公开(公告)号：US07576430B2

公开(公告)日：2009-08-18

申请号：US11669160

申请日：2007-01-31

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Abstract translation: 提供了包括第一基板，第二基板，非导电粘合剂层和球形间隔件的接合结构。 第一衬底具有第一接合焊盘。 第二基板设置在第一基板的一侧，并且分别包括设置在第二接合焊盘上的第二接合焊盘和顺应凸块。 第二基板上的第二接合焊盘分别通过柔性凸块电连接到第一基板上的第一接合焊盘。 非导电性粘合剂层夹在第一基板和第二基板之间。 球形间隔件分布在非导电粘合剂层中以保持第一和第二基板之间的间隙。

公开(公告)号：US07531900B2

公开(公告)日：2009-05-12

申请号：US11554597

申请日：2006-10-31

Applicant: Ji-Cheng Lin ,  Shyh-Ming Chang

Inventor： Ji-Cheng Lin ,  Shyh-Ming Chang

IPC: H01L23/48

CPC classification number: H01L24/12 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/185 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A package structure with embedded electronic devices is provided. The package structure includes a substrate, a multi-layered circuit board, an adhesive film and at least an electronic device. The electronic device is disposed on the substrate. The electronic device is press-adhered to the multi-layered circuit board through the adhesive film and the composite bump thereon, so that the electronic device is embedded within the package structure and between the substrate and the circuit board. Due to the deformity of the composite bump, the electronic device is protected from being cracking in the pressing process.

Abstract translation: 提供了具有嵌入式电子设备的封装结构。 封装结构包括衬底，多层电路板，粘合膜和至少一个电子器件。 电子设备设置在基板上。 电子器件通过粘合剂膜及其上的复合凸块压接到多层电路板上，使得电子器件嵌入在封装结构内，衬底与电路板之间。 由于复合凸块的变形，电子器件在压制过程中被保护不会开裂。

公开(公告)号：US20070210429A1

公开(公告)日：2007-09-13

申请号：US11554597

申请日：2006-10-31

Applicant: Ji-Cheng Lin ,  Shyh-Ming Chang

Inventor： Ji-Cheng Lin ,  Shyh-Ming Chang

IPC: H01L23/02

CPC classification number: H01L24/12 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/185 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A package structure with embedded electronic devices is provided. The package structure includes a substrate, a multi-layered circuit board, an adhesive film and at least an electronic device. The electronic device is disposed on the substrate. The electronic device is press-adhered to the multi-layered circuit board through the adhesive film and the composite bump thereon, so that the electronic device is embedded within the package structure and between the substrate and the circuit board. Due to the deformity of the composite bump, the electronic device is protected from being cracking in the pressing process.

Abstract translation: 提供了具有嵌入式电子设备的封装结构。 封装结构包括衬底，多层电路板，粘合膜和至少一个电子器件。 电子设备设置在基板上。 电子设备通过粘合剂膜及其上的复合凸块压接到多层电路板上，使得电子器件嵌入在封装结构内，衬底与电路板之间。 由于复合凸块的变形，电子器件在压制过程中被保护不会开裂。

公开(公告)号：US20070096279A1

公开(公告)日：2007-05-03

申请号：US11516944

申请日：2006-09-06

Applicant: Shyh-Ming Chang ,  Ji-Cheng Lin ,  Shou-Lung Chen

Inventor： Shyh-Ming Chang ,  Ji-Cheng Lin ,  Shou-Lung Chen

IPC: H01L23/02

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311

Abstract: A structure for protecting electronic package contacts and the method for manufacturing the same are provided. The protective layer is used to prevent stresses from being gathered within electronic contacts on the chip and the vias for rerouting so as to raise the reliability of the conductor trace line in the electronic package structure. The protecting layer is formed in the wafer-level manufacturing processes by coating, depositing, and printing. The method is suitable for all kinds of electronic package structures owing to its high compatibility.

Abstract translation: 提供了一种用于保护电子封装触点的结构及其制造方法。 保护层用于防止应力集中在芯片上的电子触点和用于重新布线的通孔中，以提高电子封装结构中的导体迹线的可靠性。 通过涂布，沉积和印刷在晶片级制造工艺中形成保护层。 该方法由于兼容性高，适用于各种电子封装结构。

公开(公告)号：US07154176B2

公开(公告)日：2006-12-26

申请号：US10714277

申请日：2003-11-14

Applicant: Yuan-Chang Huang ,  Shyh-Ming Chang ,  Su-Chia Lu

Inventor： Yuan-Chang Huang ,  Shyh-Ming Chang ,  Su-Chia Lu

IPC: H01L23/52 ,  H01L23/48

CPC classification number: H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05026 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05099

Abstract: A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.

