公开(公告)号：US06475703B2

公开(公告)日：2002-11-05

申请号：US09203148

申请日：1998-12-01

Applicant: Delin Li ,  Achyuta Achari ,  Alice Dawn Zitzmann ,  Robert Edward Belke, Jr. ,  Brenda Joyce Nation ,  Edward McLeskey ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka

Inventor： Delin Li ,  Achyuta Achari ,  Alice Dawn Zitzmann ,  Robert Edward Belke, Jr. ,  Brenda Joyce Nation ,  Edward McLeskey ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka

IPC: G03C556

CPC classification number: H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Abstract translation: 一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

公开(公告)号：US06403893B2

公开(公告)日：2002-06-11

申请号：US09907971

申请日：2001-03-20

Applicant: Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K114

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49156

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract translation: 一种用于制造具有电镀孔96,98的多层电子电路板136的方法，其可以与电接地构件46选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。

公开(公告)号：US06320128B1

公开(公告)日：2001-11-20

申请号：US09578394

申请日：2000-05-25

Applicant: Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

Inventor： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

IPC: H01L2328

CPC classification number: H05K3/284 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/189 ,  H05K5/0095 ,  H01L2924/00

Abstract: An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

Abstract translation: 电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。 同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。 以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性 以及组装服务环境特征的其他物质的渗透/渗透。 还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。 优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。

公开(公告)号：US6019910A

公开(公告)日：2000-02-01

申请号：US995449

申请日：1997-12-22

Applicant: Achyuta Achari ,  Delin Li

Inventor： Achyuta Achari ,  Delin Li

IPC: C23F1/36 ,  H05K3/06 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  C09K13/02

CPC classification number: H05K3/062 ,  C23F1/36 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685

Abstract: The invention is an aluminum etchant and method for chemically milling aluminum, according to one embodiment, from a copper-aluminum-copper tri-metal layer to form electronic circuits. The tri-metal comprises copper circuit patterns present on opposing surfaces of an aluminum foil, one of the copper patterns being laminated on a substrate. The etchant comprises an aqueous solution of 50 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and 60 to 500 g/l nitrate salt. The method comprises contacting the tri-metal with the etchant at a temperature between 25 and 95.degree. C. for a time sufficient to remove a desired amount of the aluminum layer and provide electronic circuitry (rigid/flexible/3-dimensional circuitry) which contains multiple conductive circuit layers.

Abstract translation: 本发明是根据一个实施方案从铜 - 铜 - 铜三金属层化学研磨铝以形成电子电路的铝蚀刻剂和方法。 三金属包括存在于铝箔的相对表面上的铜电路图案，其中一个铜图案层压在基板上。 蚀刻剂包含选自（a）氢氧化钠，（b）氢氧化钾和（c）它们的混合物的50-500g / l碱的水溶液; 和60至500g / l硝酸盐。 该方法包括使三金属与蚀刻剂在25℃和95℃之间的温度下接触一段足以移除所需量的铝层的时间并提供电子电路（刚性/柔性/ 3维电路），其包含 多个导电电路层。

公开(公告)号：US20140291147A1

公开(公告)日：2014-10-02

申请号：US13895483

申请日：2013-05-16

Applicant: Delin Li

Inventor： Delin Li

IPC: C23C14/34 ,  H01L31/18

CPC classification number: C23C14/3414 ,  C23C14/16 ,  H01L31/0322 ,  H01L31/0749 ,  H01L31/1864 ,  Y02E10/541 ,  Y02P70/521

Abstract: A sputtering target device is provided for manufacturing solar cells. The target device includes a metal selected from a group consisting of copper, indium, and molybdenum and further includes antimony or antimony-containing compound mixed in a matrix of the metal. The target device comprises antimony of 0.1 to 20 wt % and the metal of at least 80 wt %. The target device is installed in a deposition system for forming a back electrode doped with antimony or for forming at least one precursor layer doped with antimony among a stack of multiple precursor layers for forming a semiconductor photovoltaic absorber material.

