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公开(公告)号：US20190281735A1
公开(公告)日：2019-09-12
申请号：US16425463
申请日：2019-05-29
发明人： Richard TSAI , Dusan LEE , Larry Don CREASY, JR.
摘要： According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a selectively plated roll of material includes a substrate, an electrically-conductive ink in a pattern along the substrate, and a metal plating on the electrically-conductive ink. The metal plating may be deposited on the electrically-conductive ink without over-plating the substrate whereat the electrically-conductive ink is not present.
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公开(公告)号：US10395853B2
公开(公告)日：2019-08-27
申请号：US15175629
申请日：2016-06-07
IPC分类号： C23C18/16 , C23C18/18 , C23C18/30 , C23C18/32 , C23C18/42 , C23C28/00 , C23C28/02 , C25D9/02 , D06M11/83 , D06M15/63 , D06M13/152 , H01G11/22 , H01G11/52 , H01G11/58 , D06M13/00 , D06M15/61 , D06M23/08 , C23C18/20 , C23C18/36 , C23C18/38 , C23C18/44 , D06M101/12 , C25D13/12
摘要： An electrode, process for preparing the electrode and devices thereof. An electrode comprising at least one metal deposited on a substrate; and at least one electrically conducting polymer. The devices comprising the electrode for energy storage and molecular separation.
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公开(公告)号：US10319911B2
公开(公告)日：2019-06-11
申请号：US15243146
申请日：2016-08-22
申请人： NIKON CORPORATION
IPC分类号： H01L51/00 , C23C18/54 , C23C18/20 , C23C18/16 , C23C18/28 , C23C18/32 , C23C18/42 , C23C18/30 , H01L51/05 , H01L51/10
摘要： A wiring pattern production method includes forming, on a substrate, a precursor film for a plating base film including a first formation material having an amino group protected by a photoreactive protecting group, forming a photoresist layer including a photoresist material on a surface of the precursor film, exposing the photoresist layer with a desired pattern of light, exposing the precursor film with a desired pattern of light to form the plating base film, developing the exposed photoresist layer, removing a deprotected protecting group, and depositing an electroless plating catalyst on the exposed surface of the plating base film.
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公开(公告)号：US10297773B2
公开(公告)日：2019-05-21
申请号：US15156958
申请日：2016-05-17
申请人： NIKON CORPORATION
IPC分类号： H01L21/02 , H01L21/288 , H01L21/28 , H01L29/786 , H01L51/00 , H01L51/05 , C23C18/31 , C23C18/32 , C23C28/00 , C23C18/16 , G03F7/20 , G03F7/32 , G03F7/40 , C23C18/30 , C23C18/34 , C23C18/42
摘要： A wiring pattern manufacturing method includes: applying a liquid body including a first formation material on a substrate to form a base film; applying a liquid body including a second formation material on at least part of a surface of the base film to form a protection layer of the base film; forming a resist layer on a surface of the protection layer to expose the resist layer with desired patterning light; causing the exposed resist layer to come into contact with a developer to remove the resist layer and the protection layer until the base film is uncovered corresponding to the patterning light; and after depositing a catalyst on a surface of the uncovered base film, causing an electroless plating solution to come into contact with the surface of the base film to perform electroless plating.
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25.发明授权公开(公告)号：US10294569B2
公开(公告)日：2019-05-21
申请号：US16034700
申请日：2018-07-13
摘要： A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
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公开(公告)号：US20190029126A1
公开(公告)日：2019-01-24
申请号：US16072091
申请日：2016-01-29
申请人： JCU CORPORATION
IPC分类号： H05K3/46 , H01L21/288 , C23C18/30 , C23C18/16
摘要： A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.
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公开(公告)号：US10161055B2
公开(公告)日：2018-12-25
申请号：US15087263
申请日：2016-03-31
发明人： Yuki Sato , Motoki Hiraoka , Hiroshi Yanagimoto , Hiroki Usui
IPC分类号： C23F1/00 , C03C15/00 , C03C25/68 , C25F3/00 , C25D5/08 , C25D3/00 , H05K3/00 , C25D5/02 , C25D7/00 , C25D17/00 , C25D17/12 , C25D21/10 , C25F3/02 , C25F7/00 , C23C18/16 , C23C18/30
摘要： A method of forming a wiring pattern includes: a) forming a metal underlayer including a first underlying wiring layer which is in contact with an electrode, a second underlying wiring layer which is not in contact with the electrode, and an underlying connection layer which connects the first underlying wiring layer to the second underlying wiring layer; b) forming a metal plating layer on the metal underlayer through electroplating; and c) removing a metal connection portion through etching. The metal connection portion is the underlying connection layer covered with the metal plating layer. The etching includes bringing a solid electrolyte material that contains a solution into which metal of the metal connection portion is dissolved, into contact with the metal connection portion and applying a voltage between the metal connection portion and the solid electrolyte material.
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公开(公告)号：US20180332713A1
公开(公告)日：2018-11-15
申请号：US16042947
申请日：2018-07-23
申请人： Averatek Corporation
IPC分类号： H05K3/18 , C23C18/20 , C23C18/16 , C23C18/18 , C23C18/38 , C23C18/32 , C23C18/30 , C23C18/00
CPC分类号： H05K3/184 , C23C18/00 , C23C18/1608 , C23C18/161 , C23C18/1817 , C23C18/1841 , C23C18/1844 , C23C18/1865 , C23C18/1889 , C23C18/1893 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , H05K2203/0565 , H05K2203/125
摘要： Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
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公开(公告)号：US09951433B2
公开(公告)日：2018-04-24
申请号：US15034424
申请日：2014-11-18
发明人： Yukiya Takeuchi , Junji Yoshikawa , Koji Kita
IPC分类号： C23C18/40 , C23C18/16 , C23C18/20 , C23C18/24 , C23C18/28 , C23C18/30 , C25D3/38 , C25D3/04 , C25D3/12 , C25D5/14 , C25D5/34 , C25D5/54 , C25D1/18
CPC分类号： C25D3/38 , C23C18/16 , C23C18/1653 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/40 , C25D3/04 , C25D3/12 , C25D5/14
摘要： An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.
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公开(公告)号：US09932676B2
公开(公告)日：2018-04-03
申请号：US15122548
申请日：2015-06-11
发明人： Masahiro Ito , Yuichi Adachi
CPC分类号： C23C18/18 , C23C18/1608 , C23C18/1612 , C23C18/1633 , C23C18/182 , C23C18/1841 , C23C18/1868 , C23C18/1889 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/42 , C23C18/44
摘要： The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.
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