公开(公告)号：US20120006679A1

公开(公告)日：2012-01-12

申请号：US12833711

申请日：2010-07-09

Applicant: Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

Inventor： Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

IPC: C25B11/00 ,  B23K31/02 ,  B23K20/12

CPC classification number: C25C7/02 ,  B23K20/1265 ,  B23K20/127 ,  B23K20/129

Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.

Abstract translation: 使用摩擦搅拌焊接（FSW）接头形成电化学阳极。 母线和阳极片或铅封装和阳极片之间可以形成FSW接头。 FSW接头还可以包括圆角和对接接头。 也可以使用FSW接头来密封电化学阳极的端部以防止腐蚀。

公开(公告)号：US06885104B2

公开(公告)日：2005-04-26

申请号：US10153451

申请日：2002-05-22

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H01L29/40 ,  H01L21/94 ,  B23K20/12 ,  B23K31/02 ,  B23K1/00

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

公开(公告)号：US06413576B1

公开(公告)日：2002-07-02

申请号：US09412542

申请日：1999-10-05

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC: B05D512

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.

Abstract translation: 用于保护铜电路的未绝缘部分的表面的方法免受不利于将表面连接到另一金属表面的环境污染物，所述方法包括用具有适于焊接的厚度的陶瓷材料层涂覆表面的步骤 没有助熔剂，并且当表面被接合以获得表面之间的金属对金属接触时，它是足够脆的。 还公开了包括半导体晶片的涂覆电子封装。

公开(公告)号：US08714361B2

公开(公告)日：2014-05-06

申请号：US12776822

申请日：2010-05-10

Applicant: Timothy W. Ellis

Inventor： Timothy W. Ellis

IPC: B02C23/10 ,  B02C23/14 ,  B03B9/06 ,  B03D1/02 ,  B03D1/08

CPC classification number: H01M10/54 ,  B03D1/02 ,  H01M6/52 ,  Y02W30/84

Abstract: Materials in battery and electrochemical cells are separated in a form suitable for recycling by employing froth flotation techniques. Bulk materials, such as casings, are removed from converted battery scrap and the resultant pulp is subjected to froth flotation. Froth flotation agents, including frothers, collectors and/or depressants, are used to manipulate the hydrophilic and hydrophobic nature of the materials in the scrap. Hydrophobic materials are entrained in the air bubbles of the froth and float out of the froth flotation vessel while those that are hydrophilic remain in the vessel, thereby separating battery grid materials without resort to pyrometallurgical, energy intensive or other environmentally undesirable processes.

Abstract translation: 电池和电化学电池中的材料通过使用泡沫浮选技术以适于再循环的形式分离。 散装材料，例如外壳，从转换后的电池废料中取出，所得纸浆进行泡沫浮选。 泡沫浮选剂，包括起泡剂，收集剂和/或抑制剂，用于操纵废料中材料的亲水性和疏水性。 疏水材料被夹带在泡沫的气泡中并漂浮在泡沫浮选槽中，而亲水的那些留在容器中，从而分离电池栅格材料，而不需要采用火法冶金，能源密集型或其他不利环境的方法。

公开(公告)号：US06534877B2

公开(公告)日：2003-03-18

申请号：US10051482

申请日：2002-01-18

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

IPC: H01L2348

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/85 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/85075 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  Y10S438/976 ,  H01L2224/48 ,  H01L2924/00015

Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

公开(公告)号：US09156038B2

公开(公告)日：2015-10-13

申请号：US13435143

申请日：2012-03-30

Applicant: Timothy W. Ellis ,  Joshua A. Montenegro

Inventor： Timothy W. Ellis ,  Joshua A. Montenegro

IPC: B03C1/30 ,  B03C1/28 ,  B03C1/32 ,  H01M10/54

CPC classification number: B03C1/286 ,  B03C1/032 ,  B03C1/0335 ,  B03C1/034 ,  B03C1/32 ,  B03C2201/18 ,  B07B1/46 ,  B07B1/4609 ,  B07B1/4645 ,  H01M10/54 ,  Y02W30/84

Abstract: A process and system for the separation of materials from electrochemical cells is disclosed. Electrode materials are removed from electrochemical cells and separated into constituent active materials using magnetic separation.

Abstract translation: 公开了一种用于从电化学电池分离材料的方法和系统。 从电化学电池中除去电极材料，并使用磁选分离成组分活性材料。

公开(公告)号：US20130256198A1

公开(公告)日：2013-10-03

申请号：US13435143

申请日：2012-03-30

Applicant: Timothy W. Ellis ,  Joshua A. Montenegro

Inventor： Timothy W. Ellis ,  Joshua A. Montenegro

IPC: B03C1/025 ,  B02C23/14 ,  H01M4/48 ,  B03C1/005

CPC classification number: B03C1/286 ,  B03C1/032 ,  B03C1/0335 ,  B03C1/034 ,  B03C1/32 ,  B03C2201/18 ,  B07B1/46 ,  B07B1/4609 ,  B07B1/4645 ,  H01M10/54 ,  Y02W30/84

Abstract: A process and system for the separation of materials from electrochemical cells is disclosed. Electrode materials are removed from electrochemical cells and separated into constituent active materials using magnetic separation.

Abstract translation: 公开了一种用于从电化学电池分离材料的方法和系统。 从电化学电池中除去电极材料，并使用磁选分离成组分活性材料。

公开(公告)号：US08313622B2

公开(公告)日：2012-11-20

申请号：US12833711

申请日：2010-07-09

Applicant: Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

Inventor： Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

IPC: C25B9/02 ,  C25B11/02 ,  C25B11/04 ,  C25B11/16

CPC classification number: C25C7/02 ,  B23K20/1265 ,  B23K20/127 ,  B23K20/129

Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.

Abstract translation: 使用摩擦搅拌焊接（FSW）接头形成电化学阳极。 母线和阳极片或铅封装和阳极片之间可以形成FSW接头。 FSW接头还可以包括圆角和对接接头。 也可以使用FSW接头来密封电化学阳极的端部以防止腐蚀。

公开(公告)号：US07199475B2

公开(公告)日：2007-04-03

申请号：US11084985

申请日：2005-03-21

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC: H01L23/52

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

Abstract translation: 具有非绝缘部分的铜电路的电子封装件被涂覆层保护，其涂层厚度适于焊接而不进行焊接，并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。

公开(公告)号：US06352743B1

公开(公告)日：2002-03-05

申请号：US09330906

申请日：1999-06-11

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

IPC: B05D512

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/85 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/85075 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  Y10S438/976 ,  H01L2224/48 ,  H01L2924/00015

Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

Abstract translation: 通过涂覆具有适合焊接的厚度的陶瓷材料的层而不会熔化并且在球中足够脆弱的陶瓷材料层，从而防止大气污染物或从铜半导体接合焊盘的接合表面除去大气污染物的方法 或楔形线接合，以在接合表面和与其接合的线之间获得金属对金属的接触。 还公开了涂覆的半导体晶片。