公开(公告)号：US09171818B2

公开(公告)日：2015-10-27

申请号：US13323843

申请日：2011-12-13

Applicant: Da-Jung Chen ,  Wen-Hsiung Liao ,  Chun-Fu Hu

Inventor： Da-Jung Chen ,  Wen-Hsiung Liao ,  Chun-Fu Hu

IPC: H05K1/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/2902 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/30181 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/32507 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/83418 ,  H01L2224/83439 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

Abstract translation: 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括​​第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。

公开(公告)号：US09025295B2

公开(公告)日：2015-05-05

申请号：US14162185

申请日：2014-01-23

Applicant: Cyntec Co., Ltd.

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Lang-Yi Chiang ,  Wen-Shiang Luo ,  Kuo-Shu Chen ,  Han-Yang Chung ,  Hui-Wen Hsu ,  Po-Wei Su ,  Hong-Ming Chen

IPC: H02H5/00 ,  H01H85/041 ,  H01H85/00 ,  H01H69/02 ,  H01H85/046

CPC classification number: H01H85/0411 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0065 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H85/18 ,  H01H2085/466

Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.

Abstract translation: 保护装置包括基板，电极层，金属结构，外盖和灭弧结构。 电极层设置在基板上。 电极层包括至少一个间隙。 金属结构设置在电极层上并位于间隙上方，金属结构的熔融温度低于电极层的熔融温度。 外盖设置在基板上并覆盖金属结构和电极层的一部分。 灭弧结构设置在外盖和基板之间。 还提供保护模块。

公开(公告)号：US09024204B2

公开(公告)日：2015-05-05

申请号：US13548015

申请日：2012-07-12

Applicant: Yen-Ting Lin ,  Dar-Win Lo ,  Sung-Chan Yen ,  Hsing-Kai Cheng

Inventor： Yen-Ting Lin ,  Dar-Win Lo ,  Sung-Chan Yen ,  Hsing-Kai Cheng

IPC: H05K1/16 ,  B32B37/02 ,  H01C1/142 ,  H01C7/00 ,  H01C7/06 ,  B32B37/12

CPC classification number: B32B37/02 ,  B32B37/1207 ,  B32B2309/105 ,  B32B2363/00 ,  B32B2457/08 ,  H01C1/142 ,  H01C7/003 ,  H01C7/06 ,  Y10T156/10

Abstract: A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

Abstract translation: 电阻器件包括电阻层，布置在电阻层上的柔性衬底和电极层。 电极层包括布置在电阻层下方并彼此分离的两个电极部分。 此外，还公开了一种用于制造具有柔性衬底的电阻器件的方法。

公开(公告)号：US08906741B2

公开(公告)日：2014-12-09

申请号：US13175362

申请日：2011-07-01

Applicant: Bau-Ru Lu ,  Kai-Peng Chiang ,  Da-Jung Chen ,  Tsung-Chan Wu

Inventor： Bau-Ru Lu ,  Kai-Peng Chiang ,  Da-Jung Chen ,  Tsung-Chan Wu

IPC: H01L21/00 ,  H01L23/31 ,  H01L23/64 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01F27/306 ,  H01F27/29 ,  H01F2027/297 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer.

Abstract translation: 提供了一种制造电子封装结构的方法，包括：提供衬底; 提供电感器模块; 组装电感器模块和基板，使它们限定空间; 将包装胶注入由电感器模块和衬底限定的空间中，以形成封装层。

公开(公告)号：US08884717B2

公开(公告)日：2014-11-11

申请号：US13741398

申请日：2013-01-15

Applicant: Yu-Lin Liao ,  Ian-Chun Cheng

Inventor： Yu-Lin Liao ,  Ian-Chun Cheng

IPC: H01P5/12 ,  H03H7/46 ,  H03H7/01 ,  H03H1/00

CPC classification number: H03H7/01 ,  H03H7/463 ,  H03H2001/0092

Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.

