公开(公告)号：US20050238929A1

公开(公告)日：2005-10-27

申请号：US11104274

申请日：2005-04-12

Applicant: Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

Inventor： Hiroyuki Uwazumi ,  Youichi Tei ,  Kengo Kainuma ,  Kazuhito Higuchi ,  Akira Iso ,  Hajime Kurihara

IPC: G11B5/667 ,  C23C18/50 ,  G11B5/64 ,  G11B5/65 ,  G11B5/66 ,  G11B5/72 ,  G11B5/73 ,  G11B5/738

CPC classification number: G11B5/667 ,  G11B5/7315

Abstract: A disk substrate for a perpendicular magnetic recording medium is, disclosed. The substrate exhibits sufficient productivity, serves the function of a soft magnetic backing layer of the perpendicular magnetic recording medium, and scarcely generates noise. A perpendicular magnetic recording medium using such a substrate also is disclosed. The disk substrate comprises at least a soft magnetic underlayer formed on a nonmagnetic base plate by means of an electroless plating method. The thermal expansion coefficient of the soft magnetic underlayer is larger than a thermal expansion coefficient of the nonmagnetic disk-shaped base plate. A saturation magnetostriction constant μs satisfies a relation λs≧−1×10−5.

Abstract translation: 公开了一种用于垂直磁记录介质的盘基片。 基板表现出足够的生产率，起到垂直磁记录介质的软磁背衬层的功能，并且几乎不产生噪声。 还公开了使用这种基板的垂直磁记录介质。 盘状基板通过无电镀法至少包含在非磁性基板上形成的软磁性底层。 软磁性底层的热膨胀系数大于非磁性盘状基板的热膨胀系数。 饱和磁致伸缩常数mus满足关系lambdas> = - 1×10 -5。

公开(公告)号：US06862189B2

公开(公告)日：2005-03-01

申请号：US09961172

申请日：2001-09-24

Applicant: Kazuhito Higuchi

Inventor： Kazuhito Higuchi

IPC: H01L21/98 ,  H05K3/20 ,  H05K3/46 ,  H05K7/10 ,  H05K7/12

CPC classification number: H05K3/4617 ,  H01L25/50 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/205 ,  H05K2201/0195 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2201/09963 ,  H05K2203/016 ,  H05K2203/1189

Abstract: An electronic component including an element main body section for performing an electrical function and a terminal section for electrically connecting the element main body section to a conductive member of an external device, the electronic component comprises a pair of sections arranged above the terminal section and opposite to each other in a stacking direction of the electronic component and a distance between the sections corresponding to a maximum thickness of the electronic component.

Abstract translation: 一种电子部件，包括用于执行电功能的元件主体部分和用于将元件主体部分电连接到外部装置的导电部件的端子部分，所述电子部件包括布置在所述端子部分上方的一对部分， 在电子部件的层叠方向上彼此相对的距离和对应于电子部件的最大厚度的部分之间的距离。

公开(公告)号：US06456405B2

公开(公告)日：2002-09-24

申请号：US09966527

申请日：2001-09-28

Applicant: Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

Inventor： Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

IPC: G03H108

CPC classification number: G03H1/0808 ,  G03H1/2294 ,  G03H2001/2297 ,  G03H2210/30 ,  G03H2210/441 ,  G03H2210/452 ,  G03H2210/56 ,  G03H2210/62 ,  G03H2240/62

Abstract: A method for displaying computer generated holograms of a display object is performed by computing fringe patterns produced by light interference from the display object. The steps are summarized as follows: three-dimensional data of the display object are converted into computational data for fringe pattern generation; a sampling rule for sampling computational data is selected; computational data are sampled according to a selected sampling rule; wavefronts generated by light illumination are computed by assuming that each sampled position has a light source; fringe patterns generated by computed wavefronts and a reference beam are computed; fringe patterns are stored as hologram images; sampling and a wavefront generation are repeated for all data; and a series of hologram images thus generated are displayed successively.