Abstract translation: 提供用于制造太阳能电池的溅射靶设备。 目标装置包括选自铜，铟和钼的金属，并且还包括混合在金属基质中的含锑或锑化合物。 目标装置包括0.1至20重量％的锑和至少80重量％的金属。 目标装置安装在用于形成掺杂有锑的背面电极的沉积系统中，或用于在用于形成半导体光伏吸收材料的多个前体层的堆叠中形成至少一个掺杂有锑的前体层。

公开(公告)号：US20140141562A1

公开(公告)日：2014-05-22

申请号：US13941012

申请日：2013-07-12

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L31/18

CPC classification number: H01L31/03928 ,  C23C16/45561 ,  C23C16/545 ,  H01L21/67155 ,  H01L21/67161 ,  H01L21/67173 ,  H01L22/10 ,  H01L22/26 ,  H01L31/0322 ,  H01L31/18 ,  Y02E10/541

Abstract: The present invention provides an apparatus and a method for manufacturing a CIGS absorber of a thin film solar cell. The apparatus includes a supply chamber configured to provide a flexible substrate coated with precursors. The apparatus further includes a reaction chamber coupled to the supply chamber for at least subjecting the precursors on the flexible substrate to a reactive gas at a first state to form an absorber material. Additionally, the apparatus includes a gas-balancing chamber filled with the reactive gas at a second state. The gas-balancing chamber is communicated with the reaction chamber for automatically updating the first state of the reactive gas to the second state. Moreover, the apparatus includes a control system to maintain the second state of the reactive gas in the gas-balancing chamber at a preset condition and to adjust the transportation of the flexible substrate through the reaction chamber.

Abstract translation: 本发明提供一种用于制造薄膜太阳能电池的CIGS吸收体的装置和方法。 该设备包括供应室，其构造成提供涂覆有前体的柔性基材。 该装置还包括耦合到供应室的反应室，用于至少使柔性基板上的前体经受第一状态的反应性气体以形成吸收材料。 另外，该装置包括在第二状态下填充有反应性气体的气体平衡室。 气体平衡室与反应室连通，用于将反应气体的第一状态自动更新为第二状态。 此外，该装置包括将气体平衡室中的反应气体的第二状态保持在预设状态并调节柔性基板通过反应室的输送的控制系统。

公开(公告)号：US20130230933A1

公开(公告)日：2013-09-05

申请号：US13849678

申请日：2013-03-25

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L31/0272

CPC classification number: H01L31/0272 ,  C25D3/40 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/18 ,  C25D5/48 ,  C25D7/126 ,  H01L21/02425 ,  H01L21/02491 ,  H01L21/02568 ,  H01L21/02614 ,  H01L21/02628 ,  H01L22/12 ,  H01L31/0322 ,  H01L31/03928 ,  H01L31/0749 ,  Y02E10/541 ,  Y02P70/521

Abstract: A method for fabricating a thin-film solar cell. The method includes rolling a flexible substrate prepared with a metalized surface out of a roll to move linearly with a speed. The method further includes forming a back-electrode film overlying the metalized surface moving with the speed. Additionally, the method includes forming a stack of films comprising at least copper, gallium, and indium overlying the back-electrode film and forming a Se-alloy layer overlying the stack of films. Furthermore, the method includes depositing a Se—Na bearing film overlying the Se-alloy layer from a vacuum evaporator having at least two sources. Moreover, the method includes performing a thickness measurement in real time for the back-electrode film, the stack of films, and the Se-alloy layer on the flexible substrate moving with the speed to control the Se-alloy layer in a thickness of 10-100 nm corresponding to the Se—Na film in a thickness of 1-3 microns.

Abstract translation: 一种制造薄膜太阳能电池的方法。 该方法包括将由金属化表面制备的柔性基材滚出，以速度线性地移动。 该方法还包括形成覆盖金属化表面的背面电极膜，该表面以速度移动。 此外，该方法包括形成至少包含覆盖在背电极膜上的铜，镓和铟的膜的叠层，并且形成覆盖该层叠膜的Se合金层。 此外，该方法包括从具有至少两个源的真空蒸发器沉积覆盖Se合金层的Se-Na轴承膜。 此外，该方法包括对于背面电极膜，薄膜叠层和柔性基板上的Se合金层实时地进行厚度测量，以便以Se的速度控制Se合金层的厚度为10 -100nm对应于厚度为1-3微米的Se-Na膜。

