公开(公告)号：US20120086111A1

公开(公告)日：2012-04-12

申请号：US12976220

申请日：2010-12-22

申请人： Yoshinori IWAMOTO ,  Kouji Sato ,  Yutaka Nakajima ,  Ken Hayakawa

发明人： Yoshinori IWAMOTO ,  Kouji Sato ,  Yutaka Nakajima ,  Ken Hayakawa

IPC分类号： H01L25/07 ,  H01L23/495

CPC分类号： H01L24/14 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6836 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/2732 ,  H01L2224/29099 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92147 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes.

摘要翻译： 本发明可减少外部端子连接部的断裂的发生，提高半导体器件的二次封装的可靠性。 具体地说，本发明提供一种半导体器件，其包括布线板，通过接合部件安装在布线板的一个表面上的半导体芯片，以及形成在布线板的另一个表面上并与半导体芯片电连接的外部电极。 在半导体器件中，接合部件的外周端部配置在外周端不与外部电极重叠的位置。

公开(公告)号：US07808086B2

公开(公告)日：2010-10-05

申请号：US12129297

申请日：2008-05-29

申请人： Akimi Saiki ,  Hiroyuki Shoji ,  Gousuke Takahashi ,  Noriyuki Hasegawa ,  Fumio Takano ,  Kouji Sato

发明人： Akimi Saiki ,  Hiroyuki Shoji ,  Gousuke Takahashi ,  Noriyuki Hasegawa ,  Fumio Takano ,  Kouji Sato

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.

摘要翻译： 本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和 其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起 对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。 用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。

公开(公告)号：US20080309028A1

公开(公告)日：2008-12-18

申请号：US12137361

申请日：2008-06-11

申请人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Yasushi Aburatani ,  Akira Muramatsu ,  Masayuki Noguchi ,  Kouji Sato ,  Satoshi Kumaki

发明人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Yasushi Aburatani ,  Akira Muramatsu ,  Masayuki Noguchi ,  Kouji Sato ,  Satoshi Kumaki

IPC分类号： F16J15/02

CPC分类号： F16J15/0887

摘要： A low-compression force metal gasket includes a coating layer containing a polymer material on at least a sealing surface of the gasket, and the coating layer satisfies the following conditions (1) to (3): (1) the layer comprises a resin, a rubber or a mixture thereof having an oxygen gas permeability coefficient at 25° C. of 10×10−12 to 0.1×10−12 (m2/s); (2) when the layer is compression deformed, the storage elastic modulus (E′) at 200° C. is in the range of 1.0×107 to 1.0×102 Pa; and (3) the coating layer has a thickness of 1 to 40 μm. The gasket provides a high seal at a low clamping force.

摘要翻译： 低压力金属垫片包括在垫片的至少密封面上含有聚合物材料的涂层，涂层满足以下条件（1）〜（3）：（1）该层包含树脂， 在25℃下的氧气渗透系数为10×10-12〜0.1×10-12（m2 / s）的橡胶或其混合物; （2）当层压缩变形时，200℃下的储能弹性模量（E'）为1.0×10 7〜1.0×10 2 Pa的范围; 和（3）涂层的厚度为1〜40μm。 垫圈在低夹紧力下提供高密封。

公开(公告)号：US20080296746A1

公开(公告)日：2008-12-04

申请号：US12129297

申请日：2008-05-29

申请人： Akimi SAIKI ,  Hiroyuki SHOJI ,  Gousuke TAKAHASHI ,  Noriyuki HASEGAWA ,  Fumio TAKANO ,  Kouji SATO

发明人： Akimi SAIKI ,  Hiroyuki SHOJI ,  Gousuke TAKAHASHI ,  Noriyuki HASEGAWA ,  Fumio TAKANO ,  Kouji SATO

IPC分类号： H01L23/495 ,  H01R43/00 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.

摘要翻译： 本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和 其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起 对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。 用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。

公开(公告)号：US07087778B2

公开(公告)日：2006-08-08

申请号：US10922832

申请日：2004-08-23

申请人： Kouji Sato ,  Yoshihiro Takayanagi ,  Katsuhiko Okano ,  Keiji Nakayama ,  Akihiro Imura ,  Mikihiro Itoh ,  Tsutomu Yagi ,  Yukinari Kobayashi ,  Tomoyuki Nagai

发明人： Kouji Sato ,  Yoshihiro Takayanagi ,  Katsuhiko Okano ,  Keiji Nakayama ,  Akihiro Imura ,  Mikihiro Itoh ,  Tsutomu Yagi ,  Yukinari Kobayashi ,  Tomoyuki Nagai

