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11.发明申请公开(公告)号：US20120119233A1
公开(公告)日：2012-05-17
申请号：US13320304
申请日：2010-07-19
申请人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC分类号： H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.
摘要翻译： 一种光电子半导体部件的制造方法，包括提供载体; 在载体的顶侧布置至少一个光电子半导体芯片; 在所述至少一个光电半导体芯片周围成形成形体，其中所述成形体覆盖所述至少一个光电半导体芯片的所有侧面区域，并且其中，在顶侧处背离所述载体的表面和/或面向所述至少一个光电半导体芯片的表面 在至少一个半导体芯片的下侧的载体保持基本上没有成形体或暴露，并且移除载体。
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12.发明申请公开(公告)号：US20130214323A1
公开(公告)日：2013-08-22
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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13.发明申请公开(公告)号：US20120228663A1
公开(公告)日：2012-09-13
申请号：US13394058
申请日：2010-08-05
申请人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter
IPC分类号： H01L33/62
CPC分类号： H01L33/44 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2224/24101 , H01L2224/24105 , H01L2224/24137 , H01L2224/24226 , H01L2224/24998 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： An optoelectronic component comprising at least one semiconductor body having a radiation exit side, said semiconductor body being arranged by a side lying opposite the radiation exit side on a substrate, wherein at least one electrical connection region, on which a metallization bump is arranged, is arranged on the radiation exit side, the semiconductor body is at least partly provided with an insulating layer, wherein the metallization bump projects beyond the insulating layer, and at least one planar conductor structure is arranged on the insulating layer for the purpose of making contact with the semiconductor body in planar fashion, said conductor structure being electrically conductively connected to the electrical connection region by the metallization bump.
摘要翻译： 一种光电子部件，包括至少一个具有辐射出射侧的半导体本体，所述半导体本体由与衬底上的辐射出口侧相对的一侧设置，其中至少一个电连接区域上布置有金属化凸块， 布置在辐射出口侧，半导体本体至少部分地设置有绝缘层，其中金属化凸块突出超过绝缘层，并且至少一个平面导体结构布置在绝缘层上，用于与 所述半导体本体为平面形式，所述导体结构通过所述金属化凸块与所述电连接区域导电连接。
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14.发明授权公开(公告)号：US09105771B2
公开(公告)日：2015-08-11
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/00 , H01L33/62 , H01L23/00 , H01L21/768 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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15.发明申请公开(公告)号：US20120223360A1
公开(公告)日：2012-09-06
申请号：US13505283
申请日：2010-10-05
申请人： Bernd Barchmann , Axel Kal Tenbacher , Norbert Stath , Walter Wegleiter , Karl Weidner , Ralph Wirth
发明人： Bernd Barchmann , Axel Kal Tenbacher , Norbert Stath , Walter Wegleiter , Karl Weidner , Ralph Wirth
IPC分类号： H01L33/48
CPC分类号： H01L33/62 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L2224/24998 , H01L2224/76155 , H01L2224/82102 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12042 , H01L2924/00
摘要： An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.
摘要翻译： 光电子部件具有带有连接区域（5）的载体元件（3）。 在载体元件（3）上排列的是半导体芯片（7）。 接触区域（10）安装在远离载体元件（3）的半导体芯片（7）的表面（8）上。 连接区域（5）通过未支撑的导电结构（13）导电地连接到接触区域（10）。 描述了一种用于制造光电子部件的方法。
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16.发明授权公开(公告)号：US08513682B2
公开(公告)日：2013-08-20
申请号：US12808953
申请日：2008-12-11
申请人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
发明人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
IPC分类号： H01L33/00
CPC分类号： H01L51/52 , H01L24/24 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/60 , H01L51/5253 , H01L51/5284 , H01L2224/73267 , H01L2924/01029 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.
摘要翻译： 光电子部件包括载体元件。 至少两个元件以相邻方式布置在载体元件的第一侧上。 每个元件具有用于产生电磁辐射的至少一个光学活性区域。 光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。 至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。
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17.发明申请公开(公告)号：US20100301355A1
公开(公告)日：2010-12-02
申请号：US12808953
申请日：2008-12-11
申请人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
发明人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
CPC分类号： H01L51/52 , H01L24/24 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/60 , H01L51/5253 , H01L51/5284 , H01L2224/73267 , H01L2924/01029 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.
摘要翻译： 光电子部件包括载体元件。 至少两个元件以相邻方式布置在载体元件的第一侧上。 每个元件具有用于产生电磁辐射的至少一个光学活性区域。 光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。 至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。
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公开(公告)号：US08261439B2
公开(公告)日：2012-09-11
申请号：US12733507
申请日：2008-08-04
申请人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
发明人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
IPC分类号： H01R43/00
CPC分类号： H01L24/33 , H01L23/3735 , H01L23/49562 , H01L23/5389 , H01L24/18 , H01L24/36 , H01L24/40 , H01L24/73 , H01L24/82 , H01L24/83 , H01L25/072 , H01L2224/18 , H01L2224/82039 , H01L2224/83801 , H01L2224/84801 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/30107 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , H01L2924/00 , H01L2924/00014
摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.
摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。
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19.发明申请公开(公告)号：US20100208438A1
公开(公告)日：2010-08-19
申请号：US12733507
申请日：2008-08-04
申请人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
发明人： Axel Kaltenbacher , Michael Kaspar , Gernot Schimetta , Karl Weidner , Robert Weinke , Jörg Zapf
CPC分类号： H01L24/33 , H01L23/3735 , H01L23/49562 , H01L23/5389 , H01L24/18 , H01L24/36 , H01L24/40 , H01L24/73 , H01L24/82 , H01L24/83 , H01L25/072 , H01L2224/18 , H01L2224/82039 , H01L2224/83801 , H01L2224/84801 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/30107 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , H01L2924/00 , H01L2924/00014
摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.
摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。
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20.发明申请Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces 有权用于接触基底和由具有电接触表面的基底组成的装置的电接触表面的方法公开(公告)号：US20050032347A1
公开(公告)日：2005-02-10
申请号：US10491137
申请日：2001-09-25
申请人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
发明人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
IPC分类号： H01L23/051 , H01L23/373 , H01L23/482 , H01L25/07 , H01L25/18 , H05K1/03 , H05K3/10 , H05K3/32 , H05K3/46 , H01L21/44 , H01L21/4763
CPC分类号： H05K3/4605 , H01L23/051 , H01L23/3735 , H01L23/482 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , H05K3/108 , H05K3/32 , H05K3/4632 , H05K2201/0129 , H05K2201/0154 , H05K2203/068 , H05K2203/085 , H05K2203/1469 , H01L2924/00 , H01L2224/48
摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。
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