公开(公告)号：US5310967A

公开(公告)日：1994-05-10

申请号：US68036

申请日：1993-05-28

申请人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

发明人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

IPC分类号： H01L23/12 ,  G02F1/13 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46 ,  H05K1/00

CPC分类号： H05K3/225 ,  H01L21/76886 ,  G02F1/1309 ,  H05K2201/0394 ,  H05K2201/1028 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/20 ,  H05K3/28 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49742

摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

公开(公告)号：US5289632A

公开(公告)日：1994-03-01

申请号：US981458

申请日：1992-11-25

申请人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

发明人： Pedro A. Chalco ,  Matthew F. Cali ,  Laertis Economikos ,  James L. Speidell

IPC分类号： H01L23/12 ,  G02F1/13 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/225 ,  H01L21/76886 ,  G02F1/1309 ,  H05K2201/0394 ,  H05K2201/1028 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/20 ,  H05K3/28 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49742

摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

摘要翻译： 通过将导线与衬底的选定区域并置定位来将导线施加到衬底; 将导线接合到基板上; 以及将导线从其中悬挂有导线的载体分离。 载体具有由侧壁限定的载体开口，并且导电材料被载体开口的侧壁悬挂以嵌入载体开口中，并形成导电线。

公开(公告)号：US20080315409A1

公开(公告)日：2008-12-25

申请号：US11765055

申请日：2007-06-19

申请人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US20080272177A1

公开(公告)日：2008-11-06

申请号：US12173346

申请日：2008-07-15

申请人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： B23K37/06

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

摘要： A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

摘要翻译： 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

公开(公告)号：US07410090B2

公开(公告)日：2008-08-12

申请号：US11409244

申请日：2006-04-21

申请人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： B23K31/02

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

摘要： A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

公开(公告)号：US6061114A

公开(公告)日：2000-05-09

申请号：US27997

申请日：1998-02-23

申请人： Alessandro Cesare Callegari ,  Praveen Chaudhari ,  James Patrick Doyle ,  James Andrew Lacey ,  Shui-Chin Alan Lien ,  Sampath Purushothaman ,  Mahesh Govind Samant ,  James L. Speidell ,  Joachim Stohr

发明人： Alessandro Cesare Callegari ,  Praveen Chaudhari ,  James Patrick Doyle ,  James Andrew Lacey ,  Shui-Chin Alan Lien ,  Sampath Purushothaman ,  Mahesh Govind Samant ,  James L. Speidell ,  Joachim Stohr

IPC分类号： G02F1/1337 ,  G02F1/133 ,  G02F1/141

CPC分类号： G02F1/13378

摘要： Bombardment of the surface of a substrate with a film layer is used to create alignment layers for liquid crystal displays. By using bombardment of the surface at an angle, both direct creation of the alignment layer or indirect deposition of the alignment layer material onto a glass plate can be achieved.

摘要翻译： 使用具有膜层的基板的表面轰击以产生用于液晶显示器的取向层。 通过以一定的角度轰击表面，可以实现直接产生取向层或将取向层材料间接沉积到玻璃板上。

公开(公告)号：US4923772A

公开(公告)日：1990-05-08

申请号：US341273

申请日：1989-04-17

申请人： Steven J. Kirch ,  John R. Lankard ,  John J. Ritsko ,  Kurt A. Smith ,  James L. Speidell ,  James T. Yeh

发明人： Steven J. Kirch ,  John R. Lankard ,  John J. Ritsko ,  Kurt A. Smith ,  James L. Speidell ,  James T. Yeh

IPC分类号： G03F1/24 ,  G03F1/58

CPC分类号： G03F1/58 ,  G03F1/24 ,  Y10S430/146

摘要： The present invention is a mask and methods for making masks for use with a laser projection etching system. The unique mask is able to withstand the fluences of the high energy and high power lasers used without degrading. Specifically, the new projection etching masks are fabricated of patterned multiple dielectric layers having alternating high and low indices of refraction on a UV grade synthetic fused silica substrate in order to achieve maximum reflectivity of the laser energy in the opague areas and maximum transmissivity of the laser energy in the transparent areas of the mask.

摘要翻译： 本发明是用于制造用于激光投影蚀刻系统的掩模的掩模和方法。 独特的面罩能够承受高能量和高功率激光器的使用而不降解的能量。 具体来说，新的投影蚀刻掩模由在UV级合成熔融石英基底上具有交替的高折射率和低折射率的图案化多个电介质层制成，以便实现在op区域中激光能量的最大反射率和激光器的最大透射率 能量在面具的透明区域。

公开(公告)号：US08237271B2

公开(公告)日：2012-08-07

申请号：US11765055

申请日：2007-06-19

申请人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US20120187577A1

公开(公告)日：2012-07-26

申请号：US13439198

申请日：2012-04-04

申请人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US07784664B2

公开(公告)日：2010-08-31

申请号：US12189822

申请日：2008-08-12

申请人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： B23K37/00 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K1/20 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。