦合到半导体器件的第二表面的第一表面和导电垫片的第二表面的导电散热器。 金属化层耦合到半导体器件的第一表面和导电垫片的第一表面。 金属化层延伸穿过电介质层，并通过导电垫片和散热器与半导体器件的第二表面电连接。

公开(公告)号：US11605609B2

公开(公告)日：2023-03-14

申请号：US16788428

申请日：2020-02-12

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/00 ,  H01L23/34 ,  H01L23/538 ,  H05K3/30 ,  H05K3/46 ,  H01L23/367 ,  H01L23/373 ,  H01L23/48 ,  H01L25/10 ,  H01L23/42 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  H05K3/36

Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

公开(公告)号：US10667429B2

公开(公告)日：2020-05-26

申请号：US15699713

申请日：2017-09-08

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Shakti Singh Chauhan ,  Hendrik Pieter Jacobus De Bock ,  Graham Charles Kirk ,  Stanton Earl Weaver, Jr. ,  David Shannon Slaton ,  Tao Deng ,  Pramod Chamarthy

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04 ,  H01L23/40 ,  H01L23/427 ,  H01L21/48 ,  H01L23/36

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

公开(公告)号：US09391027B2

公开(公告)日：2016-07-12

申请号：US14844515

申请日：2015-09-03

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Paul Alan McConnelee ,  Arun Virupaksha Gowda

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H05K3/46 ,  H05K1/02 ,  H05K3/30 ,  H01L23/42 ,  H01L23/433

CPC classification number: H01L23/5389 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/433 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/53295 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/25 ,  H01L24/26 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/24225 ,  H01L2224/2518 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82101 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/0266 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4602 ,  H05K3/4605 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2203/0278 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/014 ,  H01L2924/00

Abstract: A package structure includes a dielectric layer, at least one semiconductor device attached to the dielectric layer, one or more dielectric sheets applied to the dielectric layer and about the semiconductor device(s) to embed the semiconductor device(s) therein, and a plurality of vias formed to the semiconductor device(s) that are formed in at least one of the dielectric layer and the one or more dielectric sheets. The package structure also includes metal interconnects formed in the vias and on one or more outward facing surfaces of the package structure to form electrical interconnections to the semiconductor device(s). The dielectric layer is composed of a material that does not flow during a lamination process and each of the one or more dielectric sheets is composed of a curable material configured to melt and flow when cured during the lamination process so as to fill-in any air gaps around the semiconductor device(s).

公开(公告)号：US09333599B2

公开(公告)日：2016-05-10

申请号：US14135678

申请日：2013-12-20

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Tao Deng ,  Jay Todd Labhart ,  Pramod Chamarthy ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Brian Patrick Hoden

IPC: H05K7/20 ,  B23P15/26 ,  H05K9/00

CPC classification number: B23P15/26 ,  B23P2700/09 ,  B23P2700/10 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/20681 ,  H05K9/0062 ,  Y10T29/49826

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。

公开(公告)号：US09253871B2

公开(公告)日：2016-02-02

申请号：US14068697

申请日：2013-10-31

Applicant: General Electric Company

Inventor： Joo Han Kim ,  Hendrik Pieter Jacobus de Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Stuart Connolly

IPC: H05K7/20 ,  H01S4/00 ,  F28F7/00 ,  F28D15/00 ,  H01R13/00 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H05K7/1461 ,  H05K7/20672 ,  Y10T29/49002

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。

公开(公告)号：US20150380356A1

公开(公告)日：2015-12-31

申请号：US14844515

申请日：2015-09-03

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Paul Alan McConnelee ,  Arun Virupaksha Gowda

IPC: H01L23/538 ,  H01L23/528 ,  H05K1/18 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/5389 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/433 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/53295 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/25 ,  H01L24/26 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/24225 ,  H01L2224/2518 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82101 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/0266 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4602 ,  H05K3/4605 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2203/0278 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/014 ,  H01L2924/00

Abstract: A package structure includes a dielectric layer, at least one semiconductor device attached to the dielectric layer, one or more dielectric sheets applied to the dielectric layer and about the semiconductor device(s) to embed the semiconductor device(s) therein, and a plurality of vias formed to the semiconductor device(s) that are formed in at least one of the dielectric layer and the one or more dielectric sheets. The package structure also includes metal interconnects formed in the vias and on one or more outward facing surfaces of the package structure to form electrical interconnections to the semiconductor device(s). The dielectric layer is composed of a material that does not flow during a lamination process and each of the one or more dielectric sheets is composed of a curable material configured to melt and flow when cured during the lamination process so as to fill-in any air gaps around the semiconductor device(s).

Abstract translation: 封装结构包括介电层，至少一个连接到电介质层的半导体器件，一个或多个施加到电介质层的电介质片和半导体器件，以将半导体器件嵌入其中，并且多个 形成在形成在电介质层和一个或多个电介质层中的至少一个中的半导体器件上的通孔。 封装结构还包括形成在通孔中的金属互连和在封装结构的一个或多个向外表面上以形成与半导体器件的电互连的金属互连。 电介质层由在层压过程中不流动的材料组成，并且所述一个或多个电介质片中的每一个由可固化材料构成，所述可固化材料构造成在层压过程中固化时熔化和流动，以便填充任何空气 半导体器件周围的间隙。

公开(公告)号：US20150194375A1

公开(公告)日：2015-07-09

申请号：US14665735

申请日：2015-03-23

Applicant: General Electric Company

Inventor： Arun Virupaksha Gowda ,  Paul Alan McConnelee ,  Shakti Singh Chauhan

IPC: H01L23/495 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49579 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A power overlay (POL) structure includes a POL sub-module. The POL sub-module includes a dielectric layer and a semiconductor device having a top surface attached to the dielectric layer. The top surface of the semiconductor device has at least one contact pad formed thereon. The POL sub-module also includes a metal interconnect structure that extends through the dielectric layer and is electrically coupled to the at least one contact pad of the semiconductor device. A conducting shim is coupled to a bottom surface of the semiconductor device and a first side of a thermal interface is coupled to the conducting shim. A heat sink is coupled to a second side of the electrically insulating thermal interface.

Abstract translation: 功率覆盖（POL）结构包括POL子模块。 POL子模块包括电介质层和具有附着到电介质层的顶表面的半导体器件。 半导体器件的顶表面具有形成在其上的至少一个接触焊盘。 POL子模块还包括金属互连结构，其延伸穿过介电层并且电耦合到半导体器件的至少一个接触焊盘。 导电垫片耦合到半导体器件的底表面，并且热界面的第一侧耦合到导电垫片。 散热器耦合到电绝缘热接口的第二侧。