公开(公告)号：US08357858B2

公开(公告)日：2013-01-22

申请号：US12617719

申请日：2009-11-12

Applicant: Ajit Khosla ,  Bonnie Lynne Gray

Inventor： Ajit Khosla ,  Bonnie Lynne Gray

IPC: H05K1/11 ,  B32B9/04 ,  B29C39/00 ,  B29C39/12 ,  H01B1/12 ,  H01B1/04

CPC classification number: H01B1/124 ,  B82Y40/00 ,  H01B1/24 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0314 ,  H05K2201/0329 ,  H05K2203/0113 ,  Y10S977/752 ,  Y10S977/779 ,  Y10S977/81 ,  Y10T428/24942 ,  Y10T428/31504

Abstract: An electrically conductive, thermosetting elastomeric composition is provided. The composition may comprise: an initially substantially non-electrically conductive, thermosetting base polymer; a particulate filler comprising electrically conductive particles; and an electrically conductive polymer additive. The non-electrically conductive, thermosetting base polymer, the particulate filler and the electrically conductive polymer additive are mixed substantially macroscopically homogeneously.

Abstract translation: 提供导电的热固性弹性体组合物。 组合物可以包括：初始基本上非导电的热固性基础聚合物; 包含导电颗粒的颗粒填料; 和导电聚合物添加剂。 非导电性，热固性基础聚合物，颗粒填料和导电聚合物添加剂基本上在宏观上均匀混合。

公开(公告)号：US08282406B2

公开(公告)日：2012-10-09

申请号：US12729729

申请日：2010-03-23

Applicant: David A Pipho ,  David W Kuehl ,  Patrick R Conway

Inventor： David A Pipho ,  David W Kuehl ,  Patrick R Conway

IPC: H01R13/53

CPC classification number: H01R13/6485 ,  H01R12/721 ,  H05K1/0259 ,  H05K1/141 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10325 ,  Y10T29/49147 ,  Y10T29/49208

Abstract: An electrical connector having electrostatic discharge protection comprises a body and an electrostatic discharge dissipative element. The body defines a socket having electrical contacts configured to make electrical contact with electrical contacts along a bottom surface of a component module when the component module is inserted in the socket. The electrostatic discharge dissipative element is configured to make contact with the electrical contacts along the bottom surface of the component module before the electrical contacts along the bottom surface of the component module make contact with the electrical contacts of the socket.

Abstract translation: 具有静电放电保护的电连接器包括主体和静电放电耗散元件。 主体限定了一个插座，其具有电触头，当触头部件模块被插入插座中时，电触头被构造成沿着元件模块的底表面与电触点电接触。 静电放电耗散元件被配置为在沿着元件模块的底表面的电触点与插座的电触头接触之前沿着元件模块的底表面与电触点接触。

公开(公告)号：US20120103673A1

公开(公告)日：2012-05-03

申请号：US13346087

申请日：2012-01-09

Applicant: Nobuaki HASHIMOTO

Inventor： Nobuaki HASHIMOTO

IPC: H05K1/02

CPC classification number: H05K3/325 ,  G02F2001/13456 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13008 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2224/05099

Abstract: A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.

Abstract translation: 电子部件的安装结构包括：包括在电子部件中的凸块电极，具有内部树脂作为芯的凸块电极和覆盖内部树脂的表面的导电膜，并且弹性变形，以便遵循 端子的至少一个角部，使得导电膜与端子的顶表面的至少一部分和沿着端子的厚度方向的表面的至少一部分直接导电接触; 具有安装在基板上的端子和电子部件的基板; 以及保持单元，其设置到所述基板和所述电子部件，以保持所述凸起电极变形的状态与所述端子导电接触。

公开(公告)号：US08130511B2

公开(公告)日：2012-03-06

申请号：US12227059

申请日：2007-05-14

Applicant: Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

Inventor： Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC: H05K1/11

CPC classification number: H05K3/368 ,  H01L2224/16225 ,  H01R12/61 ,  H01R12/714 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/0314 ,  H05K2201/042 ,  H05K2201/09409 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.

Abstract translation: 提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加 为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至 如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。 电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。 这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

公开(公告)号：US08058565B2

公开(公告)日：2011-11-15

申请号：US11568111

申请日：2005-04-15

Applicant: Yukihiro Kiuchi ,  Masahiro Ishibashi ,  Yoshitaka Kyogoku

Inventor： Yukihiro Kiuchi ,  Masahiro Ishibashi ,  Yoshitaka Kyogoku

IPC: H05K1/00 ,  H05K1/16

CPC classification number: H01L23/10 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0314 ,  H05K2201/10674 ,  H05K2203/1536 ,  Y10T29/49124

Abstract: In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.

Abstract translation: 在半导体装置（1）中，设置多层布线层的封装基板（2），在封装基板的最上层布线层（矩阵状）配置多个安装基板（5） 2），并且焊料凸块（7）连接到安装焊盘（5）。 通过焊锡凸块（7）将半导体芯片（9）安装在封装板（2）上。 封装基板（2）的最上层布线层由温度为10〜30℃的杨氏模量为1GPa以下的树脂材料形成，断裂伸长率为50％以上。

公开(公告)号：US20110124207A1

公开(公告)日：2011-05-26

申请号：US12931518

申请日：2011-02-03

Applicant: James V. Russell

Inventor： James V. Russell

IPC: H01R12/00

CPC classification number: H01R13/2414 ,  H01R4/58 ,  H01R13/03 ,  H05K3/245 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/10719

Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.