IPC分类号： C07C229/00 ,  C07C211/00

CPC分类号： C07D498/06 ,  C07B57/00 ,  C07B2200/07 ,  C07C213/00 ,  C07C227/08 ,  C07C227/34 ,  C07C227/36 ,  C07C229/18 ,  C07C229/30 ,  C07D265/36 ,  C12P13/001 ,  C12P13/02 ,  C12P13/04 ,  C12P41/005 ,  Y02P20/55 ,  C07C215/16

摘要： Processes for producing antibacterial agents and intermediates useful in producing antibacterial agents are provided and include producing compound (VI-a) in accordance with the following reaction schema, as well as production intermediates thereof

摘要翻译： 提供了用于制备抗菌剂的方法和用于生产抗菌剂的中间体，包括根据以下反应方案制备化合物（VI-a）及其生产中间体

公开(公告)号：US20060110296A1

公开(公告)日：2006-05-25

申请号：US11325075

申请日：2006-01-04

申请人： Hideji Tajima ,  Norihisa Sagawa ,  Toyosaku Sato ,  Masataka Morita ,  Hiroshi Hayasaka ,  Kouji Sato ,  Kahoru Takahashi

发明人： Hideji Tajima ,  Norihisa Sagawa ,  Toyosaku Sato ,  Masataka Morita ,  Hiroshi Hayasaka ,  Kouji Sato ,  Kahoru Takahashi

IPC分类号： B01L3/00 ,  G01N35/00

CPC分类号： G01N35/025 ,  G01N35/0099 ,  G01N2035/00504

摘要： The invention relates to an automatic separator/extractor and a method of controlling same, with the object, particularly in all manner of fields such as medical science, agricultural science, scientific fields, or pharmaceuticals, of being able to achieve at high speed and accuracy, extraction or separation of precipitate or supernatant at a high quality, accuracy and reliability, above that which can be achieved by manual means. The construction has a conveying device for conveying a mounted vessel along a closed path, a dispensing section for dispensing a reagent or the like into the vessel mounted on the conveying device, a liquid processing section for removing and/or extracting liquid other than a precipitate inside the vessel mounted on the conveying device, a separator for performing separation with respect to the contents inside a vessel which is mounted on the conveying device and/or a vessel which is installed away from the conveying device, a vessel moving device for bringing in and taking out the vessel with respect to the conveying device and/or separator, and an operation/control section for performing operation and control with respect to the conveying device, the dispensing section, the liquid processing section, the vessel moving device, and the separator.

摘要翻译： 本发明涉及一种自动分离器/提取器及其控制方法，其目的尤其在医学，农业科学，科学领域或医药领域的各种领域中，能够高速准确地实现 ，以高质量，准确性和可靠性提取或分离沉淀物或上清液，高于可通过手动方式实现的沉淀物或上清液。 该结构具有用于沿着封闭路径输送安装的容器的输送装置，用于将试剂等分配到安装在输送装置上的容器中的分配部分，用于去除和/或提取除了沉淀物之外的液体的液体处理部分 在安装在输送装置上的容器内部，分离器，用于相对于安装在输送装置上的容器内的内容物和/或远离输送装置安装的容器进行分离;容器移动装置，用于引入 并且相对于输送装置和/或分离器取出容器，以及用于对输送装置，分配部，液体处理部，容器移动装置和运送装置进行操作和控制的操作/控制部 分隔器。

公开(公告)号：US06688674B2

公开(公告)日：2004-02-10

申请号：US09964675

申请日：2001-09-28

申请人： Manabu Sato ,  Masato Takiguchi ,  Kouji Sato ,  Kouichi Ohira ,  Masami Tashiro ,  Takashi Matsuoka ,  Takamitsu Tajima ,  Kenji Kanamori

发明人： Manabu Sato ,  Masato Takiguchi ,  Kouji Sato ,  Kouichi Ohira ,  Masami Tashiro ,  Takashi Matsuoka ,  Takamitsu Tajima ,  Kenji Kanamori

