公开(公告)号：US09779848B2

公开(公告)日：2017-10-03

申请号：US14476974

申请日：2014-09-04

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Jerry Wu ,  Jun Chen ,  Fan-Bo Meng

IPC: H05K1/03 ,  H01B1/02 ,  H01B7/08 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01B1/02 ,  H01B7/0861 ,  H05K1/0224 ,  H05K1/118 ,  H05K2201/09245

Abstract: A flat cable (100) includes an insulative carrier (20) extending along a front-to-back direction, a set of signal conductors (10) held by the insulative carrier, and a metal grid layer (30) attached to the insulative carrier. The insulative carrier has a top face facing upwardly and a bottom face facing downwardly. The insulative carrier defines a set of receiving passageways (210) disposed along a transverse direction perpendicular to the front-to-back direction. The set of signal conductors extend along the front-to-back direction and have different pitches along the transverse direction. The metal grid layer is attached to the top face or the bottom face. The metal grid layer has different densities along the front-to-back direction in order to make the impedance of the flat cable consistent along the front-to-back direction.

公开(公告)号：US20170118838A1

公开(公告)日：2017-04-27

申请号：US14919594

申请日：2015-10-21

Applicant: Applied BioPhotonics, Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/02 ,  H05K3/32 ,  H05K3/06 ,  H05K3/00 ,  H05K3/36 ,  H05K3/18

CPC classification number: H05K1/148 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/24 ,  H05K3/32 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

公开(公告)号：US20170064817A1

公开(公告)日：2017-03-02

申请号：US14843115

申请日：2015-09-02

Applicant: SAE Magnetics (H.K.) Ltd.

Inventor： Fuk Ming LAM

IPC: H05K1/02 ,  H05K1/11 ,  H01P9/00

CPC classification number: H05K1/0245 ,  H05K1/0215 ,  H05K1/0248 ,  H05K1/115 ,  H05K2201/09245

Abstract: A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.

Abstract translation: PCB包括至少包括第一金属层，第二金属层和夹在其间的第一接地层的PCB​​体; 以及包括第一传输线导体和第二传输线导体的一对传输线。 第一传输线导体位于第一金属层中，其第一金属层在其两端具有两个直线部分，在其中间具有一个曲线部分，第二传输线导体在其两端具有两个位于 第一金属层和中间的交叉通孔结构，其具有掩埋在第二金属层中的掩埋迹线，并且曲线部分和掩埋迹线由第一接地层隔离。 差分传输电路的偏斜效应降低，从而提高信号传输质量，提高信号传输速度。

公开(公告)号：US09583809B2

公开(公告)日：2017-02-28

申请号：US14509285

申请日：2014-10-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Satoshi Ishino ,  Jun Sasaki

IPC: H01P3/00 ,  H01P3/08 ,  H01P3/02 ,  H01P5/02 ,  H05K1/02

CPC classification number: H01P3/003 ,  H01P3/026 ,  H01P3/08 ,  H01P3/082 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0225 ,  H05K1/0251 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09636 ,  H05K2201/097

Abstract: A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.

Abstract translation: 高频信号线包括具有第一层级和第二层级的主体; 信号线，包括设置在第一层级的第一线部分，设置在第二层级的第二线部分和连接第一线部分和第二线部分的第一层间连接; 第一接地导体，包括设置在第一层级的第一接地部分; 第二接地导体，包括设置在第二层级的第二接地部分; 以及连接所述第一接地部和所述第二接地部的第二层间连接。 第一层间连接和第二层间连接之间的距离不小于第一线部分和第一接地部分之间的最大距离，并且不小于第二线路部分和第二接地部分之间的最大距离。

公开(公告)号：US09557854B2

公开(公告)日：2017-01-31

申请号：US15010744

申请日：2016-01-29

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/11 ,  G06F1/16 ,  H05K1/02 ,  H05K3/36

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

Abstract translation: 显示装置包括显示面板和与显示面板重叠形成的静电电容式触摸面板。 多个X电极和与X电极交叉的多个Y电极。 第一信号线向X电极提供信号，第二信号线向Y电极提供信号，并且第一信号线和第二信号线形成在柔性印刷电路板上。 在每个X电极和Y电极的电极部分的电极部分附近形成虚拟电极，虚拟电极不与X电极和Y电极重叠，并且虚拟电极不与第一和第二信号电连接 线条。