公开(公告)号：US07773388B2

公开(公告)日：2010-08-10

申请号：US11566912

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H01R9/00

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

Abstract translation: 本发明是提供一种印刷电路板，其中即使在高度集成的半导体装置安装在其上时也能够降低由半导体芯片和印刷电路板的热膨胀系数之间的差异引起的故障连接或断开，并且电子 设备使用相同。 根据本发明的电子设备（4）包括具有元件安装销（18）的印刷电路板（1）和具有电极焊盘（3）的表面安装型半导体设备（2），其中元件安装 销（18）具有弹性并且被推靠在电极焊盘（3）上以保持电连接。

公开(公告)号：US20100184309A1

公开(公告)日：2010-07-22

申请号：US12597130

申请日：2008-04-28

Applicant: Tan Duc Huynh

Inventor： Tan Duc Huynh

IPC: H01R13/24 ,  G01R27/02

CPC classification number: H01R13/641 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2428 ,  H01R2201/20 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: An electronic device includes least two electronic components linked electrically to one another using a flexible connector. The flexible connector includes multiple conducting blades, and is interposed between the two electrical components such that longitudinal edges of the flexible connector are held in contact against respective connection pads of each of the electronic components. The flexible connector is ultimately compressed, respectively, against both electronic components. The electronic device is equipped with two additional conducting blades for checking the state of compression of the flexible connector. The two additional conducting blades include an electrical circuit for determining the state of compression of the flexible connector by a resistive measurement and integrating at least one additional conducting blade of the flexible connector.

Abstract translation: 电子设备包括使用柔性连接器彼此电连接的至少两个电子部件。 柔性连接器包括多个导电叶片，并且插入在两个电气部件之间，使得柔性连接器的纵向边缘保持与每个电子部件的相应连接焊盘接触。 柔性连接器最终分别压缩到两个电子部件上。 电子设备配有两个附加的导电叶片，用于检查柔性连接器的压缩状态。 两个额外的导电叶片包括用于通过电阻测量来确定柔性连接器的压缩状态并集成柔性连接器的至少一个附加导电叶片的电路。

公开(公告)号：US07724539B2

公开(公告)日：2010-05-25

申请号：US11504653

申请日：2006-08-16

Applicant: Hideaki Konno

Inventor： Hideaki Konno

IPC: H05K5/02

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10083 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder includes a projecting portion protruding from a pressing flange toward a cylinder axis of a holding portion, formed in a portion having a predetermined length of an inner edge of the pressing flange. With this construction, when the holder accommodating a small-sized electronic part is mounted to a casing of an apparatus, even if the pressing flange is rolled up and about to be disengaged from the small-sized electronic part, the projecting portion engages with the small-sized electronic part, thereby preventing the pressing flange from being rolled up.

Abstract translation: 根据本发明，提供了一种保持器，其具有在将具有小型电子部件的保持器按压并容纳在安装凹部中的情况下，不会容易地从小型电子部件脱离的压力凸缘。 保持器包括从按压凸缘朝向保持部的气缸轴线突出的突出部分，形成在具有预定长度的按压凸缘的内边缘的部分中。 利用这种结构，当将容纳小型电子部件的保持器安装到装置的壳体上时，即使按压凸缘卷起并且要从小型电子部件脱离，突出部分与 小型电子部件，从而防止按压凸缘卷起。

公开(公告)号：US07661964B2

公开(公告)日：2010-02-16

申请号：US11882028

申请日：2007-07-30

Applicant: Kazuaki Suzuki ,  Masaki Taniguchi

Inventor： Kazuaki Suzuki ,  Masaki Taniguchi

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/186 ,  H05K3/325 ,  H05K3/4611 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611

Abstract: A connecting part for ensuring a secure connection includes first connecting terminals that are arranged on one face of a supporting member and second connecting terminals that are arranged on the back face of the supporting member. The supporting member may have an elastic body. The connecting terminals are interconnected by conductive films which are formed on the face of the supporting member. Connecting parts are arranged between circuit boards on which electronic parts are mounted, and the circuit boards are mutually fixed in the state in which the connecting parts are compressed. The first and second connecting terminals are pushed against lands on the circuit boards by restoring force of the connecting parts, and then the circuit boards are electrically interconnected.

Abstract translation: 用于确保安全连接的连接部分包括布置在支撑构件的一个面上的第一连接端子和布置在支撑构件的背面上的第二连接端子。 支撑构件可以具有弹性体。 连接端子由形成在支撑构件的表面上的导电膜互连。 连接部件布置在其上安装电子部件的电路板之间，并且电路板在连接部件被压缩的状态下相互固定。 第一和第二连接端子通过连接部件的恢复力而被推靠在电路板上的平台上，然后电路板电互连。