公开(公告)号：US06707683B1

公开(公告)日：2004-03-16

申请号：US09917483

申请日：2001-07-27

Applicant: Eric S. Bravek ,  Randy S. Uehran

Inventor： Eric S. Bravek ,  Randy S. Uehran

IPC: H05K702

CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2203/1178

Abstract: A circuit board having improved soldering characteristics having raised structure consisting of spacer pads arranged to provide for vertical distancing of electrical or electronic components from the component side planar surface of the circuit board. Such spacing is complementary to top vented soldering stations where the spacing allows solder process gases to flow unimpeded from the soldering stations through the spacing to atmosphere.

Abstract translation: 具有改进的焊接特性的电路板具有升高的结构，该结构由间隔垫组成，间隔垫布置成提供从电路板的部件侧平面的电气或电子部件的垂直距离。 这种间距与顶部排放的焊接站是互补的，其中间隔允许焊接工艺气体通过与大气的间隔从焊接站不受阻碍地流动。

公开(公告)号：US20020140080A1

公开(公告)日：2002-10-03

申请号：US10147672

申请日：2002-05-15

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L023/495

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US06423906B2

公开(公告)日：2002-07-23

申请号：US09949558

申请日：2001-09-10

Applicant: Bily Wang

Inventor： Bily Wang

IPC: H01R1204

CPC classification number: H05K1/141 ,  H05K3/301 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10651 ,  H05K2201/10666 ,  H05K2201/10765

Abstract: Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.

Abstract translation: 通孔穿过表面安装封装的基板。 电子装置的引线插入到电镀通孔中。 电镀金属的底部被扩大为焊盘，以向主板提供可靠的焊接表面。 在加热时，引线被焊接到镀通孔的壁上。 或者，引线可以在插入电镀通孔之前折叠。

公开(公告)号：US06383603B1

公开(公告)日：2002-05-07

申请号：US09390637

申请日：1999-09-07

Applicant: Shinichi Nojioka

Inventor： Shinichi Nojioka

IPC: B32B310

CPC classification number: H05K3/3452 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10651 ,  Y10S428/901 ,  Y10T428/24281 ,  Y10T428/24802

Abstract: A printed wiring board with an increased strength of solder is provided by preventing solder bridge formation and increasing the amount of solder adherent thereto. A land (1) serving as a soldering foundation is formed in a star-shape, to minimize the proximal peripheral length (L2) between adjacent lands spaced distance (L1) apart, thus reducing the possibility of solder bridge formation. Since the star-shaped land (1) has a greater area than a rhombic land of identical size, the amount of solder adherent thereto is greater than that of the rhombic land, thus enabling to increase the strength of solder.

Abstract translation: 通过防止焊料桥形成和增加附着于其上的焊料的量，提供了具有增加的焊料强度的印刷线路板。 用作焊接基座的焊盘（1）形成为星形，以使彼此间隔开距离（L1）的相邻焊盘之间的近端周长（L2）最小化，从而减少形成焊料桥的可能性。 由于星形土地（1）的面积大于相同尺寸的菱形地面，所以与其相邻的焊料的附着量大于菱形，因此能够提高焊料的强度。

公开(公告)号：US20020005296A1

公开(公告)日：2002-01-17

申请号：US09949558

申请日：2001-09-10

Inventor： Bily Wang

IPC: H05K001/11

CPC classification number: H05K1/141 ,  H05K3/301 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10651 ,  H05K2201/10666 ,  H05K2201/10765

Abstract: Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.

公开(公告)号：US6144558A

公开(公告)日：2000-11-07

申请号：US901329

申请日：1997-07-28

Applicant: Naohiro Shiota ,  Rikuro Obara

Inventor： Naohiro Shiota ,  Rikuro Obara

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/305 ,  H05K3/321 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/10174 ,  H05K2201/10651 ,  H05K2203/1316 ,  H05K3/284 ,  H05K3/4691 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A present invention is to provide a thin parts installation structure and their manufacturing method. There is provided a circuit on a wiring substrate, an adhesive is painted to a selected part installation position on the wiring substrate, a conductive adhesive is painted in a position where the terminal area of electronic parts contact the wiring pattern circuits. The electronic part is put in the selected position of wiring the substrate such that the terminals of the electronic parts contact the conductive adhesive prior to curing the adhesives, and followed by both the non-conductive adhesive and conductive adhesive are stiffened.