公开(公告)号：US20160351216A1

公开(公告)日：2016-12-01

申请号：US15234670

申请日：2016-08-11

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime ARAI

IPC: G11B5/48 ,  G11B5/127 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/18

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities, and further including a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Abstract translation: 包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬挂的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线， 并且还包括堆叠交错部分，其包括电连接到写入布线的各个线的部分，所述片段通过电绝缘层堆叠在并面对电线，使得所述相对的线和片段具有相反的极性。

公开(公告)号：US09490513B2

公开(公告)日：2016-11-08

申请号：US14503612

申请日：2014-10-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Sasaki ,  Nobuo Ikemoto ,  Shigeru Tago

IPC: H01P3/08 ,  H01P3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC classification number: H01P3/003 ,  H01P3/08 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0253 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/147 ,  H05K2201/09245 ,  H05K2201/09281 ,  H05K2201/09727

Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.

Abstract translation: 电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。 信号线设置在电介质元件组件中并沿x轴方向延伸。 参考接地导体相对于信号线在z轴方向的正侧设置。 辅助接地导体相对于信号线设置在z轴方向的负侧。 通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。 包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。

公开(公告)号：US09444160B2

公开(公告)日：2016-09-13

申请号：US14451470

申请日：2014-08-05

Applicant: Hirose Electric Co., Ltd.

Inventor： Nobuhiro Tamai

IPC: H01R12/70 ,  H05K1/02

CPC classification number: H01R12/7082 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09336

Abstract: An electrical connector is to be connected to a mating connector. The electrical connector includes a circuit board member formed of an insulation plate member; and a holding member for holding the circuit board member. The circuit board member includes a connecting portion to be connected with a mating connector of the mating connector. The connecting portion includes a pair of conductive band portions and a first insulation region disposed between the conductive band portions.

Abstract translation: 电连接器将连接到配对连接器。 电连接器包括由绝缘板构件形成的电路板构件; 以及用于保持电路板构件的保持构件。 电路板构件包括与配合连接器的配合连接器连接的连接部分。 连接部分包括一对导电带部分和设置在导电带部分之间的第一绝缘区域。

公开(公告)号：US09407044B2

公开(公告)日：2016-08-02

申请号：US14474479

申请日：2014-09-02

Applicant: Panduit Corp.

Inventor： Jack E. Caveney ,  Masud Bolouri-Saransar ,  Scott M. Lesniak

IPC: H01R24/00 ,  H01R13/6461 ,  H05K1/02 ,  H01R12/67 ,  H01R13/6466 ,  H01R13/719 ,  H01R12/77 ,  H01R13/46 ,  H01R4/24 ,  H01R12/59 ,  H01R12/62 ,  H01R13/66 ,  H05K1/18 ,  H01R13/6467 ,  H01R24/64

CPC classification number: H01R24/64 ,  H01R4/2429 ,  H01R4/2433 ,  H01R12/592 ,  H01R12/62 ,  H01R12/675 ,  H01R12/775 ,  H01R13/46 ,  H01R13/502 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/62 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/49222

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

Abstract translation: 用于模块化通信连接器的插座中的串扰补偿的装置和方法包括连接到插座触点和连接到网络电缆的柔性印刷电路板。 柔性印刷电路板包括布置成一个或多个耦合以提供串扰补偿的导电迹线。

公开(公告)号：US20160105954A1

公开(公告)日：2016-04-14

申请号：US14877424

申请日：2015-10-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05

CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056 ,  H05K3/4685 ,  H05K2201/09245 ,  H05K2203/0323

Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.

Abstract translation: 具有电路的悬挂板包括金属支撑板，第一绝缘层，包括形成在金属支撑板的厚度方向上的一侧的布置部分;第一导电层，包括形成在第一导电层的一侧的第一导线部分 绝缘层，包括覆盖第一导线部分的覆盖部分的第二绝缘层，以及包括形成在第二绝缘层一侧的第二导线部分和连接到第一或第二导线部分的端子部分的第二导电层。 第二绝缘层包括形成在端子部分另一端的第二端子支撑部分。 第一绝缘层包括形成在第二端子支撑部分的另一侧的第一端子支撑部分。 金属支撑板不形成在其另一侧。