公开(公告)号：US08454764B2

公开(公告)日：2013-06-04

申请号：US12919044

申请日：2008-02-25

Applicant: Robert Logan ,  Delin Li ,  Shuzhi Yu ,  Gangjun Liao

Inventor： Robert Logan ,  Delin Li ,  Shuzhi Yu ,  Gangjun Liao

IPC: C22C37/08 ,  C22C37/04 ,  F02B53/00

CPC classification number: C22C37/04 ,  C22C37/08 ,  C22C37/10

Abstract: A nodular graphite, heat-resistant cast iron composition for use in engine systems. The composition contains carbon 1.5-2.4 weight %, silicon 5.4-7.0 weight %, manganese 0.5-1.5 weight %, nickel 22.0-28.0 weight %, chromium 1.5-3.0 weight %, molybdenum 0.1-1.0 weight %, magnesium 0.03-0.1 weight %, and a balance weight % being substantially iron. The composition has an austenitic matrix. Additionally, the composition exhibits excellent oxidation resistance at high temperature and excellent mechanical properties at both room and high temperatures. Thus, the composition can be a lower cost substitute material for Ni-Resist D5S under thermocycling conditions experienced by exhaust gas accessories and housings such as engine exhaust manifolds, turbocharger housings, and catalytic converter housings.

Abstract translation: 用于发动机系统的结节状石墨，耐热铸铁组合物。 该组合物包含1.5-2.4重量％的碳，5.4-7.0重量％的硅，0.5-1.5重量％的锰，22.0-28.0重量％的镍，1.5-3.0重量％的铬，0.1-1.0重量％的钼，0.03-0.1重量％ ％，平衡重量％基本上为铁。 该组合物具有奥氏体基质。 此外，该组合物在高温下表现出优异的抗氧化性和在室温和高温下都具有优异的机械性能。 因此，组合物可以是由排气附件和诸如发动机排气歧管，涡轮增压器壳体和催化转化器壳体的壳体经历的热循环条件下的Ni-Resist D5S的较低成本替代材料。

公开(公告)号：US20090272422A1

公开(公告)日：2009-11-05

申请号：US12430114

申请日：2009-04-27

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L31/042 ,  H01L31/00

CPC classification number: H01L31/0322 ,  H01L31/022425 ,  H01L31/035281 ,  H01L31/046 ,  H01L31/0543 ,  H01L31/0749 ,  Y02E10/52 ,  Y02E10/541 ,  Y02P70/521

Abstract: A solar cell has a first surface and the second surface areas. The first surface is a semi-cylindrical area or modified semi-cylindrical area. The first surface is a flattened area. Sunlight strikes the semi-cylindrical area of the solar cell surface with a maximum incident angle from sunrise to sunset. A mirror may be attached on the top surface of the solar cell to further improve the efficiency.

Abstract translation: 太阳能电池具有第一表面和第二表面区域。 第一表面是半圆柱形区域或改进的半圆柱形区域。 第一个表面是平坦的区域。 阳光照射太阳能电池表面的半圆柱形区域，具有从日出到日落的最大入射角。 可以在太阳能电池的顶表面上附接反射镜以进一步提高效率。

公开(公告)号：US20080274005A1

公开(公告)日：2008-11-06

申请号：US11913596

申请日：2006-05-04

Applicant: Gangjun Liao ,  Delin Li ,  Gene B. Burger ,  Robert N. Logan

Inventor： Gangjun Liao ,  Delin Li ,  Gene B. Burger ,  Robert N. Logan

IPC: C22C37/10 ,  C22C37/00 ,  C22C37/06

CPC classification number: C22C37/10 ,  C21D5/00 ,  C22C33/08 ,  C22C37/04

Abstract: A nodular, compacted graphite or other hybrid or duplex graphite morphology cast high silicon iron is disclosed which contains up to 1.5% tungsten, up to 0.8% vanadium, and up to 1.2% niobium; and at least 60.0% iron, all percentages are based on the total weight of the composition. This cast iron exhibits high strength and good ductility over a wide temperature range compared to the conventional SiMo ductile iron. The compositions may further contain, up to 1.5% molybdenum and up to 1.0% chromium to offer improvements in material strength. The compositions may include 0.2 to 0.5% by weight aluminum and up to 1.2% chromium for further oxidation resistance and 0.5 to 5.0% nickel for corrosion resistance.

Abstract translation: 公开了一种结节状，压实的石墨或其他混合或双相石墨形态铸造的高硅铁，其含有高达1.5％的钨，至多0.8％的钒和至多1.2％的铌; 和至少60.0％的铁，所有百分比均基于组合物的总重量。 与传统的SiMo球墨铸铁相比，这种铸铁在宽的温度范围内表现出高强度和良好的延展性。 组合物还可含有至多1.5％的钼和至多1.0％的铬以提供材料强度的改善。 组合物可以包含0.2至0.5重量％的铝和至多1.2重量％的铬以用于进一步的抗氧化性，以及0.5-5.0％的镍用于耐腐蚀性。