Optoelectronic Device and Method for Manufacturing Optoelectronic Devices

    公开(公告)号:US20210336101A1

    公开(公告)日:2021-10-28

    申请号:US17284167

    申请日:2019-10-09

    Abstract: In an embodiment an optoelectronic device includes an optoelectronic component with a first main surface, a second main surface and a plurality of side surfaces interconnecting the first and second main surfaces and a conversion element arranged at the first main surface of the optoelectronic component, wherein the conversion element includes a frame of a reflective material and a conversion material located within the frame, wherein an interface between the frame and the conversion material runs slanted having an angle of smaller than 180° and larger than 90° between the interface and an adjacent side surface of the plurality of side surfaces, and wherein the frame protrudes laterally beyond a light emitting area of the first main surface of the optoelectronic component.

    ASSEMBLY THAT EMITS ELECTROMAGNETIC RADIATION AND METHOD OF PRODUCING AN ASSEMBLY THAT EMITS ELECTROMAGNETIC RADIATION
    13.
    发明申请
    ASSEMBLY THAT EMITS ELECTROMAGNETIC RADIATION AND METHOD OF PRODUCING AN ASSEMBLY THAT EMITS ELECTROMAGNETIC RADIATION 有权
    组装电磁辐射和产生电磁辐射的装置的方法

    公开(公告)号:US20160056349A1

    公开(公告)日:2016-02-25

    申请号:US14782092

    申请日:2014-03-25

    Abstract: An electromagnetic radiation emitting assembly includes a carrier, an electromagnetic radiation emitting component arranged above the carrier, and a potting material at least partly surrounding the electromagnetic radiation emitting component and into which are embedded phosphor that converts the electromagnetic radiation and heat-conducting particles that conduct heat arising during operation of the electromagnetic radiation emitting assembly, wherein a phosphor concentration in the potting material near the electromagnetic radiation emitting component is greater than a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component, and a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component is greater than in the potting material remote from the electromagnetic radiation emitting component.

    Abstract translation: 电磁辐射发射组件包括载体,布置在载体上方的电磁辐射发射部件和至少部分围绕电磁辐射发射部件的灌封材料,嵌入的荧光体转换电导辐射和导电颗粒的导体 在电磁辐射发射组件的操作期间产生的热量,其中电磁辐射发射部件附近的灌封材料中的荧光体浓度大于电磁辐射发射部件附近的灌封材料中的导热颗粒的颗粒浓度, 在电磁辐射发射部件附近的封装材料中的导热颗粒的颗粒浓度大于远离电磁辐射发射部件的灌封材料中的导热颗粒的颗粒浓度。

    Method for producing a conversion element

    公开(公告)号:US10287492B2

    公开(公告)日:2019-05-14

    申请号:US15752563

    申请日:2016-08-05

    Inventor: Kathy Schmidtke

    Abstract: A method for producing a conversion element is disclosed. In an embodiment, the method includes providing an acidic medium having a pH value of less than 2, adding a conversion material into the acidic medium thereby forming a mixture and adding a silicate solution having a viscosity between 2 to 10 000 poize inclusive to the mixture such that the pH value during the addition of the silicate solution is smaller than 2. The method further includes obtaining a precipitate which contains the conversion material and silicon dioxide as a matrix material, separating the precipitate, washing the precipitate with a washing medium, wherein the washing medium has a pH value of less than 2; and hardening the precipitate thereby forming the conversion element.

    METHOD OF PRODUCING A LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE

    公开(公告)号:US20180033925A1

    公开(公告)日:2018-02-01

    申请号:US15550968

    申请日:2016-02-17

    Abstract: A method of producing a light-emitting device includes providing a carrier having a carrier top face and at least one light-emitting semiconductor chip arranged on the carrier top face, wherein the semiconductor chip has a radiation emission face and is arranged on the carrier top face such that the radiation emission face faces away from the carrier top face; arranging a converter element on the at least one semiconductor chip on its radiation emission face so that the converter element fully covers the radiation emission face of the semiconductor chip and extends laterally beyond the semiconductor chip; covering the converter element with an encapsulant, and compression molding and curing the encapsulant so that the encapsulant covers the converter element on a face facing away from the semiconductor chip, and the converter element and the encapsulant fit closely against the radiation emission face and at least against a side face of the semiconductor chip; and detaching the encapsulant, together with the converter element and the semiconductor chip, from the carrier.

    Optoelectronic component
    20.
    发明授权

    公开(公告)号:US11621378B2

    公开(公告)日:2023-04-04

    申请号:US16355895

    申请日:2019-03-18

    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that, during intended operation, generates primary radiation coupled out of the semiconductor chip via an emission side of the semiconductor chip; and a first conversion element on the emission side, wherein the first conversion element includes a first matrix material and first phosphor particles in the form of quantum dots, the first phosphor particles are distributed and embedded in the first matrix material, and the first matrix material is formed by a polysiloxane in which an atomic percentage of carbon is smaller than an atomic percentage of oxygen.

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