公开(公告)号：US5647431A

公开(公告)日：1997-07-15

申请号：US448307

申请日：1995-05-23

申请人： Michimasa Takeshita ,  Takayuki Yoshida ,  Yoshiaki Tanimura ,  Hitoshi Iijima ,  Takashi Gotoh ,  Tsuneo Yumikura

发明人： Michimasa Takeshita ,  Takayuki Yoshida ,  Yoshiaki Tanimura ,  Hitoshi Iijima ,  Takashi Gotoh ,  Tsuneo Yumikura

IPC分类号： F24F1/00 ,  F28F1/12 ,  F28F1/22 ,  F28F1/32 ,  F28F1/36

CPC分类号： F28F1/122 ,  F24F1/0007 ,  F24F2001/0048 ,  Y10S165/31 ,  Y10S165/471 ,  Y10S165/498 ,  Y10S165/518

摘要： A heat exchanger mounted on an air condition is constructed such that at least one row of heat conduction pipe groups are arranged across an air passage. Each heat conduction pipe groups is constructed such that a plurality of heat conduction pipes 22 are arranged in parallel with each other and a fine wire 23 made of a metallic material having excellent heat conductivity is spirally wound around each adjacent heat conduction pipes 22. Thus, performances of the heat exchanger can be improved without a possibility that the air conditioner is designed with larger dimensions. In addition, the heat exchanger includes a plurality of heat conduction pipes 39 arranged in the form of at least one row with a constant distance between adjacent ones and a plurality of twisted wires 40. The twisted wires 40 are arranged so as to alternately come in contact with one side and opposite side of each heat conduction pipe 39 extending at a right angle relative to the row direction of each heat conduction pipe 39, and moreover, alternately come in contact with one side and opposite other side of each heat conduction pipe 39 extending in the longitudinal direction. With this construction, high heat conductivity can be realized, and an occurrence of clogging with dew droplets can be prevented while maintaining a heat conduction area.

摘要翻译： 安装在空气状态的热交换器被构造成使得至少一排导热管组跨越空气通道布置。 每个导热管组被构造为使得多个导热管22彼此平行地布置，并且由具有优良导热性的金属材料制成的细线23螺旋地卷绕在每个相邻的导热管22周围。因此， 可以提高热交换器的性能，而不需要设计具有更大尺寸的空调。 此外，热交换器包括多个布置成相互间隔一定距离的至少一排形式的多个导热管39和多根扭绞线40.绞线40被布置为交替进入 与每个导热管39相对于每个导热管39的行方向成直角延伸的每个导热管39的一侧和相对侧接触，并且与每个导热管39的一侧相对的另一侧交替接触 沿纵向延伸。 通过这种结构，可以实现高导热性，并且可以在保持导热面积的同时防止出现具有露滴的堵塞。

公开(公告)号：US08493765B2

公开(公告)日：2013-07-23

申请号：US13365358

申请日：2012-02-03

申请人： Takayuki Yoshida ,  Mitsumi Itou ,  Shinya Tokunaga

发明人： Takayuki Yoshida ,  Mitsumi Itou ,  Shinya Tokunaga

IPC分类号： G11C5/06

CPC分类号： H05K1/0243 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/09227 ,  H05K2201/10159 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： All interface pins for transmitting and receiving a signal having a predetermined function of a semiconductor integrated circuit element are formed on an outer periphery of the semiconductor integrated circuit element along one side of the semiconductor integrated circuit element. The one side of the semiconductor integrated circuit element is adjacent to two of sides of a BGA substrate, the two sides being not parallel to the one side. Of balls provided on the BGA substrate, balls electrically connected to the interface pins for transmitting and receiving a signal having a predetermined function are provided between the one side of the semiconductor integrated circuit element and the two sides of the BGA substrate.

摘要翻译： 用于发送和接收具有半导体集成电路元件的预定功能的信号的所有接口引脚沿半导体集成电路元件的一侧形成在半导体集成电路元件的外周上。 半导体集成电路元件的一侧与BGA基板的两侧相邻，两侧不平行于一侧。 设置在BGA基板上的球体，在半导体集成电路元件的一侧和BGA基板的两侧之间设置电连接到用于发送和接收具有预定功能的信号的接口引脚的滚珠。

公开(公告)号：US20110254094A1

公开(公告)日：2011-10-20

申请号：US13067721

申请日：2011-06-22

申请人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

发明人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

IPC分类号： H01L29/772

CPC分类号： H01L21/823807 ,  H01L21/823871 ,  H01L24/10 ,  H01L29/7842 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device 20 formed on a semiconductor chip substrate 30 has a plurality of circuit blocks made up of circuits each containing at least a metal oxide semiconductor (MOS) transistor 36, the circuit blocks being covered on top with a protective film 41 to protect the circuits. A plurality of bumps 23a, 23b, 23c are formed, at least via the protective film 41, only on circuit blocks whose current-carrying ability and threshold voltage do not satisfy predetermined values and which are in need of performance enhancement. The bumps 23a, 23b, 23c impose stresses on the MOS transistors 36, increasing the mobility of the MOS transistors 36 and thereby improving the performance of the semiconductor device 20.