Abstract translation: 通过计算由来自显示对象的光干扰产生的条纹图案来执行显示计算机生成的全息图的显示对象的方法。 步骤总结如下：将显示对象的三维数据转换为用于条纹图案生成的计算数据; 选择采样计算数据的采样规则; 根据选定的抽样规则对计算数据进行采样; 通过假设每个采样位置具有光源来计算由光照射产生的波前; 计算由计算的波前和参考光束产生的条纹图案; 条纹图案存储为全息图; 对所有数据重复采样和波阵面生成; 并且依次显示如此生成的一系列全息图。

公开(公告)号：US08614455B2

公开(公告)日：2013-12-24

申请号：US13424687

申请日：2012-03-20

Applicant: Susumu Obata ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Akiya Kimura ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

Inventor： Susumu Obata ,  Kazuhito Higuchi ,  Hideo Nishiuchi ,  Akiya Kimura ,  Toshiya Nakayama ,  Yoshiaki Sugizaki ,  Akihiro Kojima ,  Yosuke Akimoto

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: According to an embodiment, a semiconductor light emitting device includes a stacked body, first and second electrodes, first and second interconnections, first and second pillars and a first insulating layer. The stacked body includes first and second semiconductor layers and a light emitting layer. The first and second electrodes are connected to the first and second semiconductor layers respectively. The first and second interconnections are connected to the first and second electrode respectively. The first and second pillars are connected to the first and second interconnections respectively. The first insulating layer is provided on the interconnections and the pillars. The first and second pillars have first and second monitor pads exposed in a surface of the first insulating layer. The first and second interconnections have first and second bonding pads exposed in a side face connected with the surface of the first insulating layer.

Abstract translation: 根据实施例，半导体发光器件包括层叠体，第一和第二电极，第一和第二互连，第一和第二柱以及第一绝缘层。 层叠体包括第一和第二半导体层和发光层。 第一和第二电极分别连接到第一和第二半导体层。 第一和第二互连分别连接到第一和第二电极。 第一和第二支柱分别连接到第一和第二互连。 第一绝缘层设置在互连和支柱上。 第一和第二支柱具有暴露在第一绝缘层的表面中的第一和第二监视器焊盘。 第一和第二互连具有暴露在与第一绝缘层的表面连接的侧面中的第一和第二接合焊盘。

公开(公告)号：US08008773B2

公开(公告)日：2011-08-30

申请号：US12553452

申请日：2009-09-03

Applicant: Akira Tojo ,  Tomoyuki Kitani ,  Kazuhito Higuchi ,  Masako Fukumitsu ,  Tomohiro Iguchi ,  Hideo Nishiuchi ,  Kyoko Kato

Inventor： Akira Tojo ,  Tomoyuki Kitani ,  Kazuhito Higuchi ,  Masako Fukumitsu ,  Tomohiro Iguchi ,  Hideo Nishiuchi ,  Kyoko Kato

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/03 ,  H01L24/48 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a first electrode and a second electrode of a semiconductor element, the first electrode and the second electrode being configured on a first surface and a second surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, the surface portion being other than regions, each of the regions connecting with the first second electrodes, each of inner electrodes being connected with the first or the second electrodes, a thickness of the inner electrode from the first surface or the second surface being the same thickness as the encapsulating material from the first surface or the second surface, respectively, outer electrodes, each of the outer electrodes being formed on the encapsulating material and connected with the inner electrode, a width of the outer electrode being at least wider than a width of the semiconductor chip, and outer plating materials, each of the outer plating materials covering five surfaces of the outer electrode other than one surface of the outer electrode being connected with the inner electrode.

Abstract translation: 根据本发明的一个方面，提供一种半导体器件，包括半导体芯片，该半导体芯片包括第一电极和半导体元件的第二电极，第一电极和第二电极被配置在第一表面和第二表面上 半导体芯片的封装材料，封装半导体芯片的封装材料，表面部分不同于区域，每个区域与第一第二电极连接，每个内部电极与第一或第二电极连接，厚度为 来自第一表面或第二表面的内部电极分别与来自第一表面或第二表面的密封材料的厚度相同，外部电极，每个外部电极形成在封装材料上并与内部电极连接， 外部电极的宽度至少比半导体ch的宽度宽 ip和外部电镀材料，覆盖外部电极的除了外部电极的一个表面之外的五个表面的每个外部电镀材料与内部电极连接。