Abstract translation: 一种微电子结构，其具有多个导电凸块的基板，用于在倒装芯片电子组件的制造中与电子基板上的接合焊盘接触。 每个导电凸块包括导体层，该导电层不存在于凸起的至少一个侧壁中，以防止电子组件中相邻的导电凸块之间的短路电路无意形成。

公开(公告)号：US06919642B2

公开(公告)日：2005-07-19

申请号：US10190276

申请日：2002-07-05

Applicant: Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

Inventor： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC: H01L21/56 ,  H05K1/02 ,  H05K3/30 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

Abstract translation: 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US6024274A

公开(公告)日：2000-02-15

申请号：US627134

申请日：1996-04-03

Applicant: Shyh-Ming Chang ,  Shyuan-Jeng Ho ,  Yu-Chi Lee ,  Jen-Huang Jeng ,  Pao-Yun Tang ,  Su-Yu Fang

Inventor： Shyh-Ming Chang ,  Shyuan-Jeng Ho ,  Yu-Chi Lee ,  Jen-Huang Jeng ,  Pao-Yun Tang ,  Su-Yu Fang

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC classification number: H01L24/86 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/13624 ,  H01L2224/13655 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/13684 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

Abstract translation: 通过其手指引线的带状载体被结合到IC芯片上的复合凸块的胶带自动粘合（TAB）工艺，其中复合凸块由聚合材料层和至少一个金属层构成。 聚合材料层具有比金属层低的刚性（或较低的杨氏模量）。 消除了由刚性金属凸块经常引起的接合过程中的结构损坏。 TAB接合工艺可以通过使用全金属引线框架，电镀金属引线框架或聚合物强化金属引线框架来进行。 构成在IC芯片上的聚合物/金属复合凸块在热粘合剂中粘合时需要较小的粘结力。

公开(公告)号：US5707902A

公开(公告)日：1998-01-13

申请号：US507533

申请日：1995-07-26

Applicant: Shyh-Ming Chang ,  Yu-Chi Lee ,  Jwo-Huei Jou

Inventor： Shyh-Ming Chang ,  Yu-Chi Lee ,  Jwo-Huei Jou

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11901 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.

Abstract translation: 复合凸块结构和形成复合凸块结构的方法。 与由在集成电路元件或衬底的输入/输出焊盘处形成的导电金属涂层覆盖的金属相比，复合凸块结构包括相对低的杨氏模量的聚合物体。 使用材料沉积，光刻和蚀刻技术形成复合凸块。 如果需要后续处理，可以在复合凸块上形成一层焊接金属。 可以使用覆盖集成电路元件输入/输出垫的基底金属垫来提供复合凸块的位置的增加的灵活性。 复合凸块可以直接形成在输入/输出垫或基底金属垫上。

公开(公告)号：US5578527A

公开(公告)日：1996-11-26

申请号：US494582

申请日：1995-06-23

Applicant: Shyh-Ming Chang ,  Yu-Chi Lee ,  Pao-Yun Tang

Inventor： Shyh-Ming Chang ,  Yu-Chi Lee ,  Pao-Yun Tang

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/49883 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/323 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674

Abstract: This invention provides a connection structure and methods of forming the connection structure which combines the advantages of composite bumps and conductive films formed of conductive particles in a non-conductive binder. The conductive film provides conductive particles in a non-conductive binder which can be placed on the input/output pads of an integrated circuit element or substrate. The conductive particles contact composite bumps comprised of a polymer body, having a relatively low Young's Modulus, and a conductive metal coating to form the connection structure. The relatively low Young's Modulus of the composite bumps greatly reduce the recoil forces during bonding. Because of the low recoil forces the connection can be formed with reduced bonding force and forces tending to separate the connection once formed are reduced. The non-conductive binder is cured to form the adhesive between the integrated circuit element and the substrate.

Abstract translation: 本发明提供了形成连接结构的连接结构和方法，其结合了复合凸块和由导电粘合剂中的导电颗粒形成的导电膜的优点。 导电膜在非导电粘合剂中提供导电颗粒，其可以放置在集成电路元件或衬底的输入/输出焊盘上。 导电颗粒接触由具有相对低的杨氏模量的聚合物主体组成的复合凸块和导电金属涂层以形成连接结构。 复合凸块的相对较低的杨氏模量大大降低了接合期间的反冲力。 由于低的反冲力，连接可以以减小的结合力形成，并且一旦形成就会趋于分离连接。 固化非导电粘合剂以在集成电路元件和基板之间形成粘合剂。

公开(公告)号：US20110230044A1

公开(公告)日：2011-09-22

申请号：US13150470

申请日：2011-06-01

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang ,  Chao-Chyun An

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang ,  Chao-Chyun An

IPC: H01L21/60

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.

Abstract translation: 引入具有兼容凸起和测试区域的接触结构及其制造方法。 柔性突起形成在硅晶片或印刷电路板的导电接触上。 凸块的核心由聚合材料制成，并涂覆有导电材料。 特别地，柔性突起设置在包括凸起和测试区域的导电接触结构的一侧上，其中测试区域允许该区域被功能性测试，以便防止涂覆的导电材料的损坏超过 探针测试期间的顺应性凸块。