-
1.发明授权公开(公告)号：US08104666B1
公开(公告)日：2012-01-31
申请号：US12874009
申请日：2010-09-01
IPC分类号： B23K31/02
CPC分类号： H01L24/81 , B23K1/0012 , B23K1/203 , B23K3/087 , B23K2101/42 , H01L24/95 , H01L2224/131 , H01L2224/13147 , H01L2224/75251 , H01L2224/75252 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/75755 , H01L2224/81143 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/814 , H01L2224/81907 , H01L2224/81986 , H01L2224/97 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/81 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.
摘要翻译： 一种接合方法包括提供第一工件，并且将第二工件附接在第一工件上，其中焊料凸块设置在第一和第二工件之间。 使用加热工具的加热头加热第二工件以熔化焊料凸块。 在加热第二工件的步骤之后，允许第一工件和第二工件中的一个在水平方向上自由移动以使第一工件和第二工件自对准。 在允许第一和第二工件中的一个移动的步骤之后，加热头的温度降低直到第一焊料凸点固化以形成第二焊料凸块。
-
公开(公告)号：US08823166B2
公开(公告)日：2014-09-02
申请号：US12871565
申请日：2010-08-30
申请人： Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
发明人： Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
CPC分类号： H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。
-
公开(公告)号：US08317077B2
公开(公告)日：2012-11-27
申请号：US13351099
申请日：2012-01-16
IPC分类号： B23K37/04
CPC分类号： H01L24/81 , B23K1/0012 , B23K1/203 , B23K3/087 , B23K2101/42 , H01L24/95 , H01L2224/131 , H01L2224/13147 , H01L2224/75251 , H01L2224/75252 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/75755 , H01L2224/81143 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/814 , H01L2224/81907 , H01L2224/81986 , H01L2224/97 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/81 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.
-
公开(公告)号：US08177862B2
公开(公告)日：2012-05-15
申请号：US12901273
申请日：2010-10-08
IPC分类号： H01L21/58
CPC分类号： H01L24/75 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/1605 , H01L2224/75302 , H01L2224/7531 , H01L2224/75312 , H01L2224/755 , H01L2224/75502 , H01L2224/7565 , H01L2224/75745 , H01L2224/81203 , H01L2224/81815 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , Y10T29/41 , H01L2924/00014 , H01L2924/00
摘要： A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.
摘要翻译： 一种方法包括允许具有焊料凸点的工件接触焊接头; 加热粘结头，直到焊料凸起熔化; 并将冷却介质导入接合头以冷却焊料凸点并固化焊料凸块。
-
5.发明申请公开(公告)号：US20120111922A1
公开(公告)日：2012-05-10
申请号：US13351099
申请日：2012-01-16
CPC分类号： H01L24/81 , B23K1/0012 , B23K1/203 , B23K3/087 , B23K2101/42 , H01L24/95 , H01L2224/131 , H01L2224/13147 , H01L2224/75251 , H01L2224/75252 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/75755 , H01L2224/81143 , H01L2224/81191 , H01L2224/81193 , H01L2224/81204 , H01L2224/814 , H01L2224/81907 , H01L2224/81986 , H01L2224/97 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2224/81 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.
摘要翻译： 一种接合方法包括提供第一工件，并且将第二工件附接在第一工件上，其中焊料凸块设置在第一和第二工件之间。 使用加热工具的加热头加热第二工件以熔化焊料凸块。 在加热第二工件的步骤之后，允许第一工件和第二工件中的一个在水平方向上自由移动以使第一工件和第二工件自对准。 在允许第一和第二工件中的一个移动的步骤之后，加热头的温度降低直到第一焊料凸点固化以形成第二焊料凸块。
-
公开(公告)号：US08258055B2
公开(公告)日：2012-09-04
申请号：US12832168
申请日：2010-07-08
申请人： Chien Ling Hwang , Ying-Jui Huang , Zheng-Yi Lim , Yi-Yang Lei , Cheng-Chung Lin , Chung-Shi Liu
发明人： Chien Ling Hwang , Ying-Jui Huang , Zheng-Yi Lim , Yi-Yang Lei , Cheng-Chung Lin , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L21/563 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/73 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03464 , H01L2224/0361 , H01L2224/03831 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11622 , H01L2224/11831 , H01L2224/11849 , H01L2224/11901 , H01L2224/13007 , H01L2224/13017 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3512 , H01L2224/05552 , H01L2924/00 , H01L2224/1146
摘要： An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.