公开(公告)号：US07910402B2

公开(公告)日：2011-03-22

申请号：US12125421

申请日：2008-05-22

Applicant: Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

Inventor： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

IPC: H01L21/00

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16013 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/0379 ,  H05K2201/09427 ,  H05K2203/1121 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes (2) are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes (2) or more, a cooling in which a temperature within a range of 190 to 210° C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4

Abstract translation: 为了在使用低介电常数绝缘膜和无铅焊料的半导体器件的倒装芯片连接之后抑制破坏，以提高的生产成本，凸起电极（2）被加热了在加热之后的温度分布 直到凸起电极（2）的熔点以上，将在190〜210℃的范围内的温度保持在3〜15分钟的范围内的时间间隔的冷却，以及条件 使得1.4

公开(公告)号：US06269170B1

公开(公告)日：2001-07-31

申请号：US09532257

申请日：2000-03-22

Applicant: Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

Inventor： Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

IPC: G06T700

CPC classification number: G03H1/0808 ,  G03H1/2294 ,  G03H1/268 ,  G03H1/34 ,  G03H2001/0825 ,  G03H2001/0833 ,  G03H2001/303 ,  G03H2210/30 ,  G03H2210/32 ,  G03H2210/40 ,  G03H2210/452 ,  G03H2210/56 ,  G03H2210/62 ,  G03H2226/05 ,  G03H2240/56 ,  G03H2240/62

Abstract: A scheme for producing computer generated holograms in which a motion vector of each object to be displayed is detected, objects are classified according to their motions, a hologram fringe pattern for each classified group of objects is calculated separately by image processing stored basic patterns, and a hologram to be displayed is produced, by synthesizing all separately calculated hologram fringe patterns. In another aspect, a gaze point of the observer is determined, and a hologram to be displayed is produced by using high resolution hologram fringe patterns for objects located at the gaze point and low resolution hologram fringe patterns for regions other than the gaze point. In another aspect, a distance between each display target object and a hologram plane is obtained, a region of calculations for interference fringes due to each display target object is limited according to the obtained distance, interference fringes due to each display target object are separatedly calculated within the limited region of calculations, and a hologram to be displayed is produced by synthesizing separately calculated interference fringes due to all display target objects.

Abstract translation: 一种用于生成计算机产生的全息图的方案，其中检测到要显示的每个对象的运动矢量，根据其运动对对象进行分类，通过图像处理存储的基本图案分别计算每个分类的对象组的全息图条纹图案，以及 通过合成所有单独计算的全息图条纹图案，产生要显示的全息图。 在另一方面，确定观察者的凝视点，并且通过对位于凝视点处的物体使用高分辨率全息图条纹图案和除了凝视点之外的区域的低分辨率全息图条纹图案来产生要显示的全息图。 在另一方面，获得每个显示目标对象和全息图平面之间的距离，根据所获得的距离限制由于每个显示目标对象引起的干涉条纹的计算区域，分别计算由于每个显示目标对象引起的干涉条纹 在有限的计算区域内，通过由于所有显示目标对象而合成分开计算的干涉条纹来产生要显示的全息图。

公开(公告)号：US06219435B1

公开(公告)日：2001-04-17

申请号：US09532694

申请日：2000-03-22

Applicant: Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

Inventor： Tsutomu Horikoshi ,  Kazuhito Higuchi ,  Takaaki Akimoto ,  Satoshi Suzuki

IPC: G06T700

CPC classification number: G03H1/0808 ,  G03H1/2294 ,  G03H1/268 ,  G03H1/34 ,  G03H2001/0825 ,  G03H2001/0833 ,  G03H2001/303 ,  G03H2210/30 ,  G03H2210/32 ,  G03H2210/40 ,  G03H2210/452 ,  G03H2210/56 ,  G03H2210/62 ,  G03H2226/05 ,  G03H2240/56 ,  G03H2240/62

Abstract: A scheme for producing computer generated holograms in which a motion vector of each object to be displayed is detected, objects are classified according to their motions, a hologram fringe pattern for each classified group of objects is calculated separately by image processing stored basic patterns, and a hologram to be displayed is produced by synthesizing all separately calculated hologram fringe patterns. In another aspect, a gaze point of the observer is determined, and a hologram to be displayed is produced by using high resolution hologram fringe patterns for objects located at the gaze point and low resolution hologram fringe patterns for regions other than the gaze point. In another aspect, a distance between each display target object and a hologram plane is obtained, a region of calculations for interference fringes due to each display target object is limited according to the obtained distance, interference fringes due to each display target object are separatedly calculated within the limited region of calculations, and a hologram to be displayed is produced by synthesizing separately calculated interference fringes due to all display target objects.

