摘要:
A device that can realize satellite communication with a popularized mobile phone in a case a large number of users communicate at a same time such as in a case where disaster strikes and the like. An external battery for charging a mobile phone includes a satellite antenna for performing satellite communication via a satellite communication channel and a satellite communication unit which causes the mobile phone to perform the satellite communication via the satellite antenna. The mobile phone and the external battery are connected with a cable and the like, and thereby a satellite communication terminal is configured.
摘要:
A melt spinning apparatus includes an apparatus body, a nozzle configured to extrude melted resin in the apparatus body, and a barrel having an air discharge passage arranged around this nozzle to discharge hot air. The discharge passage includes a sloped passage and a parallel passage that extends along the nozzle. At an intersection of imaginary lines extending along the centerlines of the sloped passage, an imaginary merging section is defined. An open end of the nozzle is positioned on the downstream side of the imaginary merging section of the hot air blown diagonally forward toward a periphery of the nozzle. To manufacture a sheet of a nonwoven fabric, the melted resin is discharged from the nozzle and then the hot air swirling diagonally forward is blown toward the periphery of the nozzle. This causes the melted resin to be formed into spiral fibers. Those fibers are blown onto the belt of a conveyor belt apparatus to manufacture a nonwoven fabric sheet.
摘要:
Provided is a manufacturing method of an outer ring (3) of a back-to-back arrangement double-row angular ball bearing from a raw material (10) comprising a upsetting (A to B), a backward extrusion process (C to D), a punching (D to E), a rolling (E to F) and a finishing, wherein an outer diameter of a first intermediate material (11a) produced by the upsetting is equal to or smaller than an inside diameter of an inner periphery large diameter portion (18) of the inner circumference of a die (13) used in the backward extrusion process and larger than an inside diameter of an inner periphery small portion (19) of the die (13), and in a condition with the first intermediate material (11a) sitting on the inner periphery inclined portion (20) of the die (13), the intermediate material (11a) is pushed toward a base of the die (13) by a punch (14), to thereby the middle metal material (29) with the highest cleanliness of the raw material (10) is exposed to the two outer ring raceways (2) of the outer ring (3).
摘要:
A light reflector comprising a resin film having a reflection angle peak ratio [i.e. (reflection peak value when a light ray is applied at an angle of 45° to the perpendicular line of the reflection surface)/(reflection peak value when a light ray is applied at an angle of 15° to the perpendicular line of the reflection surface)] of from 1.3 to 10, and a specular reflectance [i.e. (reflectance)−(diffuse reflectance)] of from 1.4% to 10%. This light reflector can prevent generation of a bright line even when it is used in an illumination device having a plurality of light sources.
摘要:
A packaging bag and a drying agent with a moisture absorption indicator function are provided without using a heavy metal harmful to the human body. The packaging bag includes a first packaging material (10) and a second packaging material (20). The first packaging material (10) is provided on an outermost side thereof with a transparent barrier film (12) having a barrier property against water vapor. The second packaging material (20) has a light-reflective or light-absorbing film (24) and a pattern printed layer (23) overlaid on a bag interior side thereof, the pattern printed layer (23) having a printed moisture-absorbing indicator pattern (30). A desiccant-containing resin film (11, 21) which becomes transparent due to moisture absorption is overlaid on a bag interior side of at least one of the first packaging material (10) and the second packaging material (20). The drying agent with a moisture absorption indicator function includes an indicator film layer (70) having a barrier film (75), a pattern printed layer (73) for a moisture absorption indicator, and a moisture-absorbing film (71) containing zeolite, the pattern printed layer (73) and moisture-absorbing film (71) being laminated in this order on the barrier film (75). The drying agent further includes a main desiccant layer (61) and a moisture permeable film (64) that are overlaid on the moisture-absorbing film (71).
摘要:
In a method of manufacturing a hollow stabilizer, a pipe compressing step of compressing an electroseamed pipe in a temperature range of a hot state or a warm state so as to make a rate of a thickness with respect to an outer diameter between 18 and 35% is performed, and a forming step of forming the compressed electroseamed pipe in a stabilizer shape in a cold state is executed. Next, a step of applying a heat treatment to a half-finished stabilizer is performed, a shot peening step of impacting a shot on the half-finished stabilizer is performed, and a step of coating the half-finished stabilizer is performed.
摘要:
Disclosed is a novel monomer having a lactone skeleton, which is useful typically as a monomer component typically for a highly functional polymer, because, when the monomer is applied typically to a resist resin, the resin is satisfactory stable and resistant typically to chemicals, is highly soluble in organic solvents, and has improved hydrolyzability and/or water solubility after hydrolysis.The monomer having a lactone skeleton is represented by following Formula (1),wherein Ra represents a hydrogen atom, halogen atom, or substituted or unsubstituted alkyl group having 1 to 6 carbon atoms; R1 represents a group having a lactone skeleton; and Y represents a bivalent organic group having 1 to 6 carbon atoms.
摘要:
An air-cooled engine (10) has a fan cover (16) for covering a cooling fan (14). The cover (16) is composed of a fan-cover peripheral wall (44) for covering the outside of the cooling fan (14), and a top board (45) for closing off one end of the fan-cover peripheral wall (44). The fan-cover peripheral wall (44) has an internally disposed guiding duct (47) for guiding cooling air (Wi) from the cooling fan (14) to an engine main body (12). A first fastening member (42) secures a portion of the external part of the fan-cover peripheral wall (44) that is proximal to the guiding duct (47) to a casing (25) of the engine main body (12). A second fastening member (41) extends from the casing (25) and through the fan-cover peripheral wall (44), and secures a top board (45) in a portion that is at a distance from the guiding duct (47).
摘要:
In a transfer device R, which feeds a first web group W20 obtained by overlapping a plurality of webs and vertically folding them in a half width by a former F11 and a second web group W10 of a plurality of overlapped webs in the same width dimension as that of the first web group W20 vertically folded by the former F11 in mutual overlap between a cutting cylinder C1 and a folding cylinder C2, so as to form a newspaper signature, wherein at least one transfer roller R1, R2, R3, or R3′ is provided for guiding the second web group W10 to a position at which it is overlapped on the first web group W20 and at least one out of the transfer rollers is rotationally driven, at least one of the transfer rollers to be driven is a roller having a step formed at a peripheral surface in a range in contact with the web while circumferential surfaces having different diameters in an axial direction are adjacent to each other, thus providing the transfer device for a folder unit capable of applying an appropriate tension to each of the webs constituting the web group, so as to prevent the web from being deviated or meandering.
摘要:
For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.