摘要翻译： 形成在半导体芯片基板30上的半导体装置20具有由至少包含金属氧化物半导体（MOS）晶体管36的电路构成的多个电路块，电路块由保护膜41覆盖在顶部，以保护 电路。 至少通过保护膜41仅形成多个凸起23a，23b，23c，其电流承载能力和阈值电压不满足预定值并且需要性能提高的电路块。 凸起23a，23b，23c在MOS晶体管36上施加应力，增加MOS晶体管36的迁移率，从而提高半导体器件20的性能。

公开(公告)号：US07641990B2

公开(公告)日：2010-01-05

申请号：US11473065

申请日：2006-06-23

申请人： Shinichi Konno ,  Toshihiko Ueyama ,  Kenichi Inoue ,  Takayuki Yoshida ,  Ken Inoue

发明人： Shinichi Konno ,  Toshihiko Ueyama ,  Kenichi Inoue ,  Takayuki Yoshida ,  Ken Inoue

IPC分类号： G11B5/716

CPC分类号： C01G49/06 ,  B82Y30/00 ,  C01G49/02 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/11 ,  C01P2006/12 ,  G11B5/738 ,  Y10T428/2982

摘要： Non-magnetic powder of particles for non-magnetic lower layer applications is provided that enables a multilayer coating type magnetic recording medium having good surface smoothness to be obtained. The particles are iron compound particles having a long axis with a standard geometrical deviation, as obtained from a transmission electron microscope image, that is greater than 1.5, and a short axis with a standard geometrical deviation, as obtained from a TEM image, that is greater than 1.35. The iron compound particles may be hematite or iron oxyhydroxide.

摘要翻译： 提供了用于非磁性下层应用的非磁性粉末颗粒，能够获得具有良好表面平滑度的多层涂布型磁记录介质。 颗粒是具有从透射电子显微镜图像获得的具有大于1.5的具有标准几何偏差的长轴的铁化合物颗粒和从TEM图像获得的具有标准几何偏差的短轴，即 大于1.35。 铁化合物颗粒可以是赤铁矿或羟基氧化铁。

公开(公告)号：US20080312228A1

公开(公告)日：2008-12-18

申请号：US12053133

申请日：2008-03-21

申请人： Hisashi Kawasaki ,  Hiroyuki Abe ,  Kazuhide Hayakawa ,  Tetsuya Iida ,  Shinichi Kikuchi ,  Takayuki Yamaguchi ,  Toyomichi Nanayama ,  Hironori Kurachi ,  Masahiro Tamaru ,  Yoshikazu Hori ,  Mitsuru Takahashi ,  Takayuki Yoshida ,  Toshiyuki Sakai

发明人： Hisashi Kawasaki ,  Hiroyuki Abe ,  Kazuhide Hayakawa ,  Tetsuya Iida ,  Shinichi Kikuchi ,  Takayuki Yamaguchi ,  Toyomichi Nanayama ,  Hironori Kurachi ,  Masahiro Tamaru ,  Yoshikazu Hori ,  Mitsuru Takahashi ,  Takayuki Yoshida ,  Toshiyuki Sakai

IPC分类号： C07D487/04 ,  A61K31/519 ,  A61K31/5377 ,  A61K31/496 ,  A61P35/00

CPC分类号： C07D471/04 ,  A61K31/519 ,  C07C275/30 ,  C07C275/50 ,  C07C2601/16 ,  C07D239/545 ,  C07D239/553 ,  C07D239/62 ,  C07D471/16 ,  C07D487/04 ,  C07F9/53

摘要： The present invention relates to a pyrimidine compound or a pharmaceutically acceptable salt thereof represented by the following formula [I] wherein each symbol is as defined in the specification and a method of therapeutically or prophylactically treating an undesirable cell proliferation, comprising administering such a compound. The compound of the present invention has superior activity in suppressing undesirable cell proliferation, particularly, an antitumor activity, and is useful as an antitumor agent for the prophylaxis or treatment of cancer, rheumatism, and the like. In addition, the compound of the present invention can be a more effective antitumor agent when used in combination with other antitumor agents such as an alkylating agent or metabolism antagonist.