IPC分类号： B62D2500

CPC分类号： B23K26/24 ,  B23K26/0838 ,  B23K26/0884 ,  B23K26/10 ,  B23K37/047 ,  B23K2101/006 ,  B23K2101/045 ,  B23K2103/10 ,  B23P21/004 ,  B23P2700/50 ,  B62D23/00 ,  B62D25/025 ,  B62D25/06 ,  B62D25/161 ,  B62D25/20 ,  B62D25/2009 ,  B62D25/2018 ,  B62D25/2027 ,  B62D25/2036 ,  B62D25/2045 ,  B62D27/02 ,  B62D27/026 ,  B62D29/001 ,  B62D29/008 ,  B62D65/00 ,  B62D65/02 ,  B62D65/04 ,  B62D65/06 ,  B62D65/18 ,  Y10T29/49622 ,  Y10T29/49829 ,  Y10T29/49831 ,  Y10T29/51 ,  Y10T29/5191 ,  Y10T29/5196 ,  Y10T29/53365 ,  Y10T29/534

摘要： A compact vehicle production line. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

摘要翻译： 紧凑型车辆生产线。 生产线包括组装地板构件的地板工艺。 每个都是在挤出压铸工艺中通过在预定方向上迫使熔融铝合金通过模腔而制成的铝合金挤出压铸产品。 组装的地板组成部分被焊接以形成地板结构。 在内部部件安装过程中，内部部件是地板结构以制造地板单元。 在身体主体处理中，将两个身体侧面结构中的每一个修整成身体侧面单元。 屋顶结构被修剪成屋顶单元。 组装地板单元，车身侧单元和车顶单元。 将组件焊接成一个主体单元。 在运行部件安装过程中，下运行单元安装到主体单元。 在外部部件附接过程中，将彩色主体面板附接到主体单元。

公开(公告)号：US06668438B2

公开(公告)日：2003-12-30

申请号：US09964674

申请日：2001-09-28

申请人： Manabu Sato ,  Masato Takiguchi ,  Kouji Sato ,  Kouichi Ohira ,  Masami Tashiro ,  Takashi Matsuoka ,  Takamitsu Tajima ,  Kenji Kanamori

发明人： Manabu Sato ,  Masato Takiguchi ,  Kouji Sato ,  Kouichi Ohira ,  Masami Tashiro ,  Takashi Matsuoka ,  Takamitsu Tajima ,  Kenji Kanamori

IPC分类号： B23P2304

CPC分类号： B23K26/24 ,  B23K26/0838 ,  B23K26/0884 ,  B23K26/10 ,  B23K37/047 ,  B23K2101/006 ,  B23K2101/045 ,  B23K2103/10 ,  B23P21/004 ,  B23P2700/50 ,  B62D23/00 ,  B62D25/025 ,  B62D25/06 ,  B62D25/161 ,  B62D25/20 ,  B62D25/2009 ,  B62D25/2018 ,  B62D25/2027 ,  B62D25/2036 ,  B62D25/2045 ,  B62D27/02 ,  B62D27/026 ,  B62D29/001 ,  B62D29/008 ,  B62D65/00 ,  B62D65/02 ,  B62D65/04 ,  B62D65/06 ,  B62D65/18 ,  Y10T29/49622 ,  Y10T29/49829 ,  Y10T29/49831 ,  Y10T29/51 ,  Y10T29/5191 ,  Y10T29/5196 ,  Y10T29/53365 ,  Y10T29/534

摘要： A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

公开(公告)号：US5120384A

公开(公告)日：1992-06-09

申请号：US742080

申请日：1991-08-07

申请人： Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

发明人： Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

IPC分类号： B29C70/86 ,  B32B15/14 ,  B32B37/00 ,  B32B38/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC分类号： B32B37/0038 ,  B29C70/865 ,  B32B15/14 ,  H05K3/445 ,  H05K3/4641 ,  B29K2105/0854 ,  B29K2105/16 ,  B29L2031/3425 ,  B32B2311/12 ,  B32B2457/08 ,  B32B38/0012 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0293 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K2203/143 ,  H05K3/385 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A method for manufacturing a multilayer laminate provides in metal plates each forming a substrate apertures at positions where through holes are to be formed, fills the apertures with a synthetic resin including a first filler, and prepares prepregs to be disposed on both sides of each substrate by impregnating nonwoven fabric with a thermosetting synthetic resin containing a second filler. The metal plates forming the substrates are thereby allowed to be thicker for realizing larger capacity power supply with an improvement also in heat dissipation characteristics.

摘要翻译： 制造多层叠层体的方法提供在金属板中，每个在要形成通孔的位置处形成基底孔，在包含第一填料的合成树脂中填充孔，并制备待设置在每个基底两侧的预浸料 通过用含有第二填料的热固性合成树脂浸渍无纺布。 因此，形成基板的金属板可以更厚以实现更大容量的电源，并且散热特性也得到改善。