公开(公告)号：US20080009152A1

公开(公告)日：2008-01-10

申请号：US11456111

申请日：2006-07-07

Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC: H01R12/00

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract translation: 电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块以及用于将第一，第二和形状发生模块夹紧在一起的夹紧装置。 形状产生模块向第二模块施加期望的形状，用于将第二组电触点推向第一组电触点，使得将模块夹在一起导致第一和第二组电触点之间的正接触力， 在电接触组之间基本均匀。 形状发生模块包括第一绝缘层，第二绝缘层和设置在第一和第二绝缘层之间的形状产生层。 形状产生层包括在施加热处理以产生所需形状时流动和固化的粘合剂。

公开(公告)号：US07173193B2

公开(公告)日：2007-02-06

申请号：US10403148

申请日：2003-03-31

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer ,  James R. Stack

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer ,  James R. Stack

IPC: H05K3/02 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K1/0271 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/112 ,  H05K2201/0191 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/10719 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.

Abstract translation: 提供了一种用于实现电连接器（例如，平面栅格阵列（LGA）模块）和印刷电路板的增强的互连性能的方法和结构。 多层印刷线路板包括多个预定义的接地层和功率层。 预定义的接地层和功率层中的至少一个包括用于最小化厚度变化的厚度变化最小化结构。 厚度变化最小化结构包括在预定义的接地层和功率层中的至少一个的选定区域内的穿孔图案。 所选择的区域靠近预定义的模块站点，例如地面和电力层中的陆地网格阵列（LGA）模块站点。 所选择的区域可以包括围绕每个预定义模块站点的区域，并且还可以包括模块站点内的区域。

公开(公告)号：US06497582B1

公开(公告)日：2002-12-24

申请号：US09934763

申请日：2001-08-22

Applicant: Mark Kenneth Hoffmeyer

Inventor： Mark Kenneth Hoffmeyer

IPC: H01R909

CPC classification number: H01R12/57 ,  H01R12/7076 ,  H01R13/5219

Abstract: Land grid array (LGA) connectors are used to attach circuit modules to printed circuit boards that present an array of noble metal or semi-noble metal plated contacts to not only effect a reliable connection, but also enable circuit module release and replacement. During replacement, the connector is discarded and a replacement circuit module is used. Only the contact array on the printed circuit board is reused. An in situ gasket carried by the connector is compressed against the circuit board in the assembled condition to form a sealed enclosure about the contact array at the printed circuit board surface which excludes particulate and gaseous contaminants. Thus when the module is replaced, the contact array site on the printed circuit board does not require cleaning or processing to overcome degradation of the contact materials or surfaces. Beyond providing a sealed enclosure, the gasket material should be selected for sealing, but inelastic qualities so that the uniform pressure applied to the contacts of the array is not impaired nor the total required contact force increased.

Abstract translation: 地电网阵列（LGA）连接器用于将电路模块连接到印刷电路板上，印刷电路板呈现贵金属或半贵金属电镀触点阵列，不仅可以实现可靠的连接，而且可实现电路模块的释放和更换。 在更换期间，连接器被丢弃，并使用更换电路模块。 只有印刷电路板上的接触阵列被重新使用。 由连接器承载的原位垫圈在组装状态下被压靠在电路板上，以在印刷电路板表面上形成围绕接触阵列的密封外壳，排除颗粒和气体污染物。 因此，当更换模块时，印刷电路板上的接触阵列位置不需要清洁或处理以克服接触材料或表面的劣化。 除了提供密封的外壳之外，垫圈材料应该被选择用于密封，但是非弹性质量，使得施加到阵列的触点的均匀的压力不受损害，也不会增加总的所需的接触力。

公开(公告)号：US08212156B2

公开(公告)日：2012-07-03

申请号：US12146757

申请日：2008-06-26

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H05K7/02 ,  H05K1/11 ,  H01R43/02

CPC classification number: H05K3/4015 ,  H01R12/7082 ,  H05K3/20 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10T29/49124 ,  Y10T29/49222

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract translation: 用于塑料焊盘网格阵列（PLGA）模块和印刷电路板（PWB）的增强型接触式冶金结构。 PWB可以例如具有亚复合层压结构和/或双面LGA位点。 多个预成型件触点分别焊接到PLGA模块载体和/或PWB上的多个金属焊盘之一。 每个预成型件触点包括焊接到多个金属焊盘中的一个的金属预制棒基座（例如铜，镍）和在金属预制棒基部上的电解贵金属电镀（例如金）。 可以在金属预制棒基体和电解贵金属电镀之间插入底层电镀非贵金属（例如镍）。 在一个实施方案中，底镀电解非贵金属为80-400微英寸，以提供增强的扩散阻挡层，并且电解贵金属镀层为30-60微英寸，并且包含一种或多种硬化剂以提供增强的耐磨性和耐腐蚀性 。

公开(公告)号：US08085550B2

公开(公告)日：2011-12-27

申请号：US12410095

申请日：2009-03-24

Applicant: Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

Inventor： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

IPC: H05K7/10

CPC classification number: H05K1/111 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/09736 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49218

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract translation: 提供了一种方法和表面贴装技术（SMT）焊盘结构，用于实现增强的焊点鲁棒性。 SMT焊盘结构包括基板SMT焊盘。 基座SMT焊盘接收用于焊接到SMT焊盘结构的连接器。 在基座SMT焊盘上限定具有选定几何形状的间隔结构，以增加用于连接器的焊点的厚度。

