公开(公告)号：US20150282307A1

公开(公告)日：2015-10-01

申请号：US14613591

申请日：2015-02-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Shoji WATANABE ,  Toshinori KOYAMA ,  Akio ROKUGAWA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/10156 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13666 ,  H01L2224/13687 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/0352 ,  H05K2203/025 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/04941

Abstract: A wiring board includes first insulating layers; first wiring layers; first via wirings; second insulating layers; second wiring layers; second via wirings; and a solder resist layer, wherein the first insulating layers are composed of non-photosensitive resin, wherein the second insulating layers, and the solder resist layer are composed of photosensitive resin, respectively, wherein the first surface of the uppermost first insulating layer and the first end surface of the first via wiring embedded in the uppermost first insulating layer are polished surfaces, wherein the first end surface of the first via wiring embedded in the uppermost first insulating layer is flush with the first surface of the uppermost first insulating layer, and wherein the wiring density of the second wiring layers is higher than the wiring density of the first wiring layers.

Abstract translation: 布线板包括第一绝缘层; 第一布线层; 首先通过布线; 第二绝缘层; 第二布线层; 第二条通过布线; 以及阻焊层，其中，所述第一绝缘层由非感光性树脂构成，所述第二绝缘层和所述阻焊层分别由感光性树脂构成，其中，所述第一绝缘层和所述第二绝缘层的第一表面 嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面是抛光表面，其中嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面与最上面的第一绝缘层的第一表面齐平， 其中所述第二布线层的布线密度高于所述第一布线层的布线密度。

公开(公告)号：US20150179560A1

公开(公告)日：2015-06-25

申请号：US14548784

申请日：2014-11-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiromu Arisaka ,  Noriyoshi SHIMIZU ,  Masato TANAKA ,  Tetsuya KOYAMA ,  Akio ROKUGAWA

IPC: H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/0137 ,  H05K2201/029 ,  H05K2201/0296 ,  H01L2924/00

Abstract: A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers each formed from a thermosetting insulative resin including a reinforcement material, and a via wire formed in the first insulation layer. The second wiring structure includes a wiring layer formed on upper surfaces of the first insulation layer and the via wire, an insulation layer formed on the upper surface of the first insulation layer, and an uppermost wiring layer including a pad used to electrically connect a semiconductor chip and the wiring layer. An outermost insulation layer stacked on a lower surface of the second insulation layer exposes a portion of a lowermost wiring layer stacked on the lower surface of the second insulation layer as an external connection pad. The second wiring structure has a higher wiring density than the first wiring structure.

Abstract translation: 布线基板包括第一和第二布线结构。 第一布线结构包括芯基板，由包括增强材料的热固性绝缘树脂形成的第一绝缘层和第二绝缘层，以及形成在第一绝缘层中的通孔布线。 第二布线结构包括形成在第一绝缘层和通孔导线的上表面上的布线层，形成在第一绝缘层的上表面上的绝缘层，以及包括用于将半导体 芯片和布线层。 堆叠在第二绝缘层的下表面上的最外绝缘层暴露作为外部连接焊盘堆叠在第二绝缘层的下表面上的最下布线层的一部分。 第二布线结构具有比第一布线结构更高的布线密度。

公开(公告)号：US20150163899A1

公开(公告)日：2015-06-11

申请号：US14625757

申请日：2015-02-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Hitoshi SAKAGUCHI ,  Wataru KANEDA ,  Masato TANAKA ,  Akio ROKUGAWA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L23/5383 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K3/4007 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/025 ,  H01L2924/00

Abstract: A wiring board includes first insulating layers and second insulating layers formed on a core layer in this order; a third insulating layer and a solder resist layer formed on another surface of the core layer in this order, first wiring layers and second wiring layers formed in the first insulating layers and the second insulating layers, respectively, wherein a first end surface of the first via wiring exposes from the first surface of the outermost first insulating layer to be directly connected with an outermost second wiring layer, the first via wiring and the outermost second wiring layer being separately formed, the first surface of the outermost first insulating layer and the first end surface of the first via wiring are polished surfaces, smooth surfaces and are flush with each other, and the wiring density of the second wiring layers is higher than that of the first wiring layers.

Abstract translation: 布线板依次包括在芯层上形成的第一绝缘层和第二绝缘层; 依次形成在芯层的另一表面上的第三绝缘层和阻焊层，分别形成在第一绝缘层和第二绝缘层中的第一布线层和第二布线层，其中第一绝缘层和第一绝缘层的第一端面 通过布线从最外侧的第一绝缘层的第一表面暴露出来，与最外层的第二布线层直接连接，第一通孔布线和最外层的第二布线层被分开地形成，最外面的第一绝缘层的第一表面和第一 第一通孔布线的端面是抛光表面，光滑的表面并且彼此齐平，并且第二布线层的布线密度高于第一布线层的布线密度。

公开(公告)号：US20140150258A1

公开(公告)日：2014-06-05

申请号：US14090076

申请日：2013-11-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Akio ROKUGAWA ,  Toshinori KOYAMA ,  Wataru KANEDA

IPC: H05K3/46

CPC classification number: H05K3/007 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/09527 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring substrate includes a core portion and a wiring portion. The core portion includes a wiring layer and an organic resin core substrate. The wiring portion includes wiring layers and organic resin insulative layers. The wiring layer of the core portion is formed in a state in which the organic resin core substrate is supported by a support body. The wiring layers of the wiring portion are formed in a state in which the organic resin core substrate is adhered to a support body and the wiring layer of the core portion faces toward the support body.

Abstract translation: 布线基板包括芯部和布线部。 芯部包括布线层和有机树脂芯基板。 布线部分包括布线层和有机树脂绝缘层。 芯部的布线层形成为有机树脂芯基板由支撑体支撑的状态。 布线部分的布线层形成为有机树脂芯基板粘附到支撑体并且芯部的布线层朝向支撑体的状态。