Abstract translation: 本发明公开了一种由第一滤波器和第二滤波器的组合形成的双工器，其中第一滤波器和第二滤波器都具有至少一个通孔通孔电感器。 双工器具有用于接收输入信号的输入端。 第一滤波器具有电连接到输入端子的第一端子和产生第一输出信号的第二端子; 第二滤波器具有电连接到输入端子的第三端子和用于产生第二输出信号的第四端子。 双工器具有电连接到第一滤波器的第二端子以输出第一输出信号的第一输出端子和电连接到第二滤波器的第四端子的第二输出端子，以输出第二输出信号。

公开(公告)号：US08779887B2

公开(公告)日：2014-07-15

申请号：US13452265

申请日：2012-04-20

Applicant: Ta-Wen Lo ,  Yen-Ting Lin

Inventor： Ta-Wen Lo ,  Yen-Ting Lin

IPC: H01C1/012 ,  H01C7/13

CPC classification number: H01C7/13 ,  G01R1/203 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.

Abstract translation: 电阻器件包括电阻器板和电极结构。 电极结构包括电极层和辅助层。 电极层设置在电阻器板的第一面上，分别包括覆盖电阻器板的第一侧和第二侧的第一部分和第二部分，并且在第一部分和第二部分之间传导电流通路 部分通过电阻板。 辅助层设置在电阻器板的第二面上，并且至少包括覆盖电阻器板的第一侧的第一块和第二块，以及覆盖电阻器板的第二侧的至少第三块，其中， 辅助层的第一，第二和第三块彼此分离，使得块之间的任何电流都被阻挡。

公开(公告)号：US08723629B1

公开(公告)日：2014-05-13

申请号：US13738674

申请日：2013-01-10

Applicant: Cyntec Co., Ltd.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/24 ,  H01F17/04

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20≦PCL≦7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract translation: 磁性装置包括T形磁芯，线圈和磁性体。 T型磁芯包括基座和支柱，由退火的软磁金属材料制成，T形磁芯的铁心损耗PCL（mW / cm3）满足：0.64×f0.95×Bm2。 20＆nlE; PCL＆nlE; 7.26×f1.41×Bm1.08，其中f（kHz）表示施加到T形磁芯的磁场的频率，Bm（kGauss）表示磁场的工作磁通密度 在频率。 磁体完全覆盖支柱，位于基座底面上方的基座的任何部分以及位于基座顶表面正上方的线圈的任何部分。

公开(公告)号：US20140097931A1

公开(公告)日：2014-04-10

申请号：US14102510

申请日：2013-12-11

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

IPC: H01F27/255

CPC classification number: H01F27/255 ,  H01F17/045 ,  H01F2017/048

Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.

Abstract translation: 提供了包括芯，至少线和磁性材料的电子设备。 核心包括柱子，顶板和底板。 支柱设置在顶板和底板之间。 顶板的面积小于底板的面积。 在顶板，底板和支柱之间形成卷绕空间。 电线缠绕在支柱上并位于绕组空间中。 磁性材料填充绕组空间以封装电线。 磁性材料包括树脂和金属粉末，其中磁粉的平均粒径小于20μm。

公开(公告)号：US08619428B2

公开(公告)日：2013-12-31

申请号：US13206810

申请日：2011-08-10

Applicant: Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

Inventor： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC: H05K7/20

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

Abstract translation: 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。

公开(公告)号：US20130321119A1

公开(公告)日：2013-12-05

申请号：US13962837

申请日：2013-08-08

Applicant: CYNTEC CO., LTD.

Inventor： Chung-Hsiung WANG ,  Hung-Ming LIN ,  Wen-Shiang LUO ,  Chun-Tiao LIU ,  Kuo-Shu CHEN

IPC: H01H85/48

CPC classification number: H01H85/48 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/0283 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和桥接元件的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 桥接元件跨过金属元件横跨金属元件中的电流流动方向穿过金属元件，其中桥接元件有助于熔化时金属元件的断裂。