公开(公告)号：US20090321125A1

公开(公告)日：2009-12-31

申请号：US12146757

申请日：2008-06-26

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H01R43/02 ,  H05K1/11

CPC classification number: H05K3/4015 ,  H01R12/7082 ,  H05K3/20 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10T29/49124 ,  Y10T29/49222

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract translation: 用于塑料焊盘网格阵列（PLGA）模块和印刷电路板（PWB）的增强型接触式冶金结构。 PWB可以例如具有亚复合层压结构和/或双面LGA位点。 多个预成型件触点分别焊接到PLGA模块载体和/或PWB上的多个金属焊盘之一。 每个预成型件触点包括焊接到多个金属焊盘中的一个的金属预制棒基座（例如铜，镍）和在金属预制棒基部上的电解贵金属电镀（例如金）。 可以在金属预制棒基体和电解贵金属电镀之间插入底层电镀非贵金属（例如镍）。 在一个实施方案中，底镀电解非贵金属为80-400微英寸，以提供增强的扩散阻挡层，并且电解贵金属镀层为30-60微英寸，并且包含一种或多种硬化剂以提供增强的耐磨性和耐腐蚀性 。

公开(公告)号：US20080239683A1

公开(公告)日：2008-10-02

申请号：US11693824

申请日：2007-03-30

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H05K7/02

CPC classification number: H05K7/1069 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  Y10T29/49169

Abstract: A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.

Abstract translation: 一种使用具有具有配电元件的框架结构的平面栅格阵列（LGA）连接器来电连接两个基板的方法和装置。 在一个实施例中，框架结构包括具有夹在非导电层之间的一个或多个导电层的框架。 框架可以例如是具有从第一基板（例如，系统PWB）和/或电力电缆分配功率到第二基板（例如，电子模块）的电力平面的印刷线路板（PWB）。 该框架包括一个或多个孔，其构造成接收用于电连接两个基板的LGA插入器。 优选地，框架包括布置在象限中的四个孔，每个孔分别接收插入件，并且至少一个电源平面在两个象限之间延伸和/或邻近一个或多个象限的周边边缘，堆叠和/或并行母线的形式 每个定义一个电源域。

公开(公告)号：US07079398B2

公开(公告)日：2006-07-18

申请号：US10672756

申请日：2003-09-27

Applicant: Mark Kenneth Hoffmeyer

Inventor： Mark Kenneth Hoffmeyer

IPC: H01R9/00

CPC classification number: H05K7/1061 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/111 ,  H05K3/244 ,  H05K2201/09781 ,  H05K2201/10719 ,  Y02P70/611 ,  H01L2924/00

Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array. Preferably, the sash is manufactured along with the array of electrical interconnections of the carrier, and during the manufacture the sash provides more homogeneous current density to the outer interconnections of the array during component processing which in turn provides more predictable and consistent surface topography of the carrier and permits more uniform mechanical loading of the interposer or other connector onto the array when assembled.

公开(公告)号：US06784377B2

公开(公告)日：2004-08-31

申请号：US10205102

申请日：2002-07-25

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R1204

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US06076726A

公开(公告)日：2000-06-20

申请号：US108482

申请日：1998-07-01

Applicant: Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

Inventor： Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs

IPC: B23K1/00 ,  H01R12/04 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  H05K3/3463 ,  B23K2201/42 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2201/2081 ,  H05K2203/043 ,  H05K2203/0455 ,  H05K3/3452 ,  H05K3/3484 ,  Y02P70/613

Abstract: Fine pitch area array packaging is achieved using a via-in-pad design within the area array attach portion of a printed circuit board (PCB). The limitation of the design is the wicking action, whereby solder applied to the capture pad contact surface is depleted by capillary action into the via hole when reflowed, causing insufficient solder to be present at the contact surface to effect reliable and repeatable electrical connections. In one implementation, an initial application of solder is applied to plug the via hole with a material having a higher final melting temperature than eutectic solder, thereby providing a stable plug. This plug is formed by the initial solder application that may be either a eutectic solder containing a third metal that forms intermetallic compounds, when reflowed, that elevate the liquidus temperature or a solder having a different formulation with an inherent higher melting temperature. An alternative implementation is to plate the via hole with a material, such as nickel, which prevents eutectic solder, applied to the via capture pad contact surface, from wetting the hole surface and being drawn away from the contact surface by capillary action. Thus, the solder, applied to the via capture pad and used to establish an electrical connection is not depleted.

Abstract translation: 使用在印刷电路板（PCB）的区域阵列附着部分内的通孔焊盘设计实现细间距区域阵列封装。 设计的限制是芯吸作用，由此当回流时，施加到捕获垫接触表面的焊料被毛细管作用通入通孔中，导致在接触表面处存在不足的焊料以实现可靠和可重复的电连接。 在一个实施方案中，施加焊料的初始应用以用比共晶焊料更高的最终熔融温度的材料堵塞通孔，从而提供稳定的插塞。 该插头由初始焊料应用形成，其可以是包含形成金属间化合物的第三金属的共晶焊料，当回流时，提高液相线温度的焊料或具有固有的较高熔融温度的不同配方的焊料。 另一种实施方案是用诸如镍的材料对通孔进行平板化，其防止施加到通孔捕获垫接触表面的共晶焊料润湿孔表面并通过毛细管作用从接触表面拉出。 因此，施加到通孔捕获垫并用于建立电连接的焊料不会耗尽。