摘要翻译： 本发明涉及由下式[I]表示的嘧啶化合物或其药学上可接受的盐，其中每个符号如说明书中所定义，以及治疗或预防性治疗不期望的细胞增殖的方法，包括施用这种化合物。 本发明的化合物在抑制不期望的细胞增殖，特别是抗肿瘤活性方面具有优异的活性，可用作预防或治疗癌症，风湿病等的抗肿瘤剂。 此外，当与其它抗肿瘤剂如烷化剂或代谢拮抗剂组合使用时，本发明的化合物可以是更有效的抗肿瘤剂。

公开(公告)号：US20080144913A1

公开(公告)日：2008-06-19

申请号：US11958179

申请日：2007-12-17

申请人： Takayuki Yoshida

发明人： Takayuki Yoshida

IPC分类号： G06K9/00 ,  A61B6/00

CPC分类号： A61B6/032 ,  A61B6/0457 ,  A61B6/583 ,  A61N5/1049 ,  A61N2005/105 ,  A61N2005/1063 ,  A61N2005/1076 ,  G06K9/3216 ,  G06T7/30 ,  G06T2207/10081 ,  G06T2207/30004

摘要： Discrepancies in alignment between an X-ray CT apparatus and an apparatus for radiation therapy are to be corrected. A phantom for alignment correction (P) is imaged, and data for alignment correction for conversion of data (x, y, z) of the coordinates of the X-ray CT apparatus (100) into data (X, Y, Z) of the coordinates of the apparatus for radiation therapy (200) are produced. Then, the data in the coordinates of the X-ray CT apparatus (100) obtained by imaging the subject with the X-ray CT apparatus (100) are converted into data in the coordinates of the apparatus for radiation therapy (200).

摘要翻译： 要矫正X射线CT装置和放射治疗装置之间的对准差异。 用于对准校正（P）的体模被成像，并且用于将X射线CT装置（100）的坐标的数据（x，y，z）的数据（x，y，z）转换成数据（X，Y，Z） 产生放射治疗装置（200）的坐标。 然后，将用X射线CT装置（100）对被检体成像的X射线CT装置（100）的坐标数据转换为放射线治疗装置的坐标数据（200）。

公开(公告)号：US20080061324A1

公开(公告)日：2008-03-13

申请号：US11898305

申请日：2007-09-11

申请人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

发明人： Takayuki Yoshida ,  Kimihito Kuwabara ,  Takuma Motofuji ,  Toshiyuki Fukuda

IPC分类号： H01L29/04

CPC分类号： H01L21/823807 ,  H01L21/823871 ,  H01L24/10 ,  H01L29/7842 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device 20 formed on a semiconductor chip substrate 30 has a plurality of circuit blocks made up of circuits each containing at least a metal oxide semiconductor (MOS) transistor 36, the circuit blocks being covered on top with a protective film 41 to protect the circuits. A plurality of bumps 23a, 23b, 23c are formed, at least via the protective film 41, only on circuit blocks whose current-carrying ability and threshold voltage do not satisfy predetermined values and which are in need of performance enhancement. The bumps 23a, 23b, 23c impose stresses on the MOS transistors 36, increasing the mobility of the MOS transistors 36 and thereby improving the performance of the semiconductor device 20.

摘要翻译： 形成在半导体芯片基板30上的半导体装置20具有由至少包含金属氧化物半导体（MOS）晶体管36的电路构成的多个电路块，电路块由保护膜41覆盖在顶部，以保护 电路。 至少通过保护膜41形成多个凸起23a，23b，23c，仅在载流能力和阈值电压不满足预定值并且需要性能提高的电路块上形成。 凸块23a，23b，23c对MOS晶体管36施加应力，增加MOS晶体管36的迁移率，从而提高半导体器件20的性能。

公开(公告)号：US20050287211A1

公开(公告)日：2005-12-29

申请号：US11119460

申请日：2005-04-28

申请人： Takayuki Yoshida ,  Hiroaki Tasaki ,  Masataka Katsuma ,  Atsushi Maeda

发明人： Takayuki Yoshida ,  Hiroaki Tasaki ,  Masataka Katsuma ,  Atsushi Maeda

IPC分类号： A61K9/00 ,  A61K9/16 ,  A61K9/20 ,  A61K9/26 ,  A61K9/50 ,  A61K31/135 ,  A61K47/02 ,  A61K47/04 ,  A61K47/10 ,  A61K47/12 ,  A61K47/18 ,  A61K47/24 ,  A61K47/26 ,  A61K47/32 ,  A61K47/34 ,  A61K47/36 ,  A61K47/38 ,  A61K47/40 ,  A61K47/42

CPC分类号： A61K9/0056 ,  A61K9/2077 ,  A61K9/2081 ,  A61K9/2095 ,  A61K9/501 ,  A61K9/5015 ,  A61K9/5026 ,  A61K9/5042 ,  A61K9/5047 ,  A61K9/5078 ,  A61K31/135

摘要： The present invention relates to an oral pharmaceutical composition in particle form, which comprises particles that contain a drug at the core of the pharmaceutical composition in particle form; a middle layer that contains two types of water-soluble components, an insolubilizer and an insolubilizing substance; and an outer layer for controlling water penetration that contains a water-insoluble substance. The present invention makes it possible to provide a pharmaceutical composition in particle form for oral use with which initial drug release is suppressed, the drug is quickly released thereafter, and lag time can be controlled as needed, and fast-disintegrating tablets containing this composition.

