公开(公告)号：US20130146647A1

公开(公告)日：2013-06-13

申请号：US13313371

申请日：2011-12-07

申请人： Chung-Shi Liu ,  Chien Ling Hwang ,  Bor-Ping Jang ,  Ying-Jui Huang

发明人： Chung-Shi Liu ,  Chien Ling Hwang ,  Bor-Ping Jang ,  Ying-Jui Huang

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/0053 ,  B23K1/012 ,  B23K1/206 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/75272 ,  H01L2224/75283 ,  H01L2224/75651 ,  H01L2224/765 ,  H01L2224/81097 ,  H01L2224/81211 ,  H01L2224/81912 ,  H01L2224/81948 ,  H01L2924/00012 ,  H01L2924/014

摘要： A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.

摘要翻译： 一种方法包括回流包装结构的焊料区域，并且在高于室温的清洁温度下对包装结构进行清洁。 在回流步骤和清洁步骤之间，封装结构没有被冷却到接近于室温的温度。

公开(公告)号：US20130115752A1

公开(公告)日：2013-05-09

申请号：US13290855

申请日：2011-11-07

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Yi-Li Hsiao

IPC分类号： H01L21/762 ,  B23K3/08 ,  B23K37/04

CPC分类号： H01L24/75 ,  H01L21/67144 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/81815 ,  H01L2924/15311 ,  H01L2924/00014

摘要： An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops

摘要翻译： 一种装置包括导向环和安装在引导环上的接合头。 结合头被构造成沿着导向环移动成环。 结合头被配置为拾取模具并且在回路期间放置模具

公开(公告)号：US08104666B1

公开(公告)日：2012-01-31

申请号：US12874009

申请日：2010-09-01

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0012 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/95 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75755 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00

摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

摘要翻译： 一种接合方法包括提供第一工件，并且将第二工件附接在第一工件上，其中焊料凸块设置在第一和第二工件之间。 使用加热工具的加热头加热第二工件以熔化焊料凸块。 在加热第二工件的步骤之后，允许第一工件和第二工件中的一个在水平方向上自由移动以使第一工件和第二工件自对准。 在允许第一和第二工件中的一个移动的步骤之后，加热头的温度降低直到第一焊料凸点固化以形成第二焊料凸块。

公开(公告)号：US08823166B2

公开(公告)日：2014-09-02

申请号：US12871565

申请日：2010-08-30

申请人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

发明人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L21/02052 ,  H01L21/32125 ,  H01L21/76873 ,  H01L21/76885 ,  H01L23/488 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/1084 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/1111 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11614 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/11912 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0541 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/20102 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/207

摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。

公开(公告)号：US20130228951A1

公开(公告)日：2013-09-05

申请号：US13411293

申请日：2012-03-02

申请人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B29C45/22 ,  B29C45/34

CPC分类号： H01L25/50 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/34 ,  B29C2045/0027 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

摘要： A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

公开(公告)号：US20130048027A1

公开(公告)日：2013-02-28

申请号：US13221673

申请日：2011-08-30

申请人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B08B3/08 ,  H01L21/67028 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8191 ,  H01L2924/014

摘要： A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

摘要翻译： 一种方法包括产生含有溶剂的含溶剂的蒸气。 将含溶剂的蒸气传导到包装组件以清洁包装组件。 含溶剂的蒸汽在包装组件的表面上冷凝形成液体，并从包装组件的表面流出。

公开(公告)号：US08317077B2

公开(公告)日：2012-11-27

申请号：US13351099

申请日：2012-01-16

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0012 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/95 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75755 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00

摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

公开(公告)号：US08177862B2

公开(公告)日：2012-05-15

申请号：US12901273

申请日：2010-10-08

申请人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

IPC分类号： H01L21/58

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/75302 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.

摘要翻译： 一种方法包括允许具有焊料凸点的工件接触焊接头; 加热粘结头，直到焊料凸起熔化; 并将冷却介质导入接合头以冷却焊料凸点并固化焊料凸块。

公开(公告)号：US20120111922A1

公开(公告)日：2012-05-10

申请号：US13351099

申请日：2012-01-16

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： B23K3/04 ,  B23K3/08

CPC分类号： H01L24/81 ,  B23K1/0012 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/95 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75755 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00

摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

摘要翻译： 一种接合方法包括提供第一工件，并且将第二工件附接在第一工件上，其中焊料凸块设置在第一和第二工件之间。 使用加热工具的加热头加热第二工件以熔化焊料凸块。 在加热第二工件的步骤之后，允许第一工件和第二工件中的一个在水平方向上自由移动以使第一工件和第二工件自对准。 在允许第一和第二工件中的一个移动的步骤之后，加热头的温度降低直到第一焊料凸点固化以形成第二焊料凸块。

公开(公告)号：US08951037B2

公开(公告)日：2015-02-10

申请号：US13411293

申请日：2012-03-02

申请人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Yeong-Jyh Lin ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B29C45/22

CPC分类号： H01L25/50 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/34 ,  B29C2045/0027 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

摘要： A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

摘要翻译： 模具包括顶部和具有环形的边缘环。 边缘环是底部并连接到顶部的边缘。 边缘环包括通风口。 边缘环进一步环绕模具顶部下方的内部空间。 多个注射口连接到模具的内部空间。 多个注射口基本上对齐于与模具顶部的中心交叉的直线。 多个注射口具有不同的尺寸。