Abstract translation: 本发明提供一种薄部件安装结构及其制造方法。 在布线基板上设置电路，在布线基板上的选定部件安装位置上涂布粘合剂，在电子部件的端子区域与布线图案电路接触的位置上涂布导电性粘合剂。 将电子部件置于选择位置，使基板的端子在固化粘合剂之前使电子部件的端子接触导电性粘合剂，然后使导电性粘合剂和导电性粘接剂两者均硬化。

公开(公告)号：US5848462A

公开(公告)日：1998-12-15

申请号：US655931

申请日：1996-05-31

Applicant: Naoki Sera ,  Hideki Mitsuoka ,  Yoshiro Sano ,  Tetsutaro Nasu

Inventor： Naoki Sera ,  Hideki Mitsuoka ,  Yoshiro Sano ,  Tetsutaro Nasu

IPC: H01H9/18 ,  H01H13/702 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/30 ,  H01H11/00

CPC classification number: H05K3/284 ,  H01H13/702 ,  H05K3/326 ,  H05K3/3421 ,  H01H2207/032 ,  H01H2219/04 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2203/1311 ,  H05K3/281 ,  Y02P70/613 ,  Y10T29/49105 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: An insulating film 3 is provided with an opening 4 whose size is substantially equivalent to or slightly smaller than the outer configuration of electronic component 5. A conductive pattern 2 is formed on insulating substrate 1. After forcibly inserting the main body of electronic component 5 into said opening 4, terminals 6 are put between insulating film 3 and insulating substrate 1 and disposed in such a manner that terminals 6 are brought into contact with conductive pattern 2. Then, insulating film 3 is connected with insulating substrate 1 by fusing them in a region surrounding terminals 6, thereby firmly fixing terminals 6 of electronic component 5 on conductive pattern 2.

Abstract translation: 绝缘膜3设置有大小等于或略小于电子部件5的外部构造的开口4.导电图案2形成在绝缘基板1上。将电子部件5的主体强制插入 所述开口4，端子6放置在绝缘膜3和绝缘基板1之间，并且以使端子6与导电图案2接触的方式设置。然后，绝缘膜3通过将其熔合在绝缘基板1中而与绝缘基板1连接 区域周围端子6，从而将电子部件5的端子6牢固地固定在导电图案2上。

公开(公告)号：US5726862A

公开(公告)日：1998-03-10

申请号：US596530

申请日：1996-02-02

Applicant: Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

Inventor： Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

IPC: H01L33/62 ,  H05K3/30 ,  H05K7/02

CPC classification number: H01L33/62 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/168

Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Abstract translation: 引线元件（10）设置有第一和第二引线（14和16）。 引线形成有阻止偏差（26和28），其阻止引线超出止动偏差插入电路板（38）。 引线还可以设置有用于将部件保持在电路板上的保持偏差（34和36）。 此外，可以形成停止偏差以指示部件的极性，最后，可以将停止偏差设置有安装部分（50和52），使得引线部件可以表面安装在电路板（54）上 ）。

公开(公告)号：US5723823A

公开(公告)日：1998-03-03

申请号：US257402

申请日：1994-06-09

Applicant: James S. Bell

Inventor： James S. Bell

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/0292 ,  H05K1/114 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/0393 ,  H05K2201/09227 ,  H05K2201/09518 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10651 ,  H05K2203/0455 ,  Y10T29/49004 ,  Y10T29/49144 ,  Y10T29/49815

Abstract: A rework configuration is provided for disconnecting defective lithography-formed conductors and/or overlying electrical components from the printed circuit wiring netlist and connecting rework elements at the substituted sites. In particular, defective regions can be severed at spaced first and second target areas upon the upper surface of the PCB and one or more interconnect structures can be coupled therebetween. The interconnect structures allow re-routing of PCB conductors, allow connectivity between the upper and lower surfaces, allow connectivity to power and ground planes, and allow pull-up, pull-down and decoupling connectivity.

Abstract translation: 提供了返工配置，用于将有缺陷的光刻形成的导体和/或从印刷电路布线网表上覆盖电气部件和连接替代部位的返工元件。 特别地，可以在PCB的上表面上的间隔开的第一和第二目标区域处切断缺陷区域，并且可以在其间耦合一个或多个互连结构。 互连结构允许重新布线PCB导体，允许上表面和下表面之间的连接，允许连接电源和接地层，并允许上拉，下拉和去耦连接。

公开(公告)号：US5668702A

公开(公告)日：1997-09-16

申请号：US643377

申请日：1996-05-06

Applicant: Shary Nassimi

Inventor： Shary Nassimi

IPC: H01C1/02 ,  H01L23/04 ,  H05K3/34 ,  H05K7/00 ,  H01L23/053 ,  H01L23/055 ,  H05K7/02

CPC classification number: H01L23/041 ,  H01C1/02 ,  H05K3/341 ,  H05K3/3415 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613

Abstract: A combination axial and surface mounted cylindrically-shaped package containing at least one electronic component and being surface mountable to a printed circuit board with electrical lands by the use of conventional axial component through hole mounting machinery that includes a hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, at least one electronic component that is contained in the hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, a pair of electrically-conductive axial leads that are in electrical communication with the at least one electronic component, and at least one circumferentially-disposed, laterally-oriented, and electrically-conductive ring also in electrical communication with the at least one electronic component.

Abstract translation: 一种组合的轴向和表面安装的圆柱形包装，其包含至少一个电子部件，并且通过使用常规的轴向部件通孔安装机构可表面安装到具有电焊盘的印刷电路板，该机械包括中空的，电绝缘的，并且通常 圆形圆柱形壳体，至少一个电子部件，其容纳在中空的，电绝缘的和大致圆柱形的壳体中，一对导电轴向引线，其与至少一个 电子部件和至少一个周向布置的，横向定向的和导电的环，其还与所述至少一个电子部件电连通。