摘要翻译： 本发明涉及一种颗粒形式的口服药物组合物，其包含以粒子形式含有药物组合物核心的药物的颗粒; 含有两种水溶性组分的中间层，不溶物和不溶物质; 以及用于控制含水不溶性物质的水渗透的外层。 本发明使得可以提供一种用于口服使用的颗粒形式的药物组合物，其中抑制初始药物释放，此后快速释放药物，并且可以根据需要控制滞后时间，以及含有该组合物的快速崩解片剂。

公开(公告)号：US20050175689A1

公开(公告)日：2005-08-11

申请号：US10975210

申请日：2004-10-27

申请人： Ippei Kurimoto ,  Yuki Kasashima ,  Hitoshi Kawai ,  Yuuki Takaishi ,  Masataka Katsuma ,  Hiroshi Ohi ,  Takayuki Yoshida ,  Hiroaki Tasaki

发明人： Ippei Kurimoto ,  Yuki Kasashima ,  Hitoshi Kawai ,  Yuuki Takaishi ,  Masataka Katsuma ,  Hiroshi Ohi ,  Takayuki Yoshida ,  Hiroaki Tasaki

IPC分类号： A61K9/14 ,  A61K9/20

CPC分类号： A61K9/0056 ,  A61K9/2081

摘要： The present invention makes it possible to provide drug-containing coated microparticles for quick-disintegrating oral tablets wherein microparticles containing a drug with an unpleasant taste are coated with a film composed of (1) a pH-independent water-insoluble polymer accounting for 60% or more but less than 80% of the film and (2) a pH-independent water-soluble substance accounting for more than 20% to 40% or less of the film, these microparticles being characterized in that the rate of dissolution of the drug from the drug-containing microparticles is 0% to 10% in one minute and 80% to 100% in 30 minutes, and the average particle diameter is 350 μm or less, in order to realize sufficient control of oral drug dissolution and fast gastrointestinal drug dissolution.

摘要翻译： 本发明使得可以提供用于快速崩解口服片剂的药物包衣微粒，其中含有具有令人不快的味道的药物的微粒被包被（1）不含pH的水不溶性聚合物占60％ 或更多但小于80％的膜，（2）占pH超过20％至40％以下的pH不依赖性水溶性物质，这些微粒的特征在于药物的溶解速率 含药微粒在1分钟内为0％〜10％，30分钟为80％〜100％，平均粒径为350μm以下，为了实现口服药物溶解和快速胃肠药物的充分控制 溶解

公开(公告)号：US06423561B1

公开(公告)日：2002-07-23

申请号：US09640280

申请日：2000-08-16

申请人： Toyoji Chino ,  Takayuki Yoshida ,  Kenichi Matsuda

发明人： Toyoji Chino ,  Takayuki Yoshida ,  Kenichi Matsuda

IPC分类号： H01L2100

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2221/68359 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/9202 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/157 ,  H01S5/0207 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/026 ,  H01S5/0261 ,  H01S5/028 ,  H01S5/0425 ,  H01S5/0683 ,  H01S5/18305 ,  H01S5/1838 ,  H01S5/18388 ,  H01S5/423 ,  H01S2301/176 ,  H01L2924/01007 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for fabricating a semiconductor device, in which a semiconductor chip having a first surface and a second surface substantially parallel to each other is mounted on a submount such that the first surface faces the submount, includes: a first step of applying resin to at least one of the semiconductor chip and the submount; a second step of applying a pressure to the semiconductor chip and the submount so that the semiconductor chip and the submount are bonded to each other by the resin, resulting in electrical connection therebetween; and a third step of performing at least one of a film formation process, an etching process, a patterning process, and a washing process for the second surface of the semiconductor chip.

摘要翻译： 一种制造半导体器件的方法，其中具有第一表面和第二表面彼此大致平行的半导体芯片安装在基座上，使得第一表面面向基座，包括：第一步骤，将树脂施加到 半导体芯片和底座中的至少一个; 向半导体芯片和基座施加压力使得半导体芯片和副基座被树脂彼此接合的第二步骤，导致其间的电连接; 以及对半导体芯片的第二表面进行成膜处理，蚀刻处理，图案化处理和清洗处理中的至少一个的第三步骤。