摘要翻译： 本公开的实施例包括半导体管芯上的导电凸块。 提供基板。 焊盘在衬底上。 凸块下金属（UBM）层位于焊盘上方。 铜柱在UBM层之上。 铜柱具有第一宽度的顶表面和具有凹形的侧壁。 具有顶表面和底表面的镍层在铜柱的顶表面之上。 镍层的底面具有第二宽度。 第二宽度与第一宽度的比率在约0.93至约1.07之间。 焊料材料在盖层的顶表面之上。
-
公开(公告)号：US20120088362A1
公开(公告)日：2012-04-12
申请号：US12901273
申请日：2010-10-08
IPC分类号： H01L21/768
CPC分类号： H01L24/75 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/1605 , H01L2224/75302 , H01L2224/7531 , H01L2224/75312 , H01L2224/755 , H01L2224/75502 , H01L2224/7565 , H01L2224/75745 , H01L2224/81203 , H01L2224/81815 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , Y10T29/41 , H01L2924/00014 , H01L2924/00
摘要： A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.
摘要翻译： 一种方法包括允许具有焊料凸点的工件接触焊接头; 加热粘结头，直到焊料凸起熔化; 并将冷却介质导入接合头以冷却焊料凸点并固化焊料凸块。
-
公开(公告)号：US20120049346A1
公开(公告)日：2012-03-01
申请号：US12871565
申请日：2010-08-30
申请人： Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
发明人： Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。
-
公开(公告)号：US20120007230A1
公开(公告)日：2012-01-12
申请号：US12832168
申请日：2010-07-08
申请人： Chien Ling Hwang , Ying-Jui Huang , Zheng-Yi Lim , Yi-Yang Lei , Cheng-Chung Lin , Chung-Shi Liu
发明人： Chien Ling Hwang , Ying-Jui Huang , Zheng-Yi Lim , Yi-Yang Lei , Cheng-Chung Lin , Chung-Shi Liu
IPC分类号： H01L23/498 , H01L21/3205
CPC分类号： H01L24/13 , H01L21/563 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/73 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03464 , H01L2224/0361 , H01L2224/03831 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11622 , H01L2224/11831 , H01L2224/11849 , H01L2224/11901 , H01L2224/13007 , H01L2224/13017 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3512 , H01L2224/05552 , H01L2924/00 , H01L2224/1146
摘要： An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.
摘要翻译： 本公开的实施例包括半导体管芯上的导电凸块。 提供基板。 焊盘在衬底上。 凸块下金属（UBM）层位于焊盘上方。 铜柱在UBM层之上。 铜柱具有第一宽度的顶表面和具有凹形的侧壁。 具有顶表面和底表面的镍层在铜柱的顶表面之上。 镍层的底面具有第二宽度。 第二宽度与第一宽度的比率在约0.93至约1.07之间。 焊料材料在盖层的顶表面之上。
-
10.发明申请公开(公告)号：US20130146647A1
公开(公告)日：2013-06-13
申请号：US13313371
申请日：2011-12-07
申请人： Chung-Shi Liu , Chien Ling Hwang , Bor-Ping Jang , Ying-Jui Huang
发明人： Chung-Shi Liu , Chien Ling Hwang , Bor-Ping Jang , Ying-Jui Huang
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K1/0053 , B23K1/012 , B23K1/206 , B23K2101/42 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75272 , H01L2224/75283 , H01L2224/75651 , H01L2224/765 , H01L2224/81097 , H01L2224/81211 , H01L2224/81912 , H01L2224/81948 , H01L2924/00012 , H01L2924/014
摘要： A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.
摘要翻译： 一种方法包括回流包装结构的焊料区域，并且在高于室温的清洁温度下对包装结构进行清洁。 在回流步骤和清洁步骤之间，封装结构没有被冷却到接近于室温的温度。
-
-
-
-
-
-
-
-
-
搜索结果
53 条记录 (耗时 0.026 秒)
