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    PATTERNED UV SENSITIVE SILICONE-PHOSPHOR LAYER OVER LEDS
    22.
    发明申请
    PATTERNED UV SENSITIVE SILICONE-PHOSPHOR LAYER OVER LEDS 审中-公开
    图案紫外线敏感硅胶 - 磷光体层

    公开(公告)号：US20140008685A1

    公开(公告)日：2014-01-09

    申请号：US14004434

    申请日：2012-03-20

    申请人： Grigoriy Basin ,  Paul Scott Martin

    发明人： Grigoriy Basin ,  Paul Scott Martin

    IPC分类号： H01L33/50

    CPC分类号： H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2933/0041 ,  H01L2933/0091

    摘要： LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.

    摘要翻译： LED芯片安装在单个底座瓦片（或晶片）上。 LED管芯具有发光顶表面。 然后将沉积有磷光体的均匀厚的UV敏感硅胶层沉积在瓷砖上，包括在LED管芯的顶部和侧面。 只需要在LED模具的顶部和侧面上的硅氧烷/磷光体，因此需要去除直接在瓷砖上的硅氧烷/磷光体。 然后将硅氧烷/磷光体层掩蔽以暴露出保持为UV光的区域，这产生交联的硅氧烷。 然后将未曝光的硅氧烷/磷光体层用溶剂溶解并从瓷砖表面除去。 可以限定硅氧烷/磷光体层以暴露LED管芯上的引线接合电极。 瓦片最终被分割以产生单个的磷光体转换的LED。

    Wavelength converted semiconductor light emitting device
    23.
    发明授权
    Wavelength converted semiconductor light emitting device 有权
    波长转换半导体发光器件

    公开(公告)号：US08203161B2

    公开(公告)日：2012-06-19

    申请号：US12624156

    申请日：2009-11-23

    申请人： Dmitri Simonian ,  Grigoriy Basin

    发明人： Dmitri Simonian ,  Grigoriy Basin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/504 ,  H01L25/167 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A luminescent material is positioned in a path of light emitted by the light emitting layer. A thermal coupling material is disposed in a transparent material. The thermal coupling material has a thermal conductivity greater than a thermal conductivity of the transparent material. The thermal coupling material is positioned to dissipate heat from the luminescent material.

    摘要翻译： 一种器件包括半导体结构，其包括设置在n型区域和p型区域之间的发光层。 发光材料位于由发光层发射的光的路径中。 热耦合材料设置在透明材料中。 热耦合材料的导热率大于透明材料的热导率。 热耦合材料被定位成散发来自发光材料的热量。

    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE
    24.
    发明申请
    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE 审中-公开
    LED包装与磷酸盐和反射基板

    公开(公告)号：US20110049545A1

    公开(公告)日：2011-03-03

    申请号：US12552328

    申请日：2009-09-02

    申请人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

    摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

    摘要翻译： 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

    Light emitting device with molded wavelength converting layer
    25.
    发明授权
    Light emitting device with molded wavelength converting layer 有权
    具有模制波长转换层的发光器件

    公开(公告)号：US08771577B2

    公开(公告)日：2014-07-08

    申请号：US12706149

    申请日：2010-02-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： B29C43/18

    CPC分类号： H01L33/504 ,  B29C43/18 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

    摘要翻译： 包括波长转换材料的柔性膜位于光源上。 柔性膜符合预定的形状。 在一些实施例中，光源是安装在支撑衬底上的发光二极管。 二极管与模具中的压痕对准，使得柔性膜设置在支撑基板和模具之间。 透明成型材料设置在支撑基板和模具之间。 将支撑基板和模具压在一起以使模制材料填充凹陷。 柔性膜符合光源或模具的形状。

    LAMINATING APPARATUS
    26.
    发明申请
    LAMINATING APPARATUS 有权
    层压装置

    公开(公告)号：US20130133836A1

    公开(公告)日：2013-05-30

    申请号：US13816540

    申请日：2011-07-19

    申请人： Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

    发明人： Ryoichi Yasumoto ,  Kazutoshi Iwata ,  Kinya Kodama ,  Grigoriy Basin

    IPC分类号： B32B37/10

    CPC分类号： B32B37/10 ,  B29C43/18 ,  B32B37/003 ,  B32B37/1009 ,  B32B39/00 ,  B32B2309/12 ,  B32B2309/65 ,  B32B2309/68 ,  B32B2457/08 ,  H01L33/52 ,  H05K3/284 ,  H05K2203/1311 ,  Y10T156/1744

    摘要： A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

    摘要翻译： 提供了一种层叠装置，其使树脂膜完全符合基板的突出和凹陷部分，并且使得适形树脂膜的膜厚度在更严格的水平上均匀。 为此，层压装置包括层压机构，其包括：封闭空间形成接收器，其能够在其中接收临时层压体; 以及用于在由封闭空间形成接收器形成的封闭空间中以非接触关系向临时层叠体施加压力的压力层压机，以从临时层压体形成端部层叠体。

    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER
    27.
    发明申请
    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER 审中-公开
    LED与硅胶层和层压式远距离磷酸盐层

    公开(公告)号：US20110031516A1

    公开(公告)日：2011-02-10

    申请号：US12537909

    申请日：2009-08-07

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16 ,  H01L2933/0041

    摘要： A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.

    摘要翻译： 描述了一种用于制造发光器件的方法，其中倒装芯片发光二极管（LED）管芯的阵列安装在基座晶片上。 在每个LED管芯上同时模制半球形的第一硅氧烷层。 将预先形成的柔性荧光体层，包括注入硅氧烷的荧光体粉末层压在第一硅氧烷层上，以符合半球形第一硅氧烷层的外表面。 然后在荧光体层上模制硅树脂透镜。 通过预处理荧光体层，可以使荧光体层具有非常严格的公差并进行测试。 通过模制的半球状硅氧烷层将荧光体层与LED芯片分开，颜色与视角是恒定的，并且荧光体不会被热降解。 柔性荧光体层可以包括多个不同的荧光体层，并且可以包括反射器或其它层。

    Silicone based reflective underfill and thermal coupler
    30.
    发明授权
    Silicone based reflective underfill and thermal coupler 有权
    硅基反射底部填充和热耦合器

    公开(公告)号：US08471280B2

    公开(公告)日：2013-06-25

    申请号：US12613924

    申请日：2009-11-06

    申请人： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    发明人： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    IPC分类号： H01L23/29

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.

    摘要翻译： 在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度的金柱。 金柱结合到底座电极。 然后将底部填充材料模制以填充LED底部和底座之间的空隙。 底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。 氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。 氧化铝是白色粉末。 底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。 底部填充物也随机化光散射，改善光提取。 分布式金柱和底层填料在生长衬底剥离过程中支持LED层。