公开(公告)号：US06919622B2

公开(公告)日：2005-07-19

申请号：US10774405

申请日：2004-02-10

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

摘要翻译： 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US06326681B1

公开(公告)日：2001-12-04

申请号：US09482648

申请日：2000-01-13

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

摘要翻译： 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US5863817A

公开(公告)日：1999-01-26

申请号：US46542

申请日：1998-03-24

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5215842A

公开(公告)日：1993-06-01

申请号：US638544

申请日：1991-01-08

申请人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

发明人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

IPC分类号： C07D215/12 ,  C07D233/64 ,  C07D235/04 ,  C07D263/32 ,  C07D263/56 ,  C07D277/28 ,  C07D277/66 ,  C07D277/84 ,  G03G5/06

CPC分类号： G03G5/0614 ,  C07D215/12 ,  C07D263/32 ,  C07D277/28 ,  G03G5/0631 ,  G03G5/0637 ,  G03G5/067

摘要： A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.

公开(公告)号：US4886721A

公开(公告)日：1989-12-12

申请号：US147694

申请日：1988-01-25

申请人： Shigeru Hayashida ,  Seiji Tai ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Noriyuki Kinjo ,  Shunichi Numata

发明人： Shigeru Hayashida ,  Seiji Tai ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Noriyuki Kinjo ,  Shunichi Numata

IPC分类号： B41M5/26 ,  G03G5/06

CPC分类号： G03G5/0696

摘要： Disclosed are an electrophotographic plate comprising a photoconductive layer containing an organic photoconductive substance on an electroconductive support, characterized in that said photoconductive layer has a film containing as the organic photoconductive substance a metal naphthalocyanine derivative represented by the formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group),a metal naphthalocyanine derivative defined above and a process for producing the same.

公开(公告)号：US4642601A

公开(公告)日：1987-02-10

申请号：US361903

申请日：1982-03-18

申请人： Tooru Sugawara ,  Shigeki Tsuchitani ,  Noriyuki Kinjo ,  Shuichi Ohara

发明人： Tooru Sugawara ,  Shigeki Tsuchitani ,  Noriyuki Kinjo ,  Shuichi Ohara

IPC分类号： G01N27/12 ,  H01L7/00

CPC分类号： G01N27/121

摘要： The humidity-sensitive element of this invention is composed of an insulating substrate (1), a pair of electrodes (2, 3) mounted thereon, and a humidity-sensitive material (8) covering the electrodes. The humidity-sensitive material (8) has a property to change its electric resistance depending on the moisture content in the atmosphere and is formed from fine particles each having a hydrophobic core and a hydrophilic group-containing surface layer covering the core. This humidity-sensitive element exhibits a nearly linear relationship between logarithum of electric resistance and relative humidity and small hysteresis, permitting a precise measurement of relative humidity. Insulating substrate (1) and electrodes (2,3) are preferred to form from an insulating layer of silicon semiconductor and conductive monosilicon formed on it, respectively. This permits size reduction of humidity-sensitive elements or devices.

摘要翻译： PCT No.PCT / JP81 / 00166 Sec。 371日期1982年3月18日 102（e）1982年3月18日PCT PCT 1991年7月20日PCT公布。 公开号WO82 / 00362 日本1982年2月4日。本发明的湿度敏感元件由绝缘基板（1），安装在其上的一对电极（2,3）和覆盖电极的湿度敏感材料（8）组成。 湿度敏感材料（8）具有根据大气中的水分含量而改变其电阻的性质，并且由具有疏水性芯和覆盖芯的含亲水性基团的表面层的细颗粒形成。 该湿度敏感元件表现出电阻对数相对湿度和滞后小的近似线性关系，可以精确测量相对湿度。 绝缘基板（1）和电极（2,3）优选分别从其上形成的硅半导体绝缘层和导电单晶硅形成。 这允许湿度敏感元件或器件的尺寸减小。

公开(公告)号：US4128527A

公开(公告)日：1978-12-05

申请号：US787098

申请日：1977-04-13

申请人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

发明人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

IPC分类号： C08L67/00 ,  C08L67/06 ,  H02K3/30 ,  H02K3/32 ,  H02K3/44 ,  H02K5/02 ,  H02K5/08 ,  C08K7/14

CPC分类号： H02K3/30 ,  H02K3/32

摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, and a chopped glass fiber, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4 and the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.6 to 0.9.The disclosure is also concerned with a dynamoelectric machine having a housing made of a cured article of a composition containing a certain amount of clay powder as a separation inhibitor.

摘要翻译： 在具有线圈绕组和芯的定子组件的电动机中，散热的电绝缘壳体封装线圈绕组和芯。 壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒， 和短切玻璃纤维，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，重量比 聚酯树脂的组合物总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比为0.6〜0.9。

公开(公告)号：US5021563A

公开(公告)日：1991-06-04

申请号：US418087

申请日：1989-10-06

申请人： Shigeru Hayashida ,  Seiji Tai ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Noriyuki Kinjo ,  Shunichi Numata

发明人： Shigeru Hayashida ,  Seiji Tai ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Noriyuki Kinjo ,  Shunichi Numata

IPC分类号： B41M5/26 ,  G03G5/06

CPC分类号： G03G5/0696

摘要： A metal naphthalocyanine derivative and process for producing said derivative which is represented by the following formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group).

公开(公告)号：US4641924A

公开(公告)日：1987-02-10

申请号：US696908

申请日：1985-01-31

申请人： Yoshiharu Nagae ,  Shunichi Numata ,  Noriyuki Kinjo ,  Katuyuki Funahata

发明人： Yoshiharu Nagae ,  Shunichi Numata ,  Noriyuki Kinjo ,  Katuyuki Funahata

IPC分类号： G09F9/00 ,  C08G73/10 ,  G02F1/13 ,  G02F1/133 ,  G02F1/1333

CPC分类号： G02F1/132 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/1071

摘要： A liquid crystal device comprising a thermal writing type liquid crystal, an electrode for generating heat necessary for said thermal writing, and a support for supporting said liquid crystal and said electrode, wherein a material having a coefficient of thermal expansion lying between the coefficient of thermal expansion of said electrode and that of said support is arranged between said electrode and said support, whereby said electrode for generating heat can be prevented from being degraded by failure or peeling from the support due to thermal stress.

摘要翻译： 一种液晶装置，包括热书写型液晶，用于产生所述热写所需的热的电极和用于支撑所述液晶和所述电极的支撑件，其中具有位于所述热系数之间的热膨胀系数的材料 所述电极和所述支撑件的膨胀被布置在所述电极和所述支撑件之间，由此可以防止由于热应力而导致由于支撑件的故障或剥离而产生热量的电极。

公开(公告)号：US4792476A

公开(公告)日：1988-12-20

申请号：US77390

申请日：1987-07-24

申请人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

发明人： Shun-ichi Numata ,  Koji Fujisaki ,  Noriyuki Kinjo ,  Junichi Imaizumi ,  Yoshikatsu Mikami

IPC分类号： C08G73/10 ,  C08L79/08 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B27/06

CPC分类号： C08L79/08 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/1082 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5329 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K3/4676 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2913 ,  Y10T428/31623 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.