Abstract translation: 一种用于生成计算机产生的全息图的方案，其中检测到要显示的每个对象的运动矢量，根据其运动对对象进行分类，通过图像处理存储的基本图案分别计算每个分类的对象组的全息图条纹图案，以及 通过合成所有单独计算的全息图条纹图案来产生待显示的全息图。 在另一方面，确定观察者的凝视点，并且通过对位于凝视点处的物体使用高分辨率全息图条纹图案和除了凝视点之外的区域的低分辨率全息图条纹图案来产生要显示的全息图。 在另一方面，获得每个显示目标对象和全息图平面之间的距离，根据所获得的距离限制由于每个显示目标对象引起的干涉条纹的计算区域，分别计算由于每个显示目标对象引起的干涉条纹 在有限的计算区域内，通过由于所有显示目标对象而合成分开计算的干涉条纹来产生要显示的全息图。

公开(公告)号：US08569787B2

公开(公告)日：2013-10-29

申请号：US13154916

申请日：2011-06-07

Applicant: Hideo Nishiuchi ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

Inventor： Hideo Nishiuchi ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L24/06 ,  H01L33/0095 ,  H01L33/507 ,  H01L33/508 ,  H01L33/647 ,  H01L2224/06051 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/00

Abstract: According to one embodiment, a light source apparatus includes a semiconductor light emitting device, a mounting substrate, first and second connection members. The semiconductor light emitting device includes a light emitting unit, first and second conductive members, a sealing member, and an optical layer. The mounting substrate includes a base body, first and second substrate electrodes. The connection member electrically connects the conductive member to the substrate electrode. The conductive member is electrically connected to the light emitting unit electrode and includes first and second columnar portions provided on the second major surface. The sealing member covers side surfaces of the first and the second conductive members. The optical layer is provided on the first major surface of the semiconductor stacked body and includes a wavelength conversion unit. A surface area of the second substrate electrode is not less than 100 times a cross-sectional area of the second columnar portion.

Abstract translation: 根据一个实施例，光源装置包括半导体发光器件，安装衬底，第一和第二连接构件。 半导体发光器件包括发光单元，第一和第二导电构件，密封构件和光学层。 安装基板包括基体，第一和第二基板电极。 连接构件将导电构件电连接到基板电极。 导电构件电连接到发光单元电极，并且包括设置在第二主表面上的第一和第二柱状部分。 密封构件覆盖第一导电构件和第二导电构件的侧表面。 光学层设置在半导体层叠体的第一主表面上并且包括波长转换单元。 第二基板电极的表面积不小于第二柱状部分的横截面面积的100倍。

公开(公告)号：US08350283B2

公开(公告)日：2013-01-08

申请号：US13152654

申请日：2011-06-03

Applicant: Hideo Nishiuchi ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

Inventor： Hideo Nishiuchi ,  Kazuhito Higuchi ,  Susumu Obata ,  Toshiya Nakayama

IPC: H01L33/50

CPC classification number: H01L33/647 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.

Abstract translation: 根据一个实施例，半导体发光器件包括发光单元，第一和第二导电构件，绝缘层，密封构件和光学层。 发光单元包括半导体层叠体和第一和第二电极。 半导体层叠体包括第一和第二半导体层和发光层，并且在第二半导体层侧具有主表面。 第一和第二电极分别连接到主表面侧的第一和第二半导体层。 第一导电构件连接到第一电极并且包括覆盖第二半导体的一部分的第一柱状部分。 绝缘层设置在第一柱状部分和第二半导体的部分之间。 密封构件覆盖导电构件的侧表面。 光学层设置在另一个主表面上。