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    MZM linear driver for silicon photonics device characterized as two-channel wavelength combiner and locker
    14.
    发明授权
    MZM linear driver for silicon photonics device characterized as two-channel wavelength combiner and locker 有权

    公开(公告)号：US09874800B2

    公开(公告)日：2018-01-23

    申请号：US15247091

    申请日：2016-08-25

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: G02F1/225 ,  G02F1/01 ,  G02F1/025 ,  G02F1/21

    CPC classification number: G02F1/2257 ,  G02F1/0121 ,  G02F1/0123 ,  G02F1/025 ,  G02F1/225 ,  G02F2001/212

    Abstract: The present invention includes a Mach-Zehnder modulator (MZM) linear driver configured in a differential form with two waveguides carrying two traveling waves which supports a two-channel spectral combiner integrated with a wavelength locker. By coupling a DC current source supplied with a modulation voltage with each segment thereof for providing electrical modulation signal overlapping with each of the two traveling waves. The modulated traveling waves in the two waveguides then are combined in one output signal by a multimode interference coupler. Two optical signals at ITU grid channels are separately modulated by two MZMs and combined into a silicon waveguide-based delayed-line interferometer built on a SOI substrate to produce an output signal having a free spectral range equal to twice of the spacing of the two ITU grid channels. Two dither signals can be added respectively to the two optical signals for identifying and locking corresponding two channel wavelengths.

    Package structure for photonic transceiving device
    18.
    发明授权
    Package structure for photonic transceiving device 有权
    光子收发器的封装结构

    公开(公告)号：US09553671B1

    公开(公告)日：2017-01-24

    申请号：US14793636

    申请日：2015-07-07

    Applicant: Inphi Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: H04B10/00 ,  H04B10/40 ,  H04B10/516

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Abstract translation: 四芯小型可插拔（QSFP）封装中的光子收发器设备。 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括印刷电路板（PCB），该印刷电路板（PCB）安装在基座部件的空间体积内部，在后端具有可插拔的电连接器。 此外，该装置包括微型发射 - 光学 - 子组件封装中的多个光学传输装置，每个光学传输装置均安装在共同的支撑结构上，并且具有朝向后端的反向取向的激光输出端口。 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤到硅附着模块，并耦合到调制驱动器模块和跨阻放大器模块。 此外，该装置包括一对光输入/输出端口，其后连接到光纤到硅附接模块。

    Light engine based on silicon photonics TSV interposer
    20.
    发明授权
    Light engine based on silicon photonics TSV interposer 有权

    公开(公告)号：US11367687B2

    公开(公告)日：2022-06-21

    申请号：US16738844

    申请日：2020-01-09

    Applicant: INPHI CORPORATION

    Inventor： Liang Ding ,  Radhakrishnan L. Nagarajan

    IPC: H01K3/10 ,  H01R43/00 ,  H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H01L23/538 ,  G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  G02B6/12 ,  H01L21/768

    Abstract: A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.

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