公开(公告)号：US11764444B2

公开(公告)日：2023-09-19

申请号：US17564012

申请日：2021-12-28

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Wencai Xu ,  Xuguang Wang ,  Jihua Yao ,  Mu Qian

IPC: H01M50/519 ,  B60L50/60 ,  H01M10/42 ,  H01R13/66 ,  H02J7/00

CPC classification number: H01M50/519 ,  B60L50/66 ,  H01M10/425 ,  H01M10/4207 ,  H01R13/6683 ,  H02J7/0063 ,  H01M2220/20 ,  H01R2201/26 ,  H05K2201/09009

Abstract: The application discloses a connecting assembly, a battery module, a battery group, and a device using the battery module as a power supply. The connecting assembly includes a plurality of connecting sheets, a sampling assembly, and an insulating film, where the plurality of connecting sheets are configured to connect battery cells of the battery module; the sampling assembly includes a circuit board and a sampling terminal connected to the circuit board; the sampling terminal is connected to the plurality of connecting sheets, the insulating film is provided at one side of the sampling assembly and the plurality of connecting sheets, and the insulating film connects the sampling assembly to the plurality of connecting sheets to form an integral structure with the sampling assembly and the plurality of connecting sheets, an insulating film through hole is provided in a region of the sampling assembly covered by the insulating film.

公开(公告)号：US20180356085A1

公开(公告)日：2018-12-13

申请号：US15684665

申请日：2017-08-23

Applicant: Fluence Bioengineering

Inventor： Dung Duong

IPC: F21V29/70 ,  F21V7/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/05

CPC classification number: F21V23/005 ,  A01G7/045 ,  F21K9/232 ,  F21K9/90 ,  F21S4/28 ,  F21V7/005 ,  F21V7/0066 ,  F21V7/05 ,  F21V15/015 ,  F21V17/107 ,  F21V19/0015 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V23/0442 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0272 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/0277 ,  H05K1/05 ,  H05K1/056 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106

Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.

公开(公告)号：US20180356077A1

公开(公告)日：2018-12-13

申请号：US15688358

申请日：2017-08-28

Applicant: Fluence Bioengineering

Inventor： Dung Duong ,  Randy Johnson ,  Nick Klase

IPC: F21V19/00 ,  F21V17/10 ,  F21V23/00 ,  F21V23/02 ,  F21V29/70 ,  F21V15/015 ,  F21S4/28 ,  H05K1/05

CPC classification number: F21V23/005 ,  A01G7/045 ,  F21K9/232 ,  F21K9/90 ,  F21S4/28 ,  F21V7/005 ,  F21V7/0066 ,  F21V7/05 ,  F21V15/015 ,  F21V17/107 ,  F21V19/0015 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V23/0442 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0272 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/0277 ,  H05K1/05 ,  H05K1/056 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106

Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.

公开(公告)号：US09992897B2

公开(公告)日：2018-06-05

申请号：US15255026

申请日：2016-09-01

Applicant: Samsung Display Co., Ltd.

Inventor： Minsoo Kim ,  Kinyeng Kang

IPC: H05K1/00 ,  H05K7/14 ,  G06F3/14 ,  H05K5/00 ,  H05K1/11 ,  H05K1/02 ,  G09G3/20

CPC classification number: H05K7/1427 ,  G06F3/1446 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2380/02 ,  H05K1/028 ,  H05K1/111 ,  H05K5/0017 ,  H05K2201/09009

Abstract: A display device is disclosed. In one aspect, the display device includes a first display unit including a first display area, a first left pad area outside a first left end portion of the first display area, and a first right pad area outside a first right end portion of the first display area. The first right end portion is opposite to the first left end portion. The first display unit is bent at a first portion between the first display area and the first left pad area and bent at a second portion between the first display area and the first right pad area. The first display area is bent such that the first left and right end portions are adjacent to each other, and the first left and right pad areas are located inside the first display unit. The display device also includes a first printed circuit board corresponding to both the first left and right pad areas.

公开(公告)号：US09955571B2

公开(公告)日：2018-04-24

申请号：US15700433

申请日：2017-09-11

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/12 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US09807885B2

公开(公告)日：2017-10-31

申请号：US15138792

申请日：2016-04-26

Applicant: IBIDEN CO., LTD.

Inventor： Kenji Sakai ,  Tomoyuki Ikeda ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/02 ,  H05K3/46 ,  H05K3/32

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H05K1/0298 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09009 ,  H05K2201/09536 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611

Abstract: A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

公开(公告)号：US20170118835A1

公开(公告)日：2017-04-27

申请号：US15296435

申请日：2016-10-18

Applicant: Valeo Vision

Inventor： Olivier Badia

IPC: H05K1/02 ,  B60Q1/04 ,  H05K1/03

CPC classification number: H05K1/0281 ,  B60Q1/0088 ,  B60Q1/04 ,  B60Q1/076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/046 ,  H05K2201/09009 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: A flexible printed circuit board, configured to receive electronic components, comprising an electrically insulating flexible element, configured to bear conductive component-connecting tracks, the flexible element being further configured to be bent according to a curvature, the board further comprising an electrically insulating reinforcing element, mechanically secured to the flexible element, extending on one side of the curvature, and comprising two parts: a first part being substantially planar and a second part exhibiting a predefined curvature, arranged on the side of the curvature of the flexible element, the reinforcing element being arranged so as to leave a free part for the flexible element to be bent according to the curvature.

公开(公告)号：US09596751B2

公开(公告)日：2017-03-14

申请号：US14773558

申请日：2015-03-30

Applicant: KYOCERA Corporation

Inventor： Hiroshi Yamada ,  Takuji Okamura

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H01L23/053 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H05K1/00 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/053 ,  H01L23/13 ,  H01L23/15 ,  H01L23/36 ,  H01L23/562 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/3511 ,  H05K1/0313 ,  H05K1/182 ,  H05K2201/09009 ,  H01L2924/00014

Abstract: There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.

Abstract translation: 提供了一种用于安装电子元件的基板，包括：框状的第一布线基板，其第一通孔形成在其内部; 平板状或框状的第二布线基板，被布置成与第一布线基板的底表面重叠并与其电连接; 以及片状金属片，其布置成与第二布线基板的底表面重叠，使得第二布线基板夹在第一布线基板和金属片之间，框架状的第一布线基板内的区域或内部的区域 框状的第一布线基板和第二布线基板是电子元件安装区域，第二布线基板的弹性模量低于第一布线基板和金属板的弹性模量。

公开(公告)号：US09504148B1

公开(公告)日：2016-11-22

申请号：US14957426

申请日：2015-12-02

Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/03 ,  H05K3/38 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

Abstract translation: PCB页面空白包括柔性基板，可固化粘合剂，导电层和导电层支撑件。 柔性基板在其上接收不透明的负电路图案。 不会被电路图案遮挡的可固化粘合剂的部分可能在暴露于光时粘合到导电层的部分。 导电层的接合部分从导电层的非接合部分剪切或撕裂，使得接合部分保留在柔性基板上，并且当柔性基板和导电层支撑时，非接合部分保留在导电层支撑件 被分开 因此，柔性基板和导电层的接合部分形成PCB原型，其中导电层的接合部分形成电路图案的电路迹线。

公开(公告)号：US20160242281A1

公开(公告)日：2016-08-18

申请号：US15139482

申请日：2016-04-27

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Tomota Nagaura ,  Michiya Kohiki ,  Terumasa Moriyama

IPC: H05K1/09

CPC classification number: H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Abstract translation: 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。