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    Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
    203.
    发明授权
    Electronic module having a three dimensional array of carrier-mounted integrated circuit packages 有权

    公开(公告)号：US06487078B2

    公开(公告)日：2002-11-26

    申请号：US09524324

    申请日：2000-03-13

    Applicant: Kenneth J. Kledzik ,  Jason C. Engle

    Inventor： Kenneth J. Kledzik ,  Jason C. Engle

    IPC: H05H720

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier rightside up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

    ELECTRONIC MODULE HAVING A THREE DIMENSIONAL ARRAY OF INTEGRATED CIRCUIT PACKAGES
    204.
    发明申请
    ELECTRONIC MODULE HAVING A THREE DIMENSIONAL ARRAY OF INTEGRATED CIRCUIT PACKAGES 有权

    公开(公告)号：US20020135982A1

    公开(公告)日：2002-09-26

    申请号：US09524324

    申请日：2000-03-13

    Inventor： Kenneth J. Kledzik ,  Jason C. Engle

    IPC: H05K007/20

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right-side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

    Arrangement for mounting a component upstanding on a carrier with surface mounted leads
    206.
    发明授权
    Arrangement for mounting a component upstanding on a carrier with surface mounted leads 失效
    用于将表面安装引线安装在载体上的部件的安排

    公开(公告)号：US06268651B1

    公开(公告)日：2001-07-31

    申请号：US09442034

    申请日：1999-11-17

    Applicant: Eva Hellgren ,  Mats Eriksson

    Inventor： Eva Hellgren ,  Mats Eriksson

    IPC: H01L2348

    CPC classification number: H05K3/366 ,  H05K3/303 ,  H05K13/046 ,  H05K2201/10386 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

    Abstract: There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a “Single-In-Line” technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

    Abstract translation: 电子行业倾向于可以表面安装在诸如电路板的载体上的部件。 通过使用“单列直插”技术在部件上使用表面可安装引线，可以将表面安装在电路板（7）上的部件（5），并将元件引线表面安装在电路板上。 引线（8）可以在它们的下端弯曲并且设置有用于与板有效接触的脚（10）。 引导和支撑销可用于在安装和连接部件时将部件保持在适当位置，并在安装在电路板上时将部件上的导线支撑。

    Method and an arrangement for mounting a component on a carrier
    208.
    发明授权
    Method and an arrangement for mounting a component on a carrier 失效
    用于将部件安装在载体上的方法和装置

    公开(公告)号：US6010920A

    公开(公告)日：2000-01-04

    申请号：US977235

    申请日：1997-11-24

    Applicant: Eva Hellgren ,  Mats Eriksson

    Inventor： Eva Hellgren ,  Mats Eriksson

    IPC: H05K3/30 ,  H05K3/36 ,  H05K13/04 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC classification number: H05K3/366 ,  H05K13/046 ,  H05K3/303 ,  H05K2201/10386 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

    Abstract: There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

    Abstract translation: 电子行业倾向于可以表面安装在诸如电路板的载体上的部件。 通过使用“单列直插”技术在部件上使用表面可安装引线，可以将表面安装在电路板（7）上的部件（5），并将元件引线表面安装在电路板上。 引线（8）可以在它们的下端弯曲并且设置有用于与板有效接触的脚（10）。 引导和支撑销可用于在安装和连接部件时将部件保持在适当位置，并在安装在电路板上时将部件上的导线支撑。

    Connector having adjustable solder tab
    209.
    发明授权
    Connector having adjustable solder tab 失效
    连接器具有可调焊片

    公开(公告)号：US5934936A

    公开(公告)日：1999-08-10

    申请号：US104842

    申请日：1998-06-25

    Applicant: Allen Chiu ,  Jia-Hung Liu ,  Jerry Wu

    Inventor： Allen Chiu ,  Jia-Hung Liu ,  Jerry Wu

    IPC: H01R13/73 ,  H05K3/34

    CPC classification number: H01R12/7058 ,  H01R12/707 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K2203/306 ,  H05K3/3426 ,  Y02P70/613

    Abstract: A connector equipped with auxiliary solder tabs which are self-adjustable as to height for ensuring coplanarity between solder terminals of the connector and the auxiliary solder tabs. The self-adjustability of the tabs ensures that the tabs will always properly contact a circuit board to which the connector is to be connected, independent of the plane defined by the solder terminal. The connector has at least one extension wall and various embodiments are proposed to achieve a pivotable relationship between the solder tab and the extension wall(s).

    Abstract translation: 配有辅助焊接片的连接器，其可自动调节高度，以确保连接器的焊接端子和辅助焊接片之间的共面性。 接头的自调整性确保了接头将始终与连接器要连接的电路板正确接触，而与焊接端子所界定的平面无关。 连接器具有至少一个延伸壁，并且提出了各种实施例以实现焊接片和延伸壁之间的可枢转关系。

    Method of mounting microelectronic circuit package
    210.
    发明授权
    Method of mounting microelectronic circuit package 失效
    安装微电子电路封装的方法

    公开(公告)号：US5896651A

    公开(公告)日：1999-04-27

    申请号：US713174

    申请日：1996-09-12

    Applicant: Emily Hawthorne

    Inventor： Emily Hawthorne

    IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H05K3/30

    CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

    Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

    Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

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